EPM570GF256C4 vs EPM570GF256C3 Comparison

Detailed side-by-side comparison of EPM570GF256C4 by Intel and EPM570GF256C3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570GF256C4 EPM570GF256C3
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $29.85 $10.40
Family MAX II MAX II
Logic Elements (LEs) 570 β€”
Macrocells 440 β€”
Maximum User I/Os 212 β€”
Pin-to-Pin Delay (tPD) 5.4 ns β€”
Supply Voltage VCCINT 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) 1.8 V (core, MultiVolt)
I/O Bank Voltage VCCIO 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Operating Temperature 0 Β°C to +85 Β°C (commercial) β€”
Package 256-ball FBGA (FineLine BGA) FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free
Ball Pitch 1.0 mm β€”
Mounting Type Surface Mount β€”
Process Technology 0.18 Β΅m CMOS, flash-based configuration 0.18 um 6-layer-metal flash
JTAG Support IEEE 1149.1 boundary-scan + ISP β€”
Configuration Memory Non-volatile flash (instant-on, no boot PROM) β€”
RoHS Status Lead-free, RoHS compliant Compliant (lead-free)
Device Model β€” EPM570
Logic Elements (LE) β€” 570
Equivalent Macrocells β€” 440
User I/Os (max, FBGA-256) β€” 212
User Flash Memory (UFM) β€” 8 Kbit
Propagation Delay tPD1 β€” 8.7 ns (C3 speed grade)
Internal Performance fMAX β€” 300 MHz
Operating Temperature (commercial) β€” -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C)
Programming Interface β€” JTAG (IEEE 1149.1) / ISP
MSL Level β€” 3 (per JEDEC J-STD-020, typical for FBGA)
Vertical Migration Within FBGA-256 β€” Supported across EPM570 / EPM1270 / EPM2210

Datasheets & Resources

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