EPF10K30EFC256-3 vs EPF10K30EFC256-1X Comparison

Detailed side-by-side comparison of EPF10K30EFC256-3 by Intel and EPF10K30EFC256-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-3 EPF10K30EFC256-1X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $24.60 $95.60
Family FLEX 10KE FLEX 10KE
Typical Gates 30,000 30,000
Logic Elements / Cells 1,728 β€”
Logic Array Blocks (LABs) 216 216
Embedded RAM Bits 24,576 β€”
User I/O Pins 176 β€”
Maximum Operating Frequency 200 MHz β€”
Process Technology 0.22 micrometer CMOS 0.22 Β΅m CMOS
Core Supply Voltage (VCCINT) 2.5 V β€”
I/O Supply Voltage (VCCIO) 3.3 V (multi-voltage I/O standard support) β€”
Package 256-ball FineLine BGA 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA)
Mounting Type Surface Mount (BGA) β€”
Speed Grade -3 (fastest) -1X (fastest commercial)
Temperature Grade Commercial β€”
Configuration Interface Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) β€”
RoHS Status [DATA_NEEDED: RoHS status] β€”
Logic Elements β€” 1728
Embedded Memory (EAB RAM) β€” 24,576 bits (6 EABs of 4 Kbit each)
User I/O β€” 176
Maximum Internal Frequency β€” 250 MHz
Propagation Delay (tpd) β€” 0.4 ns to 0.6 ns
Core Supply Voltage β€” 2.5 V
MultiVolt I/O Support β€” 2.5 V / 3.3 V / 5 V
Operating Temperature β€” 0 Β°C to +70 Β°C (commercial)
Configuration Method β€” SRAM, JTAG (IEEE 1149.1)
Phase-Locked Loops β€” 4
Compliance β€” RoHS (check distributor for specific lot), Pb-free option available

Datasheets & Resources

Browse All Products Create BOM Request Quote