EPF10K250EGC599-2 vs EPF10K250EGC599-1 Comparison
Detailed side-by-side comparison of EPF10K250EGC599-2 by Intel and EPF10K250EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EGC599-2 | EPF10K250EGC599-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $195.00 | $162.00 |
| Family | FLEX 10KE | β |
| Logic Elements | 12,160 LEs | 40,960 |
| Typical Gates | 250,000 | β |
| Maximum User I/O Pins | 470 | β |
| Embedded Array Blocks (EABs) | 12 | β |
| Total RAM Bits | 24,576 bits | β |
| Number of PLLs | 4 | β |
| Speed Grade | -2 | β |
| Operating Temperature Grade | Commercial | β |
| Core Voltage | 5 V | β |
| Package | 599-BCPGA (CPGA-599 / HIPGA-599) | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) |
| Mounting Type | Through-Hole (Pin Grid Array) | Through-Hole (PGA) |
| Configuration Method | SRAM / EPROM | β |
| JTAG Support | IEEE 1149.1 Boundary Scan | β |
| RoHS Status | Unknown (legacy ceramic PGA) | unknown (ceramic HIPGA package historically non-RoHS) |
| Lifecycle Status | Not Recommended for New Designs (NRND) | β |
| Product Type | β | FPGA (Field-Programmable Gate Array) |
| Series | β | FLEX 10K |
| Equivalent Gates | β | 250,000 |
| Flip-Flops | β | 12,160 |
| User I/O Pins | β | 470 |
| Embedded Array Blocks (EAB) | β | 20 (2 Kbit each) |
| Pin Count | β | 599 |
| Operating Temperature | β | 0C to +70C (Commercial) |
| Configuration | β | SRAM (volatile), serial/parallel EPROM |
| Process Node | β | 0.42 Β΅m CMOS |
| I/O Standard Support | β | 5.0 V PCI, LVTTL, LVCMOS |
| Programming Interface | β | JTAG (IEEE 1149.1), passive serial |
| MSL Level | β | [DATA_NEEDED: moisture sensitivity level] |