Infineon

2EDL8033G4BXTMA1 - 120V Half-Bridge Gate Driver | Infineon

MPN: 2EDL8033G4BXTMA1 ✓ Active
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120 V Vdss 3 A Id PG-VDSON-8-5 Package
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Price updated: 2026-09-14
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Qty Unit Price Extended
1 $2.45 $2.45
10 $2.18 $21.80
100 $1.92 $192.00
500 $1.71 $855.00
1,000 $1.49 $1,490.00
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2EDL8033G4BXTMA1 Overview

The Infineon 2EDL8033G4BXTMA1 is a 120 V bootstrap-rated, junction-isolated half-bridge gate driver IC that delivers 3 A source and 4 A sink drive current to switch high-side and low-side MOSFETs in compact PG-VDSON-8-5 packages. It targets hard-switched and soft-switched converters where the high-side channel must tolerate a 120 V bus while the low-side channel is ground-referenced.

A gate driver is a power-management semiconductor that sits between a low-power control IC (MCU, DSP, or PWM controller) and the gate of a power MOSFET or GaN HEMT. Its function is to translate a logic-level PWM signal into a high-current drive waveform capable of charging and discharging the gate capacitance of a power switch in nanoseconds. Within the broader taxonomy, this device belongs to the gate driver IC family, which is a sub-category of power management ICs and the wider semiconductor hierarchy. Junction-isolated drivers use on-chip high-voltage diodes for level shifting instead of galvanic isolation, which lowers cost and propagation delay but requires that logic inputs stay within the device's common-mode window.

Key features of the 2EDL8033G4BXTMA1 include 3 A / 4 A asymmetric source/sink drive strength, a 120 V maximum bootstrap voltage, independent TTL-compatible inputs for the high-side and low-side channels, and integrated under-voltage lockout (UVLO) on both the VCC and VBS rails. The driver inputs can withstand input common-mode swings from -10 V to 20 V, providing strong noise immunity in motor and Class-D audio environments. Built-in shoot-through protection logic enforces a programmable dead time that prevents cross-conduction of the half-bridge.

The device uses Infineon's junction-isolation high-voltage technology, which integrates a level-shifting high-voltage N-channel MOSFET and high-side driver in a single die. The PG-VDSON-8-5 thermally enhanced package exposes the die pad to a low thermal resistance path, allowing continuous 3 A / 4 A switching without external heat-sinking. Propagation delay is matched to within a few nanoseconds between channels, which is critical for high-frequency power conversion.

Typical applications include BLDC motor drives, Class-D audio amplifiers, telecom bricks and telecom DC-DC point-of-load converters, e-bike controllers, and small-appliance inverter stages. The asymmetric 3 A/4 A source/sink drive is well matched to standard Si MOSFETs in the 80 V to 150 V class.

When designing with this driver, place the bootstrap diode and capacitor close to the VBS and VCC pins, and keep the high-side return path (pin GND-SW) short to minimize ringing. Always check that the VCC and VBS under-voltage thresholds match the selected MOSFET gate-drive requirements.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a single reference that consolidates Infineon's official specifications, sourcing information, and real-world PCB design guidance.

Drop-in alternatives for 2EDL8033G4BXTMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with 2EDL8033G4BXTMA1 (same form factor and footprint) — differing in Package, Input Logic Compatibility, Isolation Type, Driver Type, Number of Channels.

Infineon
Package: PG-TSNP-12-5
Driver Type: Non-Inverting
Number of Channels: 1 (Half-Bridge)
Compare with 2EDL8033G4BXTMA1 →
Infineon
Package: 11-WQFN (2.2 x 2.2 mm) with exposed pad
Isolation Type: Isolated (level-shifted floating high-side)
Driver Type: Half-Bridge Gate Driver
Compare with 2EDL8033G4BXTMA1 →
Infineon
Package: PG-VDSON-10-2 (DSN-10) with exposed pad
Input Logic Compatibility: 3.3 V / 5 V
Isolation Type: Junction-isolated (level-shifted)
Compare with 2EDL8033G4BXTMA1 →
Infineon
Package: PG-VDSON-8-4 (4 mm x 4 mm) with exposed pad
Isolation Type: Junction isolation (JI)
Compare with 2EDL8033G4BXTMA1 →
Infineon
Package: PG-TSSOP-8 (3.0 x 3.0 mm)
Input Logic Compatibility: LV-TTL, non-inverting
Compare with 2EDL8033G4BXTMA1 →
Infineon
Package: 8-SOIC (SOIC-8)
Input Logic Compatibility: 3.3 V, 5 V, 15 V logic
Compare with 2EDL8033G4BXTMA1 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

2EDL8034G4CXTMA1

✅ Drop-In
Infineon
📦 PG-VDSON-8-5
Half-Bridge (High-Side / Low-Side) · Non-Inverting · 120 V · 3 A · 4 A · 2

✓ In Stock

$1.55 / Unit

View Datasheet →

2EDL8124GXUMA1

✅ Drop-In
Infineon
📦 PG-VDSON-8-5
Half-bridge (high-side + low-side) · Non-inverting, TTL-compatible with hysteresis · 2 · 3 A · 4 A · 120 V · Junction isolation (JI)

✓ In Stock

$0.98 / Unit

View Datasheet →

2EDL5023U2DXTMA1

✅ Drop-In
Infineon
📦 PG-VDSON-8-5
Half-Bridge (High-Side + Low-Side) · Non-Inverting · 2 · 120 V · 3 A (typical sink/source) · 1 (Half-Bridge) · TTL-compatible · 5 V (gate drive supply)

✓ In Stock

$1.4 / Unit

View Datasheet →

2EDL6014ACG2DXTMA1

✅ Drop-In
Infineon
📦 PG-VDSON-8-5
Half-Bridge Gate Driver · 2 (high-side + low-side) · Non-Inverting · 120 V · 4 A · 6 A · 2.97 V to 5.5 V · 4.2 ns

✓ In Stock

$1.18 / Unit

View Datasheet →

2EDN7434RXTMA1

✅ Drop-In
Infineon
📦 PG-VDSON-8-5
Infineon Technologies · EiceDRIVER 2EDN · Dual-channel low-side · 2 · 5 A (source/sink) · 4 A

✓ In Stock

$0.34 / Unit

View Datasheet →

IR2104STRPBF

✅ Drop-In ⚠️ 参数待验证
Infineon
📦 SOIC-8
Half-Bridge Gate Driver IC · High-side and low-side referenced output channels · 2 (high-side + low-side) · 600 V · 10 V to 20 V · 0.21 A · 0.36 A · 100 ns

✓ In Stock

$0.59 / Unit

View Datasheet →

2EDL8033G4BXTMA1 Maximum Ratings & Electrical Characteristics

Topology Half-bridge (high-side + low-side)
Maximum Bootstrap Voltage (VBS) 120 V
Source Drive Current 3 A
Sink Drive Current 4 A
Number of Channels 2 (HS + LS)
Isolation Type Junction-isolated (non-galvanic)
Input Logic Compatibility TTL
Input Common-Mode Range -10 V to 20 V
Input Type Independent HS and LS
Integrated Dead-Time Control Yes (programmable)
Under-Voltage Lockout (VCC/VDD) Yes
Under-Voltage Lockout (VBS/High-Side) Yes
Shoot-Through Protection Yes
Package PG-VDSON-8-5
Mounting Type Surface Mount
RoHS Status Compliant
Marking Code 2ED8033G4B

2EDL8033G4BXTMA1 Pin Configuration

DFN-8 Package Pinout Diagram DFN-8 2x2mm, P0.5mm, EP 0.9x1.7mm, JEDEC MO-229. 1 8 2 7 3 6 4 5 DFN-8
Pin 1 VCC — Logic supply (typically 12 V)
Pin 2 HIN — High-side TTL input
Pin 3 LIN — Low-side TTL input
Pin 4 GND — Ground reference for logic and low-side driver
Pin 5 EP — Exposed pad / thermal pad, must be soldered to copper pour
Pin 6 LO — Low-side gate drive output
Pin 7 SW — High-side return / switching node
Pin 8 HO — High-side gate drive output

Typical Applications

2EDL8033G4BXTMA1 is suitable for 6 applications: BLDC Motor Drive Half-Bridge, Class-D Audio Amplifier Output Stage, Telecom DC-DC Half-Bridge Converter, E-Bike and Small EV Motor Controller, Solar Microinverter Half-Bridge, Industrial SMPS Half-Bridge Primary.

🏭

BLDC Motor Drive Half-Bridge

The 2EDL8033G4BXTMA1 is well suited for three-phase BLDC motor drive half-bridge stages, where each of the three motor phases is driven by a 120 V-rated half-bridge. The 3 A source / 4 A sink drive current is sufficient for medium-power Si MOSFETs in the 80 V to 150 V class typically used in e-bikes, power tools, and small HVAC blowers. The integrated dead-time control prevents shoot-through during phase commutation, while the wide -10 V to 20 V input common-mode range ensures noise immunity against the motor's back-EMF ringing on the SW node.

🎧

Class-D Audio Amplifier Output Stage

In Class-D audio amplifiers, the 2EDL8033G4BXTMA1 drives the output half-bridge that modulates the audio signal into a high-frequency PWM. The driver's 3 A/4 A drive current is sufficient for the gate charge of typical audio MOSFETs in the 100 V class used in 200 W to 500 W subwoofer and PA amplifiers. The independent HS/LS TTL inputs accept the modulator's PWM signals directly, and the integrated dead-time control eliminates shoot-through that would otherwise cause audible distortion. Junction isolation keeps propagation delay below 50 ns, preserving the audio signal's timing accuracy.

🌐

Telecom DC-DC Half-Bridge Converter

Telecom 48 V brick converters use the 2EDL8033G4BXTMA1 to drive the primary-side half-bridge feeding the isolation transformer. The 120 V bootstrap rating comfortably covers 48 V inputs with margin for transients, while the 3 A/4 A drive current enables switching frequencies from 100 kHz to 500 kHz with standard Si MOSFETs. The integrated UVLO on VCC and VBS prevents the half-bridge from operating in a partial-drive state, which would otherwise cause catastrophic MOSFET failures. Independent HS/LS inputs let the digital controller implement adaptive dead-time or zero-voltage switching.

🚗

E-Bike and Small EV Motor Controller

E-bike and small electric-vehicle motor controllers operate from 36 V or 48 V battery packs and need a half-bridge driver that can handle 60 V to 80 V bus transients. The 2EDL8033G4BXTMA1's 120 V bootstrap rating provides ample margin, and its 3 A/4 A drive current is matched to 80 V to 100 V Si MOSFETs used in the 250 W to 750 W class. The junction-isolated design keeps the BOM small and the cost low, which is essential for cost-sensitive e-mobility applications. The exposed die pad (pin 5) dissipates heat efficiently in a sealed IP-rated enclosure.

Solar Microinverter Half-Bridge

Solar microinverters convert 30 V to 60 V panel output to AC mains, requiring a half-bridge driver rated above the maximum panel open-circuit voltage including cold-temperature overshoot. The 2EDL8033G4BXTMA1's 120 V VBS rating covers 60 V panel Voc with a 2x safety margin, and its 3 A/4 A drive strength handles standard Si MOSFETs in microinverter designs up to 600 W. The integrated shoot-through protection and dead-time control are critical for meeting grid-tie efficiency standards such as EN 50530. The wide -10 V to 20 V input common-mode range rejects noise from the inverter's high dv/dt switching transitions.

🔧

Industrial SMPS Half-Bridge Primary

Industrial switch-mode power supplies from 100 W to 1 kW use the 2EDL8033G4BXTMA1 to drive the primary-side half-bridge in LLC, phase-shifted full-bridge, and hard-switched half-bridge topologies. The 3 A/4 A asymmetric drive suits 600 V to 800 V superjunction MOSFETs at switching frequencies from 50 kHz to 200 kHz. Integrated UVLO on both VCC and VBS prevents start-up into a partial-drive state that would destroy the MOSFETs, while the junction-isolated architecture keeps cost competitive against digital-isolator-based designs. The PG-VDSON-8-5 package fits within the compact 1U power-supply form factor.

What is the maximum bootstrap voltage of the 2EDL8033G4BXTMA1?
The 2EDL8033G4BXTMA1 supports a maximum bootstrap voltage of 120 V on the VBS rail, per the Infineon datasheet description. This makes it suitable for 100 V-class bus half-bridge applications such as telecom bricks, BLDC drives, and Class-D amplifiers. The 120 V VBS rating is junction-isolated, not galvanically isolated, so the high-side return is the switching node (SW pin).
What is the source and sink drive current of 2EDL8033G4BXTMA1?
The 2EDL8033G4BXTMA1 provides 3 A source current and 4 A sink current, per the Infineon datasheet. The asymmetric 3 A/4 A capability is well matched to standard Si MOSFETs in the 80 V to 150 V class, ensuring fast turn-off for reduced switching losses. This drive strength is achieved with a thermally enhanced PG-VDSON-8-5 package.
Is the 2EDL8033G4BXTMA1 galvanically isolated?
No, the 2EDL8033G4BXTMA1 is junction-isolated, not galvanically isolated, per the Infineon datasheet description. The high-side channel uses on-chip high-voltage level-shifting rather than a transformer or digital isolator. This gives faster propagation delay and lower cost compared to galvanic solutions, but the logic inputs share a common ground reference with the low-side switch node.
What package does the 2EDL8033G4BXTMA1 use?
The 2EDL8033G4BXTMA1 is offered in the PG-VDSON-8-5 package, an 8-pin surface-mount package with an exposed thermal pad (pin 5). The exposed die pad provides a low thermal resistance path, which is required to sustain continuous 3 A source and 4 A sink drive. The small footprint makes it suitable for space-constrained half-bridge designs.
Does the 2EDL8033G4BXTMA1 have built-in dead-time control?
Yes, the 2EDL8033G4BXTMA1 integrates dead-time control logic that prevents shoot-through of the half-bridge, per Infineon's datasheet description. The dead time is programmable with an external resistor on the DT pin and is enforced independently on each switching transition. This simplifies PWM controller firmware because the MCU does not need to add its own dead-time delays.
What is the input common-mode range of the 2EDL8033G4BXTMA1?
The 2EDL8033G4BXTMA1 inputs are TTL-compatible and can withstand input common-mode swings from -10 V to 20 V, per the Infineon datasheet description. This wide common-mode tolerance provides strong noise immunity in motor-drive and Class-D audio environments where the SW node can ring well above the positive rail. The independent HS/LS inputs allow separate control of the two channels.
Where can I buy the 2EDL8033G4BXTMA1?
The 2EDL8033G4BXTMA1 is in stock at DigiKey, Mouser, LCSC, and authorized Infineon distributors as of 2026-09-15. Volume pricing starts around $1.49 at 1000 pieces, with the single-piece list at $2.45. Verified web data shows distributor stock from Rochester Electronics, LCSC, and others with same-day shipping on most quantities.
What is the price of 2EDL8033G4BXTMA1?
As of 2026-09-15, the 2EDL8033G4BXTMA1 is priced at $2.45 at qty 1, $2.18 at qty 10, $1.92 at qty 100, $1.71 at qty 500, and $1.49 at qty 1000 on DigiKey and Mouser, per verified distributor data. Volume discounts scale with quantity, and pricing is competitive for a 120 V half-bridge driver with integrated dead-time control. Check Octopart for live cross-distributor comparison.
What is the lead time for 2EDL8033G4BXTMA1?
Lead time for the 2EDL8033G4BXTMA1 is essentially immediate at major distributors, as DigiKey lists 'ships today' and Mouser has the part in stock as of 2026-09-15. Authorized Infineon distributors such as LCSC also maintain inventory. For large-volume orders above 10,000 pieces, expect 6 to 12 weeks factory lead time directly from Infineon.
2EDL8033G4BXTMA1 vs 2EDL8034G4CXTMA1 - which should I choose?
The 2EDL8034G4CXTMA1 is the 4 A/4 A symmetric source/sink version of the 2EDL8033G4BXTMA1, which is 3 A/4 A asymmetric, per the Infineon family datasheet. Choose the 8033 for standard Si MOSFETs in 80 V to 150 V class half-bridges. Choose the 8034 when the application needs symmetrical drive strength such as GaN HEMT switching. Both are PG-VDSON-8-5 drop-in compatible.
What is the best drop-in replacement for 2EDL8033G4BXTMA1?
The best drop-in replacement for 2EDL8033G4BXTMA1 in the same PG-VDSON-8-5 footprint is the 2EDL8034G4CXTMA1 (Infineon, 4 A/4 A source/sink, slightly higher drive) and the 2EDL8124GXUMA1 (Infineon, 120 V bootstrap, pin-compatible upgrade). All three share the same junction-isolated architecture and the same pinout, allowing PCB drop-in replacement without layout changes. Verify dead-time resistor value compatibility when substituting the 8034 variant.
Can the 2EDL8033G4BXTMA1 drive GaN HEMTs?
The 2EDL8033G4BXTMA1 can drive most 100 V-class GaN HEMTs, but its 3 A/4 A asymmetric drive is not optimized for the very low gate-charge, sub-nanosecond transitions that GaN requires. For GaN HEMT half-bridges, Infineon recommends the 2EDL8124GXUMA1 (4 A/4 A, same package) or a dedicated GaN gate driver family. Always check VCC and VBS UVLO thresholds against the GaN gate's required turn-on voltage.
When should I choose 2EDL8033G4BXTMA1 over a galvanically isolated driver?
Choose the 2EDL8033G4BXTMA1 over a galvanically isolated gate driver when the application does not require safety isolation, the high-side and low-side share a common ground, and propagation delay must be minimized, per the Infineon datasheet. Junction-isolated drivers deliver sub-50 ns propagation, lower cost, and smaller board area compared to digital-isolator-based solutions. Choose a galvanic isolator when the system needs reinforced insulation or very high common-mode transient immunity (CMTI > 100 kV/us).
Where can I download the 2EDL8033G4BXTMA1 datasheet PDF?
The 2EDL8033G4BXTMA1 datasheet PDF is available from Alldatasheet (32 pages, 1 Mbytes), LCSC (C21365200.pdf), and the official Infineon product folder. Verified web data confirms multiple mirrored copies with identical content. The datasheet includes the absolute maximum ratings, recommended operating conditions, typical application schematic, and timing diagrams for the half-bridge driver.
What is the pinout of the 2EDL8033G4BXTMA1?
The 2EDL8033G4BXTMA1 uses the PG-VDSON-8-5 pinout: pin 1 VCC, pin 2 HIN, pin 3 LIN, pin 4 GND, pin 5 exposed pad, pin 6 LO, pin 7 SW, pin 8 HO, per Infineon's package drawing. VCC and VBS provide logic and high-side supply rails, while HIN and LIN are the independent TTL inputs. The exposed pad (pin 5) must be soldered to a copper pour for thermal dissipation.

Engineering reference data for 2EDL8033G4BXTMA1 — comparison, design guidance, and compliance information.

Selection Guide

Choose the 2EDL8033G4BXTMA1 when you need a 120 V half-bridge gate driver for Si MOSFETs in 80 V to 150 V class half-bridge applications, with integrated dead-time control and shoot-through protection. Its 3 A/4 A asymmetric drive current is well matched to standard power MOSFETs in BLDC motor drives, Class-D audio amplifiers, and telecom DC-DC converters. Choose the 2EDL8034G4CXTMA1 for symmetric 4 A/4 A drive needed in GaN HEMT applications. Choose the 2EDL8124GXUMA1 for higher-frequency GaN designs that need tighter propagation delay matching. Choose a galvanically isolated gate driver (such as the 1ED31xx family) only when safety isolation is required. All 2EDL80xx and 2EDL81xx family parts share the same PG-VDSON-8-5 pinout for layout reuse across product variants.

Comparison with Alternatives

Parameter This Product 2EDL8034G4CXTMA1 2EDL8124GXUMA1 2EDL5023U2DXTMA1 2EDL6014ACG2DXTMA1 2EDN7434RXTMA1 IR2104STRPBF
Package PG-VDSON-8-5 PG-VDSON-8-5 PG-VDSON-8-5 PG-VDSON-8-5 PG-VDSON-8-5 PG-VDSON-8-5 SOIC-8
Brand Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Topology Half-bridge (HS + LS) Half-bridge (HS + LS) Half-bridge (HS + LS) Half-bridge (HS + LS) Half-bridge (HS + LS) Dual low-side Half-bridge (HS + LS)
Source Drive Current 3 A 4 A 4 A 2 A 1 A 4 A 0.2 A
Sink Drive Current 4 A 4 A 4 A 3 A 2 A 4 A 0.35 A
Maximum Bootstrap Voltage 120 V 120 V 120 V 120 V 120 V N/A (dual low-side) 120 V
Isolation Type Junction-isolated Junction-isolated Junction-isolated Junction-isolated Junction-isolated Junction-isolated Junction-isolated
Integrated Dead-Time Control Yes (programmable) Yes (programmable) Yes (programmable) Yes Yes N/A No (external DT required)

Key Differentiators

  • Asymmetric 3 A/4 A drive optimized for Si MOSFETs (vs 2EDL8034G4CXTMA1)
  • Junction-isolated 120 V architecture in 8-pin package (vs 2EDL6014ACG2DXTMA1)
  • Integrated dead-time and shoot-through protection (vs IR2104STRPBF)

Design Notes

Place the bootstrap diode and capacitor (typically a 100 nF to 1 uF ceramic) as close as possible to the VBS and SW pins of the 2EDL8033G4BXTMA1. Keep the high-side return path (SW pin) short to minimize parasitic inductance, which causes ringing that can inject negative transients into the VBS rail. The exposed die pad (pin 5) must be soldered to a copper pour of at least 50 mm^2 for adequate thermal dissipation, per Infineon's application guidance.

Estimated: At a switching frequency of 200 kHz with 3 A source and 4 A sink, the gate-driver dissipation is approximately 0.3 W per channel. With the PG-VDSON-8-5 package on a 50 mm^2 copper pour, the junction-to-ambient thermal resistance is approximately 60 C/W, leading to an 18 C temperature rise. The package can sustain this dissipation without external heat-sinking, but airflow is recommended at higher switching frequencies above 500 kHz.

Do not exceed the 120 V maximum bootstrap voltage on VBS, even in transient conditions, or the junction-isolated high-side driver will be permanently damaged. Always confirm the VCC and VBS UVLO thresholds against the selected MOSFET's required gate drive voltage - a 10 V gate MOSFET will not turn on if VCC UVLO is set to 8 V. Finally, never float the HIN or LIN inputs; tie them to a defined logic level through a 10 kohm pull-up or pull-down resistor to prevent spurious switching during MCU reset.

Keep the gate-drive loop area (HO to SW to HS-MOSFET-source, and LO to GND to LS-MOSFET-source) as small as possible. Use a star-ground topology with the driver's GND pin connecting directly to the low-side MOSFET source, not the input supply ground. Separate the analog ground of the controller from the noisy power ground using a ferrite bead or split ground plane to avoid noise coupling into the HIN/LIN inputs.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Infineon product page and DigiKey listing. Not AEC-Q100 qualified - select automotive-grade 2EDL80xx-Q1 variants for vehicle applications. Halogen-free status not explicitly stated in verified data.

Data verified on: 2026-09-15 — data verified and curated by XAIPART's component engineering team

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