K9LUGY8J7D-BCK0 - Samsung V-NAND Flash Memory | Samsung
MPN: K9LUGY8J7D-BCK0 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for K9LUGY8J7D-BCK0 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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K9KUGY8J7C-BCK0
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.55 / Unit
View Datasheet →K9KUGY8J7C-CCK0
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K9JUGY8J5C-BCK0
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →K9JUGY8J5C-CCK0
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7.6 / Unit
View Datasheet →K9IUGY8J7B-BCK0
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K9IUGY8J7B-CCK0
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1 / Unit
View Datasheet →K9LUGY8J7D-BCK0 Maximum Ratings & Electrical Characteristics
| Manufacturer | Samsung Electronics |
| Product Type | 3D V-NAND Flash Memory |
| Memory Technology | V-NAND (3D NAND flash) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
K9LUGY8J7D-BCK0 [data_needed: package type and dimensions] Pin Configuration Guide
Complete pinout information for K9LUGY8J7D-BCK0 ([data_needed: package type and dimensions] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K9LUGY8J7D-BCK0.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K9LUGY8J7D-BCK0 is suitable for 6 applications: Solid-State Drives, Embedded eMMC / UFS Storage, Industrial Storage Modules, Set-Top Boxes and Smart TVs, Networking and Telecom Equipment, Automotive Infotainment and Telematics.
Solid-State Drives
Samsung V-NAND devices of the K9LUGY8J7D class are core storage media in client and consumer SSDs. The vertical 3D cell stacking delivers high bits per package, allowing SSD controllers to aggregate multiple dies on shared channels for parallelism. In this role the NAND connects to an SSD controller over toggle-mode/ONFI interfaces; the controller implements wear leveling, LDPC ECC, and garbage collection to manage TLC cell endurance characteristics. The design benefit is high capacity per BGA footprint with Samsung's mature V-NAND reliability record, while the trade-off is strict dependence on controller firmware quality for endurance and retention.
Recommended
Embedded eMMC / UFS Storage
Raw V-NAND of this family is packaged by Samsung into eMMC and UFS embedded storage modules used in smartphones, tablets, and IoT devices. The K9LUGY8J7D-class NAND provides the non-volatile layer behind the eMMC/UFS controller, which abstracts NAND management from the host. Benefits include proven V-NAND endurance, high sequential throughput over the UFS interface, and industrial temperature options. Designers of custom embedded boards who choose raw NAND instead of finished eMMC gain cost control but must implement full flash translation layers, bad-block management, and refresh algorithms in their host controller firmware.
Recommended
Industrial Storage Modules
Industrial PCs, data loggers, and factory automation systems use V-NAND like the K9LUGY8J7D-BCK0 in CFast, mSATA, and board-level storage modules. V-NAND's charge-trap cells tolerate program-disturb stress better than planar NAND, supporting the high write duty cycles of logging applications. Industrial builds benefit from fixed-BOM supply agreements on Samsung NAND and predictable endurance data for maintenance scheduling. The design consideration is that industrial controllers must implement power-fail protection circuits (bulk capacitors plus firmware checkpointing) because unexpected power loss during a program operation can corrupt the affected page.
Recommended
Set-Top Boxes and Smart TVs
Broadcast and streaming set-top boxes use K9LUGY8J7D-class V-NAND for firmware storage and DVR content buffering. The BGA NAND provides gigabit-class capacity in a compact footprint, and toggle-mode interfaces keep controller pin counts low. Low standby power of V-NAND suits always-on consumer electronics, and the TLC density point keeps bill-of-material cost competitive for high-volume CE manufacturing. Designers should verify the NAND's timing modes against the SoC's NAND controller, as many CE SoCs support only a subset of toggle-mode speeds, requiring conservative timing configuration at boot.
Recommended
Networking and Telecom Equipment
Routers, switches, and 5G small-cell equipment store firmware, configuration, and log data on V-NAND devices of this class. The K9LUGY8J7D-BCK0's high density enables redundant firmware banks and extended log retention on a single package. Samsung V-NAND's stable read-disturb behavior suits equipment with 24/7 read-mostly duty cycles, and the BGA package withstands vibration better than card-based storage. Telecom designers typically pair the NAND with industrial-temperature controllers and must derate endurance estimates for continuous ambient temperatures above the consumer baseline specified in the Samsung datasheet.
Recommended
Automotive Infotainment and Telematics
Automotive head units, digital clusters, and telematics control units require multi-gigabyte non-volatile storage for navigation maps and media, using V-NAND like the K9LUGY8J7D-BCK0 within automotive-qualified eMMC/UFS or raw-NAND subsystems. V-NAND tolerance of wide temperature swings and high vibration environments makes it well matched to vehicle electronics, and its density supports OTA update partitioning with A/B fallback banks. Automotive designers must verify the specific ordering code's qualification level (AEC-Q100 grade or Samsung automotive qualification), since suffix variants differ, and should implement power-interruption-safe FTL firmware for cranking and load-dump scenarios.
Recommended
Recommended Products Summary
Engineering reference data for K9LUGY8J7D-BCK0 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K9KUGY8J7C-BCK0 | K9JUGY8J5C-BCK0 | K9IUGY8J7B-BCK0 |
|---|---|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Package | [DATA_NEEDED: package] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Density | [DATA_NEEDED: density] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Cell Type | [DATA_NEEDED: cell type] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Interface | [DATA_NEEDED: interface] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | [DATA_NEEDED: VCC] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Generation / Revision | D revision (newest in family) | C revision (prior) | C revision, J5 family | B revision, I generation |
| Price (qty 1) | [DATA_NEEDED: pricing] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Newest D-revision V-NAND process generation (vs K9KUGY8J7C-BCK0)
- Longer supply longevity than older generations (vs K9IUGY8J7B-BCK0)
- Higher capacity option within the same family (vs K9JUGY8J5C-BCK0)
Design Notes
Samsung V-NAND devices use separate VCC (core) and VCCQ (I/O) supply rails. Decouple each rail with low-ESR ceramic capacitors (typically 0.1uF per ball group plus bulk capacitance) placed as close to the BGA as possible. Verify power sequencing between VCC and VCCQ in the device datasheet before power-tree design; incorrect sequencing can stress I/O structures. Estimated rail currents depend on operating mode (read, program, erase) and should be taken from the official Samsung datasheet ICC tables, which were not available in the current verified data.
In toggle-mode/DDR operation, DQ, RE#, and WE# lines toggle at high rates. Length-match the DQ bus within the tolerance specified by Samsung's layout guide, maintain a continuous ground reference plane beneath the bus, and avoid routing data lines across plane splits. Add series termination resistors near the driver as recommended for the applicable speed grade. Simulation of the full channel (controller, PCB trace, NAND input) is recommended for first-pass success on new boards using this V-NAND generation.
The most frequent raw-NAND design errors are under-provisioned ECC (modern TLC V-NAND needs LDPC, not simple BCH), missing bad-block management in the flash translation layer, and ignoring power-fail integrity - a lost power event during program/erase can corrupt the operating page or block. Budget firmware effort accordingly, and reserve spare blocks for wear leveling. Also confirm the exact -BCK0 suffix meaning (speed grade/packing) from Samsung before ordering, since suffix variants are not interchangeable on the same PCB in all cases.
Compliance Information
No explicit compliance declarations for this exact ordering code were present in the retrieved web data. Samsung current-generation V-NAND is generally RoHS/lead-free compliant as standard; obtain the official declaration from Samsung Semiconductor product compliance documentation.