EPF10K30EFC256-1X vs EPF10K30EFC256-3 Comparison

Detailed side-by-side comparison of EPF10K30EFC256-1X by Intel and EPF10K30EFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-1X EPF10K30EFC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $95.60 $24.60
Family FLEX 10KE FLEX 10KE
Logic Elements 1728 β€”
Typical Gates 30,000 30,000
Logic Array Blocks (LABs) 216 216
Embedded Memory (EAB RAM) 24,576 bits (6 EABs of 4 Kbit each) β€”
User I/O 176 β€”
Maximum Internal Frequency 250 MHz β€”
Propagation Delay (tpd) 0.4 ns to 0.6 ns β€”
Process Technology 0.22 Β΅m CMOS 0.22 micrometer CMOS
Core Supply Voltage 2.5 V β€”
MultiVolt I/O Support 2.5 V / 3.3 V / 5 V β€”
Package 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) 256-ball FineLine BGA
Speed Grade -1X (fastest commercial) -3 (fastest)
Operating Temperature 0 Β°C to +70 Β°C (commercial) β€”
Configuration Method SRAM, JTAG (IEEE 1149.1) β€”
Phase-Locked Loops 4 β€”
Compliance RoHS (check distributor for specific lot), Pb-free option available β€”
Logic Elements / Cells β€” 1,728
Embedded RAM Bits β€” 24,576
User I/O Pins β€” 176
Maximum Operating Frequency β€” 200 MHz
Core Supply Voltage (VCCINT) β€” 2.5 V
I/O Supply Voltage (VCCIO) β€” 3.3 V (multi-voltage I/O standard support)
Mounting Type β€” Surface Mount (BGA)
Temperature Grade β€” Commercial
Configuration Interface β€” Serial (EPC8/EPC16) and JTAG (IEEE 1149.1)
RoHS Status β€” [DATA_NEEDED: RoHS status]

Datasheets & Resources

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