EPF10K30EFC256-2N vs EPF10K30EFC256-1 Comparison
Detailed side-by-side comparison of EPF10K30EFC256-2N by Intel and EPF10K30EFC256-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N ObsoleteSpecification Comparison
| Parameter | EPF10K30EFC256-2N | EPF10K30EFC256-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $48.57 | $69.50 |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX 10KE Embedded Programmable Logic Family | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements (LEs) | 1,728 | β |
| Embedded RAM Bits | 24,576 | β |
| Embedded Array Blocks (EABs) | 6 | β |
| User I/Os | 246 | β |
| Logic Cells | 1728 | β |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) | β |
| Number of Logic Elements | 24576 | β |
| Operating Temperature | 0 Β°C to +70 Β°C (Commercial) | 0C to +70C (Commercial) |
| Supply Voltage | [DATA_NEEDED: core and I/O rail voltages] | β |
| Process Technology | 0.22 Β΅m CMOS, SRAM-based | 0.22 Β΅m CMOS SRAM |
| Package | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch | β |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration | Passive Serial / Active Serial / JTAG | β |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) | β |
| Speed Grade | -2N (mid-grade, 0.6 ns) | -1 |
| Logic Elements / Cells | β | 1,728 |
| Total RAM Bits | β | 24,576 |
| Number of I/O | β | 176 |
| Number of Logic Gates | β | 119,000 |
| Voltage - Supply | β | 2.375 V to 2.625 V |
| Package / Case | β | 256-FBGA (17 x 17 mm, 1 mm pitch) |
| Supplier Device Package | β | 256-FBGA |
| RoHS Status | β | Compliant (verify per lot) |