EPF10K50VFC484-3N vs EPF10K130EFC484-3N Comparison

Detailed side-by-side comparison of EPF10K50VFC484-3N by Intel and EPF10K130EFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K50VFC484-3N EPF10K130EFC484-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $24.00 $109.25
Family FLEX-10K β€”
Logic Elements 2,880 β€”
Typical Gates 50,000 β€”
Total RAM Bits 40,960 65536
Embedded Array Blocks (EABs) 12 β€”
Logic Array Blocks (LABs) 10 β€”
Maximum User I/Os 291 β€”
Supply Voltage (VCCINT) 3.0 V to 3.6 V (3.3 V nominal) β€”
I/O Voltage Standards 5.0 V, 3.3 V, 2.5 V (MultiVolt) β€”
Internal Frequency 125 MHz β€”
Propagation Delay (per LE) 0.6 ns β€”
Process Technology 0.42 Β΅m CMOS, SRAM-based 0.22 Β΅m CMOS
Package 484-FBGA (23 x 23 mm, 1.27 mm pitch) β€”
Operating Temperature 0 Β°C to +70 Β°C (commercial) β€”
Configuration Modes Passive Serial, Passive Parallel (Sync/Async), Active Serial, JTAG β€”
JTAG Support IEEE 1149.1 Boundary Scan β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Mounting Type Surface Mount (BGA) Surface Mount
Series β€” FLEX-10KE
Number of Logic Elements / Cells β€” 6656
Typical Gate Count β€” 130000
Number of I/O β€” 369
Number of LABs/CLBs β€” 832
Number of Embedded Array Blocks (EABs) β€” 72
Speed Grade β€” -3 (faster timing bin)
Operating Temperature Grade β€” Commercial (0C to +70C)
Core Voltage β€” 2.5 V
Package Type β€” 484-BBGA (FineLine BGA)
Package Dimensions β€” 23 x 23 mm
Ball Pitch β€” 1.0 mm
Configuration Memory β€” SRAM-based (volatile, requires config device)
Configuration Interface β€” JTAG / PS / PPS / Altera serial

Datasheets & Resources

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