EPM2210F256C4N vs EPM2210F256C3N Comparison
Detailed side-by-side comparison of EPM2210F256C4N by Intel and EPM2210F256C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM2210F256C4N | EPM2210F256C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $39.85 | $47.10 |
| Family | MAX II | β |
| Device Type | CPLD | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LE) | 2210 | β |
| Macro Cells | 1700 | β |
| User Flash Memory | 204 Kbit | 8 Kbits |
| Maximum Internal Frequency | 247.5 MHz | β |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | β |
| Maximum User I/O Pins | 212 (varies with package) | β |
| Global Clock Networks | 4 | β |
| Process Technology | 0.18 Β΅m | 0.18 um flash CMOS |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | β |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | β |
| Operating Temperature Range | 0 Β°C to +85 Β°C (Commercial) | β |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant (per DigiKey product page) |
| Lead-Free | Yes | β |
| Series | β | MAX II |
| Programmable Type | β | In System Programmable (JTAG, IEEE 1149.1) |
| Macrocells | β | 1700 |
| Logic Elements / Blocks | β | 2210 |
| Number of User I/Os | β | 204 |
| Maximum Propagation Delay (tPD) | β | 7 ns |
| Maximum Internal Frequency (fMAX) | β | 304 MHz |
| Internal Supply Voltage | β | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) |
| I/O Standard Support | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) |
| Configuration Memory | β | On-chip flash (non-volatile, instant-on) |
| Operating Junction Temperature | β | 0 C to 85 C (commercial, TJ suffix 'C') |
| MSL Level | β | 3 (per JEDEC J-STD-020, typical for FBGA) |