EPF10K250EGC599-2 - FLEX 10KE FPGA, 250K Gates, 599-BCPGA | Intel
MPN: EPF10K250EGC599-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $195 | $195,000.00 |
EPF10K250EGC599-2 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacture to implement arbitrary digital logic. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) between simple CPLDs and modern high-end SoC FPGAs. The FLEX 10KE family uses a fine-grained architecture with built-in SRAM look-up tables and dedicated carry chains, placing it in the mid-1990s generation that pioneered embedded array blocks for on-chip memory.
Key features include 12,160 logic elements (LEs), approximately 250,000 typical gates, 12 embedded array blocks providing up to 24,576 RAM bits, 4 phase-locked loops (PLLs) for clock management, and multi-standard I/O support. The device operates from a 5V core supply and supports JTAG boundary-scan testing per IEEE 1149.1. The CPGA-599 ceramic package provides hermetic sealing for high-reliability applications.
The FLEX 10KE architecture uses a continuous SRAM-based configuration cell backed up by EPROM programming cells on each LE, enabling both in-system reprogrammability and one-time-programmable mode. Embedded array blocks implement RAM, ROM, or specialized logic functions, while the FastTrack interconnect provides predictable timing for high-speed designs. The 599-pin CPGA package supports 470 user I/O pins, which is substantial for a mid-1990s FPGA.
Typical applications include telecommunications switching infrastructure, industrial control systems, military and aerospace digital logic prototypes, high-reliability embedded computing, and legacy design replacements. The FLEX 10KE family was widely adopted in network processing equipment and DSP co-processing designs during its product life. The CPGA-599 ceramic package also makes it suitable for applications requiring hermetic sealing, such as downhole oil and gas instrumentation and military field equipment.
When designing with this part, verify that your synthesis tool still supports the FLEX 10KE family, since modern Intel Quartus has dropped legacy device support beyond Cyclone series. Engineers maintaining legacy designs should retain original MAX+PLUS II or Quartus II version 9.0 design databases for bitstream regeneration. Note that the EPF10K250E is a mature product approaching end-of-life - new designs should target Cyclone or MAX 10 series.
This page synthesizes distributor pricing, drop-in FLEX 10KE family alternatives, and practical design notes for legacy Intel FPGAs - information not consolidated in any single manufacturer datasheet.
Drop-in alternatives for EPF10K250EGC599-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K250EGC599-2 (same form factor and footprint) — differing in Mounting Type, Package, Logic Elements, RoHS Status, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K250EGC599-1
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EPF10K250EGC599-3
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EPF10K200EGC599-2
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EPF10K200EGC599-3
✅ Drop-In✓ In Stock
$39.2 / Unit
View Datasheet →EPF10K250EGC599-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements | 12,160 LEs |
| Typical Gates | 250,000 |
| Maximum User I/O Pins | 470 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 24,576 bits |
| Number of PLLs | 4 |
| Speed Grade | -2 |
| Operating Temperature Grade | Commercial |
| Core Voltage | 5 V |
| Package | 599-BCPGA (CPGA-599 / HIPGA-599) |
| Mounting Type | Through-Hole (Pin Grid Array) |
| Configuration Method | SRAM / EPROM |
| JTAG Support | IEEE 1149.1 Boundary Scan |
| RoHS Status | Unknown (legacy ceramic PGA) |
| Lifecycle Status | Not Recommended for New Designs (NRND) |
EPF10K250EGC599-2 599-bcpga (cpga-599 / hipga-599) Pin Configuration Guide
Pin configuration for EPF10K250EGC599-2 (599-bcpga (cpga-599 / hipga-599) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K250EGC599-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K250EGC599-2 is suitable for 6 applications: Telecommunications Switching Infrastructure, Industrial Control and Automation, Military and Aerospace Digital Systems, DSP Co-Processing and Hardware Acceleration, Legacy Design Maintenance and Bitstream Replacement, High-Reliability Downhole and Field Instrumentation.
Telecommunications Switching Infrastructure
The EPF10K250EGC599-2 was widely deployed in telecommunications switching equipment during the late 1990s and early 2000s, including ATM switches, SONET/SDH framers, and DSLAM line cards. The device's 250,000 typical gates, 12 embedded array blocks (EABs) for buffer memory, and 4 PLLs for clock domain management made it ideal for high-speed serial protocol processing. The 470 available user I/O pins accommodated multi-port PHY interfaces and TDM bus connections, while the 5V core voltage simplified power supply design in legacy telecom shelves. New designs targeting this application should evaluate modern Cyclone V SoC FPGAs, but the FLEX 10KE remains in service across installed telecom bases.
Recommended
Industrial Control and Automation
Industrial control systems including PLC backplanes, motor controllers, and SCADA remote terminal units (RTUs) leveraged the EPF10K250EGC599-2 for high-density glue logic, encoder interfacing, and custom protocol handling. The 599-pin ceramic PGA package provides mechanical robustness and resistance to vibration, while the commercial temperature grade suits factory-floor environments. Engineers used the EABs to implement encoder capture FIFOs and protocol state machines without external memory. The device's SRAM-based configuration enables field firmware updates via JTAG, simplifying maintenance across distributed industrial installations.
Recommended
Military and Aerospace Digital Systems
The EPF10K250EGC599-2 was used in military and aerospace applications where its hermetic ceramic CPGA-599 package provided required reliability for harsh environments. Programs deployed this FPGA in radar signal pre-processing, avionics bus interfaces (MIL-STD-1553, ARINC 429), and electronic warfare subsystems. The device's SRAM configuration backed by EPROM programming cells enabled both in-system reprogrammability for development and one-time-programmable mode for deployed hardware. Modern aerospace programs have transitioned to radiation-hardened FPGAs such as the Microsemi RTG4 or Xilinx Virtex-5QV, but legacy FLEX 10KE designs continue to fly on platforms with multi-decade support windows.
Recommended
DSP Co-Processing and Hardware Acceleration
The EPF10K250EGC599-2 served as a co-processor in DSP systems during the late 1990s, accelerating compute-intensive functions such as FFTs, convolutional encoding, and image filtering. Its 12,160 logic elements and dedicated multiplier chains (via EAB configurations) enabled parallel arithmetic pipelines that offloaded host DSPs. The 470 user I/O pins supported wide data buses and dual-port SRAM interfaces, while 4 PLLs managed multiple clock domains between the host DSP and accelerator. Modern alternatives include Cyclone V with hardened DSP blocks, but FLEX 10KE co-processors remain in legacy medical imaging and seismic processing equipment.
Recommended
Legacy Design Maintenance and Bitstream Replacement
Many OEMs maintain installed bases of products built around the EPF10K250EGC599-2 and require replacement parts for field repairs. With the device now NRND, distributors hold remaining inventory for sustaining engineering programs. The 599-pin ceramic PGA through-hole package is repair-friendly, allowing direct substitution on existing PCBs without redesign. Field service engineers must retain original MAX+PLUS II or Quartus II 9.0 design databases to regenerate configuration bitstreams if SRAM-based configuration memory has degraded. Order verification at intake is critical since FLEX 10KE parts from independent distributors may be refurbished or remarked.
Recommended
High-Reliability Downhole and Field Instrumentation
The ceramic CPGA-599 package of the EPF10K250EGC599-2 makes it suitable for high-reliability field instrumentation including downhole oil and gas tools, where hermetic sealing protects against pressure and corrosive fluids. The device's wide operating margin and proven long-term reliability have made it a preferred FPGA for tools that must operate for years without maintenance at extreme depths and temperatures approaching the upper commercial grade limit. Engineers pair the FPGA with high-temperature memory and analog front-ends to implement downhole telemetry, MWD (measurement while drilling) signal processing, and formation evaluation sensor interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K250EGC599-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K250EGC599-1 | EPF10K250EGC599-3 | EPF10K200EGC599-2 | EPF10K200EGC599-3 | EPF10K250EFI672-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | CPGA-599 | CPGA-599 (same) | CPGA-599 (same) | CPGA-599 (same) | CPGA-599 (same) | FBGA-672 (different) |
| Logic Elements | 12,160 LEs | 12,160 LEs | 12,160 LEs | 9,984 LEs (-18%) | 9,984 LEs (-18%) | 12,160 LEs |
| Typical Gates | 250,000 | 250,000 | 250,000 | 200,000 (-20%) | 200,000 (-20%) | 250,000 |
| Speed Grade | -2 | -1 (slower) | -3 (faster) | -2 (same) | -3 (faster) | -3 (faster) |
| Embedded Array Blocks | 12 | 12 | 12 | 10 (-17%) | 10 (-17%) | 12 |
| Total RAM Bits | 24,576 bits | 24,576 bits | 24,576 bits | 20,480 bits (-17%) | 20,480 bits (-17%) | 24,576 bits |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- True pin-compatible speed grade variant within same package (vs EPF10K250EGC599-1)
- Maximum density within FLEX 10KE family in CPGA-599 (vs EPF10K200EGC599-2)
- Ceramic PGA package provides hermetic sealing for harsh environments (vs EPF10K250EFI672-3)
Design Notes
The EPF10K250EGC599-2 is SRAM-based and loses its configuration on power-down. Designs must include a configuration memory device (EPC2 or compatible) on the board or accept configuration via JTAG at every power-up. Ensure the configuration controller's nSTATUS and CONF_DONE signals are properly monitored - a stuck-low CONF_DONE indicates configuration failure and the FPGA will not enter user mode.
The 599-pin CPGA package requires plated through-hole pads on the PCB with proper thermal relief for reliable soldering. Pin pitch is 2.54 mm (100 mil) standard PGA spacing - verify your PCB fabrication house supports the inner-row via-in-pad escape required for the center pins. Add 0.1uF decoupling capacitors on every VCCINT and VCCIO pin pair, plus bulk 47uF tantalum capacitors at the board power entry.
The 5V VCCIO option of the EPF10K250EGC599-2 simplifies interfacing to legacy TTL logic, but the device's 12 mA drive strength per I/O requires careful signal integrity analysis on high-speed nets. Use series termination resistors (33 ohm) on clocks and high-speed buses longer than 50 mm. The FastTrack interconnect introduces predictable routing delays that must be back-annotated into timing simulation for accurate setup/hold analysis.
Estimated: At 250,000 gates with 50% utilization clocked at 50 MHz, power dissipation is approximately 1.5-2.0 W. The CPGA-599 ceramic package provides theta_JA around 15 C/W with adequate airflow, resulting in 30-40 C junction temperature rise above ambient. For enclosed industrial enclosures without airflow, consider heatsink attachment to the package lid or derate clock frequency to maintain junction temperature below 100 C.
Compliance Information
Original FLEX 10KE family parts predate RoHS implementation. Compliance status must be verified at order time with the distributor. Not AEC-Q100 qualified (FPGA, not automotive-grade silicon).
