EPM2210F256C4N vs EPM2210F256A5NGA Comparison
Detailed side-by-side comparison of EPM2210F256C4N by Intel and EPM2210F256A5NGA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM2210F256C4N | EPM2210F256A5NGA |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $39.85 | $48.75 |
| Family | MAX II | MAX II |
| Device Type | CPLD | β |
| Logic Elements (LE) | 2210 | β |
| Macro Cells | 1700 | β |
| User Flash Memory | 204 Kbit | 8 Kbits (typical for MAX II family) |
| Maximum Internal Frequency | 247.5 MHz | β |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | β |
| Maximum User I/O Pins | 212 (varies with package) | β |
| Global Clock Networks | 4 | β |
| Process Technology | 0.18 Β΅m | β |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | β |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | β |
| Operating Temperature Range | 0 Β°C to +85 Β°C (Commercial) | 0C to +85C (NGA, commercial) |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (NGA) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | [DATA_NEEDED: rohs status from manufacturer] |
| Lead-Free | Yes | β |
| Logic Elements | β | 2210 |
| Macrocells | β | 1700 |
| Maximum Propagation Delay (tPD) | β | 7 ns (A5 speed grade) |
| User I/O Pins | β | 212 |
| Core Voltage | β | 1.8 V |
| Programmable Logic Blocks | β | 16 Logic Array Blocks |
| Configuration Method | β | On-chip Flash, in-system programmable via JTAG |
| I/O Standards | β | LVTTL, LVCMOS, PCI, LVDS (per bank) |
| Lead-Free / Halogen-Free | β | [DATA_NEEDED: lead-free / halogen-free status] |