EPM2210F256C4N - 2210 LE MAX II CPLD 256-FBGA | Intel / Altera
MPN: EPM2210F256C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $56.11 | $56.11 |
| 10 | $52.45 | $524.50 |
| 100 | $46.9 | $4,690.00 |
| 250 | $43.2 | $10,800.00 |
| 500 | $39.85 | $19,925.00 |
EPM2210F256C4N Overview
A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on programmable logic IC that combines multiple PAL/GAL-like macro-cell arrays with a global interconnect fabric. It belongs to the broader class of programmable logic devices (PLD), which also includes FPGAs; CPLDs are distinguished by deterministic timing, low static power, and flash-based configuration that eliminates external boot memory. Within the MAX II family, the EPM2210 is the highest-density member, positioning it between small glue-logic CPLDs and entry-level FPGAs.
Key features include four global clock networks with up to four clock pins, a JTAG-compliant IEEE Std. 1149.1 boundary-scan interface with in-system programmability (ISP), 8 Kbits of user flash memory, MultiVolt I/O for mixed-voltage interfacing, and on-chip support for 32-bit, 66-MHz PCI. The 256-ball FineLine BGA package is pin-compatible with EPM570F256 and EPM1270F256 devices, enabling vertical density migration without PCB rework.
The EPM2210F256C4N is widely used as a bus-bridging glue-logic replacement, an I/O expansion controller for microcontrollers, a power-up sequencer for multi-rail systems, and a low-density state-machine engine in industrial, consumer, and automotive subsystems. Designers favor the MAX II family for its instant-on non-volatile behavior, predictable timing, and Quartus Prime Lite design-flow support.
When integrating this part, ensure 1.2 V, 2.5 V, and 3.3 V supplies are decoupled with 0.1 µF and 10 µF capacitors placed within 100 mils of each ball. Maintain continuous reference planes beneath the BGA and follow Altera's JTAG chain guidelines for in-system programming. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical MAX II design notes not aggregated in any single manufacturer datasheet.
Drop-in alternatives for EPM2210F256C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM2210F256C4N (same form factor and footprint) — differing in Programming Interface, Process Technology, Operating Temperature, Package, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM2210F256C4
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View Datasheet →EPM2210F256C3N
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View Datasheet →EPM1270F256C5N
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View Datasheet →EPM1270F256C5
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View Datasheet →EPM2210F256A5NGA
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$48.75 / Unit
View Datasheet →EPM1270F256I5N
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View Datasheet →EPM2210F256C4N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD |
| Logic Elements (LE) | 2210 |
| Macro Cells | 1700 |
| User Flash Memory | 204 Kbit |
| Maximum Internal Frequency | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns |
| Maximum User I/O Pins | 212 (varies with package) |
| Global Clock Networks | 4 |
| Process Technology | 0.18 µm |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| Operating Temperature Range | 0 °C to +85 °C (Commercial) |
| Package | 256-ball FineLine BGA (FBGA) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EPM2210F256C4N 256-ball fineline bga (fbga) Pin Configuration Guide
Pin configuration for EPM2210F256C4N (256-ball fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM2210F256C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPM2210F256C4N is suitable for 7 applications: Microcontroller Bus Bridging & I/O Expansion, Power-Up/Down Sequencer for Multi-Rail Systems, Industrial Control & State-Machine Logic, PCI Bus Interface Glue Logic, Consumer Electronics Display Backlight & Timing Controller, Telecom Line-Card Interface & Protocol Conversion, Automotive Subsystem Glue Logic (Aftermarket).
Microcontroller Bus Bridging & I/O Expansion
The EPM2210F256C4N's 2,210 Logic Elements and 212 user I/Os make it an ideal bus-bridging and I/O-expansion companion for resource-constrained microcontrollers. With 7.0 ns tPD and 247.5 MHz internal frequency, it can translate between asynchronous bus domains (e.g., 8-bit MCU to 32-bit peripheral) without timing closure headaches. The 204 Kbit user flash stores calibration constants and serial numbers, while MultiVolt I/O (1.5/1.8/2.5/3.3 V) lets the CPLD directly interface legacy 5 V-tolerant and modern 1.8 V peripherals from a single device. Quartus Prime Lite's free-tier synthesis and instant-on non-volatile configuration remove boot-ROM overhead typical of FPGAs.
Recommended
Power-Up/Down Sequencer for Multi-Rail Systems
The EPM2210F256C4N's deterministic timing, four global clock networks, and 212 I/Os suit multi-rail power sequencing in servers, telecom, and FPGA co-processing boards. Each rail can be assigned a dedicated output pin driven by a finite state machine compiled in Quartus Prime; rails enable sequentially with microsecond precision. The CPLD's instant-on non-volatile configuration means sequencing starts within microseconds of 3.3 V rail assertion, eliminating MCU firmware-boot latency. 3.3 V LVCMOS outputs drive discrete MOSFETs directly, and the 0-85 °C commercial temperature grade covers most indoor equipment envelopes.
Recommended
Industrial Control & State-Machine Logic
Industrial controllers and motor-drive boards use the EPM2210F256C4N to host deterministic state machines for safety interlocks, encoder decoding, and PWM generation. Its 2,210 LEs encode complex Mealy/Moore machines in a single non-volatile device, removing the firmware-update burden of MCU-based equivalents. PCI-66 MHz compliance allows direct interfacing with industrial frame-grabbers and motion cards; JTAG ISP enables in-field firmware updates on installed equipment. The BGA package with thermal pad keeps junction temperature manageable in enclosed control cabinets.
Recommended
PCI Bus Interface Glue Logic
The EPM2210F256C4N's PCI-66 MHz compliance and 32-bit data path make it a textbook choice for legacy PCI add-in card glue logic. It can decode the upper address bits, generate chip-selects for companion memories, and arbitrate interrupts between the PCI bus and an onboard microcontroller. The MAX II's 4 global clocks accept 33 MHz or 66 MHz PCI clocks directly, and the device meets PCI's 7 ns setup/hold with comfortable margin. 212 user I/Os support multiple companion devices without external bus switches.
Recommended
Consumer Electronics Display Backlight & Timing Controller
TV backlight controllers, e-paper timing generators, and human-machine interface (HMI) panels leverage the EPM2210F256C4N for high-precision timing and channel-count expansion. The CPLD generates multi-phase PWM for LED strings, drives source/gate timing for small LCDs, and bridges I2C/SPI from a host MPU to parallel displays. Its instant-on feature eliminates the visible boot delay typical of MCU-driven panels, while 1.8 V LVCMOS I/O directly interfaces modern SoCs without level shifters.
Recommended
Telecom Line-Card Interface & Protocol Conversion
Telecom line cards use the EPM2210F256C4N to bridge legacy T1/E1 framers, HDLC controllers, and switching fabrics to modern Ethernet MACs. The 2,210 LE budget absorbs HDLC encoding, framing, and clock-domain crossing in a single device, while the 204 Kbit user flash stores line-card serial numbers and inventory data. Deterministic timing simplifies telecom-grade jitter budgets, and the 4 global clocks accommodate multiple TDM buses without external PLL parts.
Recommended
Automotive Subsystem Glue Logic (Aftermarket)
Although EPM2210F256C4N is commercial-grade (0-85 °C), it is widely used in non-safety automotive subsystems such as infotainment head-unit I/O expansion, HVAC control panels, and instrument-cluster timing where operating temperature remains within cabin range. The 256-ball FineLine BGA withstands high-vibration mounting when properly underfilled. For under-hood or safety-critical applications, designers should instead use the EPM2210F256A5NGA automotive grade variant from the same Intel MAX II family in the identical footprint.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210F256C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F256C4 | EPM2210F256C3N | EPM1270F256C5N | EPM1270F256C5 | EPM2210F256A5NGA | EPM1270F256I5N |
|---|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 2210 | 2210 | 2210 | 1270 | 1270 | 2210 | 1270 |
| Speed Grade / tPD | -4 / 7.0 ns | -4 / 7.0 ns | -3 / 5.5 ns | -5 / 8.5 ns | -5 / 8.5 ns | -5 / 8.5 ns | -5 / 8.5 ns |
| Operating Temperature | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | -40 to +125 °C (Automotive) | -40 to +100 °C (Industrial) |
| Lead-Free / RoHS | Yes / Yes | No / Non-compliant | Yes / Yes | Yes / Yes | No / Non-compliant | Yes / Yes | Yes / Yes |
| User Flash | 204 Kbit | 204 Kbit | 204 Kbit | 8 Kbit | 8 Kbit | 204 Kbit | 8 Kbit |
| PCI-66 MHz Support | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest density in MAX II family with 2,210 LEs and 212 user I/Os (vs EPM1270F256C5N)
- 204 Kbit user flash memory (vs 8 Kbit in EPM1270) (vs EPM1270F256C5N)
- Pin-compatible lead-free RoHS-compliant variant (-4 speed grade) (vs EPM2210F256C4)
Design Notes
The EPM2210F256C4N requires a 3.3 V core supply (3.0-3.6 V) plus optional 1.8 V and 2.5 V supplies if MultiVolt I/O banks are used. Place a 0.1 µF decoupling capacitor within 100 mils of every VCC and VCCIO ball, with a bulk 10-47 µF tantalum or ceramic on each supply rail. Power-up sequencing is not strictly required because MAX II devices have power-on-reset logic, but simultaneous ramp-up of all rails avoids transient I/O contention. Estimate worst-case core current at ~100 mA and I/O current up to ~20 mA per bank under 66 MHz PCI switching.
Estimated: at full I/O utilization (212 outputs at 33 MHz LVTTL) the device dissipates approximately 1.2 W. The 256-ball FineLine BGA exposes a thermal pad; solder it to a 0.5 oz copper pour with at least 16 thermal vias (0.3 mm drill, 0.6 mm pad) to keep junction temperature below 100 °C. In enclosed cabinets without airflow, derate I/O switching frequency by 25 % or specify the industrial-grade EPM2210F256I4N variant.
Use a 4-layer or 6-layer PCB stack-up with continuous ground and 3.3 V planes beneath the BGA. BGA breakout requires 0.5 mm pitch fan-out with micro-vias (8-mil laser vias on 1-2-3 stack-up is typical). Maintain 50 Ω controlled impedance on clock traces feeding global clock pins GCLK[3:0] (bank 1). Avoid routing signals across the BGA's thermal-pad region to prevent reference-plane discontinuity; route escape traces on the top layer only.
Do not confuse the C4N lead-free part number suffix with the C4 (non-lead-free) variant when ordering - they are functionally identical but only C4N is RoHS compliant. JTAG chain: the MAX II device must be the first device in the JTAG chain if it acts as the chain master, otherwise attach TCK/TMS pull-ups of 10 kΩ to VCCIO bank 1. Quartus Prime Lite supports the device without license; do not waste budget on paid Standard/Pro licenses unless you need the PCI megafunction or partial reconfiguration.
Place the JTAG header (10-pin or 6-pin Altera-legacy pinout) within 2 inches of the device to keep TCK/TMS traces short and avoid signal-integrity issues at 10-30 MHz TCK frequencies. Add 4.7 kΩ pull-ups on TMS and TDI, and a 1 kΩ pull-down on TCK if no programmer is attached during board bring-up. Series-terminate clock output traces with 33 Ω resistors when driving more than 2 inches of FR4 stripline.
Compliance Information
RoHS compliance and lead-free finish indicated by 'N' suffix per Intel/Altera MAX II datasheet. AEC-Q100 qualification available in EPM2210F256A5NGA automotive variant in same package. Halogen-free status not explicitly stated in available data; use 'unknown' per Data Authenticity Rules.
