EPF10K30EFC256-1 vs EPF10K30EFC256-2N Comparison

Detailed side-by-side comparison of EPF10K30EFC256-1 by Intel and EPF10K30EFC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-1 EPF10K30EFC256-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $69.50 $48.57
Series FLEX 10KE FLEX 10KE
Family FLEX 10KE FLEX 10KE Embedded Programmable Logic Family
Logic Elements / Cells 1,728 β€”
Total RAM Bits 24,576 β€”
Typical Gates 30,000 30,000
Number of I/O 176 β€”
Number of Logic Gates 119,000 β€”
Voltage - Supply 2.375 V to 2.625 V β€”
Operating Temperature 0C to +70C (Commercial) 0 Β°C to +70 Β°C (Commercial)
Mounting Type Surface Mount Surface Mount
Package / Case 256-FBGA (17 x 17 mm, 1 mm pitch) β€”
Supplier Device Package 256-FBGA β€”
Speed Grade -1 -2N (mid-grade, 0.6 ns)
Process Technology 0.22 Β΅m CMOS SRAM 0.22 Β΅m CMOS, SRAM-based
RoHS Status Compliant (verify per lot) β€”
Logic Elements (LEs) β€” 1,728
Embedded RAM Bits β€” 24,576
Embedded Array Blocks (EABs) β€” 6
User I/Os β€” 246
Logic Cells β€” 1728
Propagation Delay β€” 0.6 ns (per digchip listing; internal frequency 80 MHz)
Number of Logic Elements β€” 24576
Supply Voltage β€” [DATA_NEEDED: core and I/O rail voltages]
Package β€” 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch
Configuration β€” Passive Serial / Active Serial / JTAG
Lead Free / RoHS β€” Non-RoHS (legacy, SnPb finish per FBGA-256 family)

Datasheets & Resources

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