Infineon

FF2000R17T2P8 - 1700V 2000A Half-Bridge IGBT Module | Infineon

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1700 V Vdss 2000 A Id [DATA_NEEDED: RthJC] Rds(on) XHP 2 (XHPTM2), Chassis Mount Package
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Price updated: 2026-08-29
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Drop-in alternatives for FF2000R17T2P8 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

FF1400R17T2P8

βœ… Drop-In
Infineon
πŸ“¦ XHP 2 (XHPTM2) Chassis Mount
Half-Bridge Β· 1700 V Β· 1400 A Β· 2800 A Β· TRENCHSTOP IGBT8 / Emitter Controlled 8 (EC8) diode Β· AG-XHP2K17 (XHP 2) Β· 175 C Β· NTC thermistor

βœ“ In Stock

$870 / Unit

View Datasheet β†’

FF2000XTR17T4M1

⚑ Same Package
πŸ“¦ XHP 2 (XHPTM2) Chassis Mount
same 1700 V/2000 A XHP 2 platform but CoolSiC MOSFET technology instead of IGBT8 - gate drive redesign needed

πŸ“‹ Reference alternative (not in catalog)

FF2000UXTR33T2M1

⚑ Same Package
πŸ“¦ XHP 2 (XHPTM2) Chassis Mount
same XHP 2 platform family but 3300 V CoolSiC - higher voltage class, not a 1700 V replacement

πŸ“‹ Reference alternative (not in catalog)

ℹ️ 1 cross-package part(s) hidden β€” different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

FF2000R17T2P8 Maximum Ratings & Electrical Characteristics

Configuration Half-Bridge (2-in-1)
Collector-Emitter Voltage (VCES) 1700 V
Continuous Collector Current (DC) 2000 A
Technology TRENCHSTOP IGBT8 with emitter controlled 8 (EC8) diode
Package Family XHP 2 (XHPTM2), Chassis Mount
Temperature Sensor Integrated NTC
Power Density Feature Low-inductive multi-package housing
Mounting Type Chassis Mount (screw-down)
Ordering Variant FF2000R17T2P8BPSA1 (packed form listed at DigiKey/Mouser)

FF2000R17T2P8 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 Collector (DC+) β€” Positive DC-link / upper IGBT collector
Pin 2 AC (Phase output) β€” Half-bridge midpoint, upper emitter / lower collector
Pin 3 Collector (DC-) β€” Negative DC-link / lower IGBT collector
Pin 4 G1 (Gate, upper IGBT) β€” Gate of upper IGBT
Pin 5 E1 (Aux emitter, upper) β€” Auxiliary emitter for upper IGBT gate drive
Pin 6 G2 (Gate, lower IGBT) β€” Gate of lower IGBT
Pin 7 E2 (Aux emitter, lower) β€” Auxiliary emitter for lower IGBT gate drive
Pin 8 NTC 1 β€” NTC temperature sensor terminal 1
Pin 9 NTC 2 β€” NTC temperature sensor terminal 2

Safe Operating Area

DC Continuous Operation

Typical Applications

FF2000R17T2P8 is suitable for 6 applications: Wind Turbine Converters, Medium-Voltage and Large Industrial Motor Drives, Traction Power Conversion, High-Power Industrial Power Supplies, Solar Central Inverters, Test and High-Power Conversion Rigs.

⚑

Wind Turbine Converters

The FF2000R17T2P8 fits wind turbine full-power and doubly-fed converters where 1700 V DC links and multi-hundred-kilowatt ratings are standard. Its 2000 A continuous collector current and low-inductive XHP 2 housing keep turn-off overshoot controlled at high DC-bus voltages, while the soft-recovering EC8 diode limits reverse-recovery EMI in the grid-side inverter. The integrated NTC supports converter-level thermal derating. Place the module on a liquid-cooled or large-finned heatsink with the datasheet screw torque and TIM to hold junction temperature within limits at full converter load.

🏭

Medium-Voltage and Large Industrial Motor Drives

Large industrial drives benefit from the FF2000R17T2P8's low VCE(sat) TRENCHSTOP IGBT8 dies, which cut conduction losses at high output current, and the short-circuit robustness needed for drive fault conditions. In a three-phase inverter, three half-bridge modules form the output stage; the XHP 2 low stray inductance allows higher switching frequency with reduced snubber needs, improving waveform quality. Gate drivers with desaturation protection and the module NTC provide layered fault protection. Verify per-IGBT thermal resistance against drive load profiles for reliable continuous operation.

πŸš—

Traction Power Conversion

Rail traction inverters operating from 1500-1700 V DC links are a natural fit for this 1700 V, 2000 A module. The trench field-stop IGBT8 technology reduces total switching and conduction losses, directly improving traction system efficiency and cooling requirements, while the scalable XHP 2 platform lets OEMs reuse mechanical and driver designs across power variants. The EC8 diode's soft recovery keeps EMI within limits in the converter cabinet. Designers must validate vibration, thermal cycling, and railway qualification requirements with Infineon before design-in.

πŸ–₯️

High-Power Industrial Power Supplies

High-current rectifiers, DC fast-charger front ends, and electrolysis supplies use half-bridge stages where the FF2000R17T2P8's 2000 A rating minimizes device count and paralleling complexity. The XHP 2 package's low internal inductance supports hard-switched and resonant topologies with lower ringing, and the NTC simplifies thermal supervision in sealed cabinets. Because conduction losses dominate at high current, operate at reduced switching frequency and verify heatsink sizing from datasheet thermal resistance and measured loss data for the target load cycle.

πŸ’‘

Solar Central Inverters

Utility-scale solar central inverters built around 1500 V DC systems benefit from 1700 V IGBT margin. The FF2000R17T2P8's high current rating allows fewer parallel legs, reducing complexity and failure points, while IGBT8 low switching losses raise conversion efficiency at the inverter's mid-frequency PWM range. The EC8 diode handles the freewheeling currents of the grid-tied bridge with soft recovery. In deployment, NTC-based thermal monitoring plus properly torqued, flat heatsink mounting are essential for 25-year service life targets.

πŸ”§

Test and High-Power Conversion Rigs

Grid emulation, battery cyclers, and motor test benches use reconfigurable half-bridge stages where the FF2000R17T2P8 provides 1700 V / 2000 A headroom. The XHP 2 platform's clean switching behavior improves measurement fidelity in test systems, and the NTC enables closed-loop thermal protection during destructive or boundary testing. Because bench systems cycle loads rapidly, use conservative junction-temperature targets and verify the datasheet thermal impedance curves against the test duty cycle to avoid fatigue failures of the module stack.

What is the voltage and current rating of FF2000R17T2P8?
The FF2000R17T2P8 is rated 1700 V collector-emitter voltage and 2000 A continuous collector current in a half-bridge configuration. According to the Infineon final datasheet, it uses TRENCHSTOP IGBT8 dies with EC8 emitter-controlled diodes in the XHP 2 package with an integrated NTC sensor.
Where to download FF2000R17T2P8 datasheet PDF?
The official FF2000R17T2P8 final datasheet PDF is available on Infineon's website at infineon.com (document titled 'FF2000R17T2P8 XHPTM2 module Final datasheet'). It covers electrical characteristics, thermal data, XHP 2 mechanical drawings, and the NTC sensor table. Mouser also mirrors the datasheet for its FF2000R17T2P8BPSA1 listing.
What is the price of FF2000R17T2P8?
Pricing for the FF2000R17T2P8 was not published in the data verified as of 2026-08-29. This is a high-power chassis-mount XHP 2 module typically quoted project-by-project; check Mouser (lists FF2000R17T2P8BPSA1) or contact Infineon sales/distribution for volume pricing and lead time.
Is FF2000R17T2P8 in stock and where can I buy it online?
Availability differs by ordering code: the packed variant FF2000R17T2P8BPSA1 is listed at DigiKey and Mouser with inventory and same-day shipping options as of 2026-08-29. The base FF2000R17T2P8 is usually sourced through Infineon distribution. Always confirm live stock on the distributor page before ordering.
What is the difference between FF2000R17T2P8 and FF1400R17T2P8?
Both are 1700 V XHP 2 half-bridge modules using the IGBT8/EC8 chipset, but the FF2000R17T2P8 is rated 2000 A while the FF1400R17T2P8 is rated 1400 A. They share the same package platform and pinout concept, so the 1400 A part can suit lower-current designs on the same mechanical platform with lower conduction losses headroom.
What is the best drop-in replacement for FF2000R17T2P8?
Within Infineon's portfolio there is no second-source die-level drop-in other than platform variants: FF1400R17T2P8 (1400 A, same XHP 2 package) is the closest same-family alternative, and FF2000XTR17T4M1 (2000 A, 1700 V XHP 2 with CoolSiC MOSFET technology) is electrically stronger but a technology change. Cross-brand pin-compatible equivalents in XHP 2 do not exist; verify mechanical and thermal fit before substitution.
Is FF2000R17T2P8 suitable for wind turbine converters?
Yes. The 1700 V / 2000 A rating, low-inductive XHP 2 construction, soft-recovering EC8 diodes, and integrated NTC make it well suited to wind turbine grid-side and machine-side converters. The low package inductance reduces turn-off overshoot on high DC-link voltages, and the NTC supports converter-level thermal protection schemes.
Can I use FF2000R17T2P8 in traction applications?
Yes, the module targets traction-class power conversion where 1700 V devices are standard. Its trench field-stop IGBT8 dies offer low VCE(sat) and robust short-circuit behavior, while the XHP 2 scalable platform supports high power density inverters. Confirm railway-specific qualification requirements separately with Infineon before design-in.
What gate driver should I use with FF2000R17T2P8?
The module requires an isolated gate driver delivering sufficient peak current for 2000 A-class IGBT8 dies, with adequate creepage/clearance for 1700 V isolation. Infineon gate-driver ICs with galvanic isolation (for example the EiceDRIVER family) are commonly paired; driver strength, Miller clamp, and desaturation/short-circuit protection are essential at this current level.
Does FF2000R17T2P8 include temperature monitoring?
Yes. According to the Infineon datasheet, the XHP 2 module integrates an NTC thermistor for junction-region temperature monitoring. The NTC output feeds the controller for over-temperature protection and derating. Its resistance-temperature table is given in the datasheet and should be linearized in firmware for accurate readings.
What are the key specifications of FF2000R17T2P8 engineers should know?
Key specs: 1700 V collector-emitter voltage, 2000 A DC collector current, half-bridge topology, TRENCHSTOP IGBT8 plus EC8 diode chipset, XHP 2 low-inductive chassis-mount package, and integrated NTC sensor. Source: Infineon FF2000R17T2P8 final datasheet and product page. These parameters position it for high-power industrial inverters and converters.
Is FF2000R17T2P8 the same as FF2000R17T2P8BPSA1?
They are the same silicon and package; BPSA1 is Infineon's packed/ordering-code suffix used for distribution channels. DigiKey and Mouser list FF2000R17T2P8BPSA1 as 'IGBT Module Trench Field Stop Half Bridge 1700 V 2000 A Chassis Mount'. Electrically the devices are identical; choose the suffix your purchasing channel stocks.
How should I manage thermal design for FF2000R17T2P8?
Size the heatsink using the per-IGBT junction-to-case thermal resistance from the datasheet and your estimated conduction plus switching losses at target frequency and current. At 2000 A-class currents, use a flat, high-quality mounting surface with the specified screw torque and thermal interface material, and monitor the NTC for derating.
Is FF2000R17T2P8 RoHS compliant?
RoHS status for FF2000R17T2P8 was not confirmed in the data verified as of 2026-08-29. Infineon power modules of current generation are typically RoHS-compliant, but verify the compliance certificate on the Infineon product page or via your distributor before shipping to regulated markets.

Engineering reference data for FF2000R17T2P8 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose FF2000R17T2P8 when you need maximum current density in a 1700 V half-bridge: its 2000 A rating and XHP 2 low-inductance package suit wind, solar central, traction, and large drive inverters where minimizing parallel devices matters. Choose FF1400R17T2P8 if your load current is below ~1400 A and you want lower device cost with the same mechanical platform - it is a direct package-compatible step-down. Choose FF2000XTR17T4M1 only if you can redesign the gate drive for SiC and need the lower switching losses of CoolSiC at higher switching frequencies. Trade-offs: IGBT8 gives simple, robust drive and short-circuit ruggedness; SiC gives efficiency at high frequency but different protection requirements. Cross-brand drop-ins do not exist for the XHP 2 package, so second sourcing must be planned at the platform level. Verify thermal resistance, isolation, and railway/automotive qualification needs directly with Infineon for your project.

Comparison with Alternatives

Parameter This Product FF1400R17T2P8 FF2000XTR17T4M1 FF2000UXTR33T2M1
Package XHP 2 (XHPTM2) chassis mount XHP 2 - same XHP 2 - same XHP 2 - same
Brand Infineon Infineon Infineon Infineon
Voltage Rating 1700 V 1700 V 1700 V 3300 V
Current Rating 2000 A 1400 A 2000 A [DATA_NEEDED]
Switch Technology TRENCHSTOP IGBT8 TRENCHSTOP IGBT8 CoolSiC MOSFET CoolSiC MOSFET
Freewheeling Diode Emitter controlled 8 (EC8) EC8 SiC body diode SiC body diode
Configuration Half-bridge Half-bridge [DATA_NEEDED] [DATA_NEEDED]
NTC Sensor Yes Yes Yes [DATA_NEEDED]
Lifecycle Status Active Active Active Active

Key Differentiators

  • Highest current in the 1700 V XHP 2 IGBT family (vs FF1400R17T2P8)
  • IGBT8 simplicity vs CoolSiC drive requirements (vs FF2000XTR17T4M1)
  • Proven silicon platform reuse (vs FF1400R17T2P8)

Design Notes

Gate drive is critical at 2000 A-class IGBT8 dies. Use an isolated driver with high peak current (several A), a Miller clamp to prevent parasitic turn-on, and desaturation-based short-circuit protection within the datasheet short-circuit withstand window. Split gate/emitter Kelvin connections (aux emitter pins) to keep driver loop inductance minimal, and use separate, isolated supplies per switch to satisfy the 1700 V isolation requirement between high-side and low-side drivers.

Size the heatsink from the per-IGBT RthJC in the Infineon datasheet plus your conduction and switching loss estimates at the actual switching frequency and load profile. Mount on a flat (typically <= 50 um flatness) surface with specified screw torque sequence and recommended thermal interface material. Use the integrated NTC for real-time derating: it measures near the IGBT junction region and should trigger alarm/shutdown thresholds in the controller firmware.

Minimize DC-link loop stray inductance between bus capacitors and module terminals to limit turn-off voltage overshoot within the 1700 V rating; XHP 2's low internal inductance means external loop inductance dominates. Laminated busbars and closely placed DC-link capacitors are recommended. Where overshoot margins are tight, consider snubbers or reduced gate resistance (trading switching loss) rather than exceeding VCES.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not present in verified web data as of 2026-08-29; obtain certificates from the Infineon product page or distributor.

Data verified on: 2026-08-29 β€” data verified and curated by XAIPART's component engineering team

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Infineon FF2000R17T2P8 FF2000R17T2P8BPSA1 FF1400R17T2P8 FF2000XTR17T4M1 IGBT module insulated gate bipolar transistor XHP 2 XHPTM2 package TRENCHSTOP IGBT8 emitter controlled 8 diode EC8 diode half-bridge topology NTC temperature sensor chassis mount module wind turbine converter traction inverter motor drive low-inductive power module gate driver
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