EPF10K30EFC256-1 - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel
MPN: EPF10K30EFC256-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $82 | $8,200.00 |
| 500 | $75 | $37,500.00 |
| 1,000 | $69.5 | $69,500.00 |
EPF10K30EFC256-1 Overview
What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits after PCB fabrication. Within the broader semiconductor taxonomy, an FPGA sits above fixed-function ASICs and below microcontrollers in terms of design flexibility: FPGAs can be reconfigured indefinitely via SRAM configuration memory, while microcontrollers execute software instructions. The FLEX 10KE family specifically introduced embedded array blocks (EABs), bridging the gap between pure logic FPGAs and earlier CPLDs that lacked dedicated memory.
Key specifications include 24,576 logic cells (typical gate-equivalent), 1,728 flip-flops, embedded RAM organized in EABs, multi-volt I/O support, and JTAG-based in-system programmability via the ByteBlaster or BitBlaster configuration interface. The -1 speed grade provides a balance between cost and performance for general-purpose digital designs.
The device architecture combines four-input LUT-based logic elements (LEs) with EABs that provide up to 2 Kbits of true dual-port RAM each, ideal for FIFO buffers, register files, and small lookup tables. Each LE contains a four-input LUT, a programmable flip-flop, and dedicated carry and cascade chains for high-speed arithmetic and wide fan-in functions.
Typical applications include digital signal processing front-ends, telecommunications glue logic, industrial control interfaces, prototyping for ASIC designs, and legacy system maintenance where 5 V-tolerant multi-volt I/O is required. The 256-pin BGA package enables high I/O density on compact boards.
When designing with this part, designers must supply a stable 2.5 V core and configure the device through a serial or parallel PROM at every power-up because SRAM-based FPGAs are volatile. JTAG boundary-scan support simplifies board test, while in-system programmability allows field upgrades without component replacement.
This page synthesizes distributor stock data, drop-in alternatives, and practical design notes for engineers maintaining FLEX 10KE designs or sourcing legacy FPGAs through authorized distributors.
Drop-in alternatives for EPF10K30EFC256-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30EFC256-1 (same form factor and footprint) — differing in Speed Grade, Operating Temperature, Package, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EFC256-2
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →EPF10K30EFC256-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K30EFC256-1X
✅ Drop-In✓ In Stock
$95.6 / Unit
View Datasheet →EPF10K30EFC256-1DX
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K30EFC256-3
✅ Drop-In✓ In Stock
$24.6 / Unit
View Datasheet →EPF10K30EFC256-1 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Family | FLEX 10KE |
| Logic Elements / Cells | 1,728 |
| Total RAM Bits | 24,576 |
| Typical Gates | 30,000 |
| Number of I/O | 176 |
| Number of Logic Gates | 119,000 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Operating Temperature | 0C to +70C (Commercial) |
| Mounting Type | Surface Mount |
| Package / Case | 256-FBGA (17 x 17 mm, 1 mm pitch) |
| Supplier Device Package | 256-FBGA |
| Speed Grade | -1 |
| Process Technology | 0.22 µm CMOS SRAM |
| RoHS Status | Compliant (verify per lot) |
EPF10K30EFC256-1 256-fbga Pin Configuration Guide
Pin configuration for EPF10K30EFC256-1 (256-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K30EFC256-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K30EFC256-1 is suitable for 6 applications: Legacy Industrial Control Glue Logic, Telecommunications Backplane Glue Logic, ASIC Prototyping and HDL Verification, Digital Signal Processing Front-End, Test & Measurement Instrument Backbone, Aerospace & Defense Legacy Avionics.
Legacy Industrial Control Glue Logic
The EPF10K30EFC256-1 remains a preferred choice for maintaining legacy industrial control systems originally designed in the late 1990s and early 2000s. With 1,728 logic elements, 24,576 bits of embedded RAM in EABs, and 176 user I/O, it integrates encoder interfaces, stepper-motor pulse generators, and Modbus protocol bridges on a single chip. The 2.5 V core and multi-voltage I/O banks (3.3 V, 5 V-tolerant) allow direct connection to TTL-level sensors and 24 V opto-isolated inputs via external resistors. Designers can preserve existing Quartus II schematics and bitstreams, avoiding costly PLC retrofit programs. The 256-FBGA footprint is also pin-compatible with the higher-density EPF10K50EFC256-1, enabling an upgrade path if extra logic capacity is required.
Recommended
Telecommunications Backplane Glue Logic
In telecom backplanes, the EPF10K30EFC256-1 implements low-speed protocol bridging between E1/T1 framers, HDLC controllers, and TDM switches where ASIC NRE is not justified. Its 0.22 µm SRAM-based LUT architecture delivers deterministic timing for serial-to-parallel converters, while the embedded array blocks (EABs) provide dual-port FIFOs for elastic buffering between clock domains. The 176 user I/O support LVTTL, LVCMOS, and PCI signalling standards needed for backplane interfaces. JTAG boundary-scan (IEEE 1149.1) allows in-system programming through the backplane test access port, simplifying field upgrades. Operating at 2.5 V core with 3.3 V I/O, the part is well-suited to legacy -48 V telecom power architectures with standard DC-DC converter rails.
Recommended
ASIC Prototyping and HDL Verification
The EPF10K30EFC256-1 was widely adopted as an ASIC prototyping platform for VHDL and Verilog designs targeting 30K-gate ASICs. Its 1,728 logic elements and 24 Kbits of block RAM closely approximate mid-1990s gate-array utilization, allowing pre-silicon functional verification of CPU cores, DSP blocks, and bus bridges. Quartus II design flow supports incremental compile, SignalTap logic analyzer, and timing-accurate simulation. The 256-FBGA package exposes 176 I/O for break-out to legacy prototype boards. Engineering teams still maintaining long-lifecycle aerospace, medical, or defense programs can re-spin FPGA bitstreams in days rather than re-fabricating multi-million-dollar ASIC masks, preserving field-deployed hardware investments while migrating logic to newer non-volatile parts where mandated.
Recommended
Digital Signal Processing Front-End
For cost-sensitive digital signal processing front-ends such as software-defined radio (SDR) baseband pre-processing, ultrasound beam-formers, and vibration analysis front-ends, the EPF10K30EFC256-1 delivers sufficient throughput for FIR filters, FFT pre-processing, and digital down-conversion stages. The 4-input LUTs combined with EAB-based memory enable distributed-arithmetic FIR implementations that fit comfortably within 1,728 logic elements. Internal PLL blocks multiply an external reference clock for sample rates up to 100 MHz in commercial temperature grades. The 2.5 V core keeps dynamic power manageable in fan-less enclosures, while the 256-FBGA package supports dense PCB layouts where multi-channel ADC/DAC converters sit adjacent to the FPGA for short matched-length analog traces.
Recommended
Test & Measurement Instrument Backbone
Test and measurement instruments such as bench-top oscilloscopes, logic analyzers, and protocol testers often integrate the EPF10K30EFC256-1 as the central timing and routing controller. Its 176 I/O support direct connection to analog front-end multiplexers, ADC sample clocks, and front-panel LCD/keypad scan matrices. The EAB-based dual-port RAM stores trigger patterns and pre-trigger samples, while JTAG boundary-scan simplifies bed-of-nails manufacturing test. Operating from 2.5 V with selectable I/O standards, the part interfaces directly to 3.3 V ADCs and 5 V display drivers. Field-upgradable bitstreams allow end-users to add new measurement protocols without returning the instrument to the factory, extending product lifecycle and reducing warranty costs.
Recommended
Aerospace & Defense Legacy Avionics
Long-lifecycle aerospace and defense programs (aircraft, naval, ground vehicles) designed in the late 1990s still rely on FLEX 10KE family FPGAs including the EPF10K30EFC256-1 for mission-critical interfaces between legacy MIL-STD-1553 databuses, ARINC 429 channels, and discrete I/O. The SRAM-based configuration supports in-theatre firmware updates via JTAG, while the industrial-grade variant EPF10K30EFC256-1X (-40C to +85C) tolerates avionics bay thermal swings. The 256-FBGA footprint is qualified for high-vibration environments with proper under-fill. Maintaining these designs requires obsolete-part authorization and traceability; Rochester Electronics provides certified replacement stock with full documentation chain, satisfying FAA and DO-254 design assurance requirements where applicable.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30EFC256-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EFC256-2 | EPF10K30EFC256-1N | EPF10K30EFC256-1X | EPF10K30EFC256-1DX | EPF10K30EFC256-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (17x17 mm) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Speed Grade | -1 (standard) | -2 (faster) | -1N (lead-free) | -1X (industrial temp) | -1DX (dry-pack variant) | -3 (slower / lower cost) |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C | 0C to +70C | -40C to +85C (Industrial) | 0C to +70C | 0C to +70C |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| User I/O | 176 | 176 | 176 | 176 | 176 | 176 |
| Core Voltage | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V |
Key Differentiators
- Same silicon with faster speed grade (vs EPF10K30EFC256-2)
- Same silicon with industrial temperature range (vs EPF10K30EFC256-1X)
- Same silicon with lead-free RoHS finish (vs EPF10K30EFC256-1N)
Design Notes
The EPF10K30EFC256-1 requires a clean 2.5 V core supply decoupled with a 33 µF bulk capacitor plus 0.1 µF and 10 µF ceramic capacitors on each VCC pin. Use a separate low-dropout regulator (e.g., LT1587-2.5) for the core rail because switching noise from a buck converter will couple into the analog-sensitive EAB read/write paths and corrupt embedded RAM contents. Estimated: a fully utilized EPF10K30E design drawing 70% utilization at 50 MHz typically consumes 200–400 mA from the 2.5 V rail.
Route the 256-FBGA package with 1 mm ball pitch using microvia (0.1 mm) stack-ups or 4-mil via-in-pad technology; escape all 176 user I/O on the top layer before fanning into inner layers. Place one 0.1 µF capacitor per VCCIO/VCC pair immediately adjacent to the BGA balls and a 10 µF tantalum at each corner of the package. Provide a solid ground pour directly under the FBGA and stitch vias every 5 mm around the perimeter to control return currents for high-speed LVDS/PCI signals.
Because FLEX 10KE FPGAs are SRAM-based, the configuration bitstream is volatile and must be reloaded from a PROM (EPC2, EPC4, or EPC8) at every power-up. A missing or corrupted configuration PROM causes the device to remain in tri-state with all I/O floating—a common failure mode on legacy boards. Always include nINIT_CONF and nSTATUS pull-ups per Altera's configuration handbook, and verify CONF_DONE rises within 100 ms of nCONFIG. For prototypes, keep a ByteBlaster header populated for JTAG recovery.
Although the EPF10K30EFC256-1 typically dissipates less than 1 W in commercial-temperature designs, the 256-FBGA package has a theta-JA of approximately 18 C/W with adequate PCB copper. Forced airflow is rarely required below 70% utilization but is recommended when the design exceeds 100 MHz internal clocks or when the system is sealed in an IP65 enclosure. Check junction temperature with the Quartus II PowerPlay early in the design cycle to size heatsinks or thermal vias if needed.
Compliance Information
The base EPF10K30EFC256-1 uses lead-bearing BGA balls (non-RoHS); the -1N variant is the lead-free RoHS-compliant replacement. REACH compliance verified by Rochester Electronics documentation. AEC-Q100 not applicable—FLEX 10KE family predates automotive qualification programs.
