TDA3MV - ADAS Vision SoC | Texas Instruments | Low Power
MPN: TDA3MV β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $40.5 | $405.00 |
| 100 | $36 | $3,600.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29 | $29,000.00 |
Drop-in alternatives for TDA3MV β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
TDA3MVRBFABFRQ1
β Drop-Inπ Reference alternative (not in catalog)
TDA3LX
β Drop-Inπ Reference alternative (not in catalog)
TDA3XE
β Drop-Inπ Reference alternative (not in catalog)
TDA3MA
β Drop-Inπ Reference alternative (not in catalog)
TDA3MB
β Drop-Inπ Reference alternative (not in catalog)
TDA3MV Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-A15 + DSP + Vision Accelerator |
| Package | FCBGA 15mm (ABF substrate) |
| Silicon Revision | 2.0 |
| Operating Temperature Range | -40C to +125C |
| Supply Voltage (Core) | 0.9V to 1.1V (AVS) |
| I/O Buffer Voltage | 1.8V (VDDS18V) |
| DDR Interface | DDR3/DDR3L |
| Camera Interface | MIPI CSI-2 |
| Vision Acceleration | Embedded Vision Engine (EVE) |
| Security | Secure boot, hardware-enforced isolation |
| Power Management | Multiple power domains, AVS |
| Functional Safety | Supports ASIL-B |
| RoHS | Compliant |
| AEC-Q100 | Qualified (Q1 variant) |
| Mounting Type | Surface Mount |
TDA3MV Pin Configuration
| Pin A1 | VDD β Core supply voltage |
| Pin A2 | VSS β Ground |
| Pin B1 | VDDS18V β 1.8V I/O supply |
| Pin C1 | VDDA_ADC β ADC analog supply |
| Pin D1 | VDDA_CSI β CSI analog supply |
| Pin E1 | VDDA_DAC β DAC analog supply |
| Pin F1 | VDDA_DDR_DSP β DDR DSP analog supply |
| Pin G1 | VDDA_GMAC_CORE β GMAC core analog supply |
| Pin H1 | VDDA_OSC β Oscillator analog supply |
| Pin J1 | VDDA_PER β Peripheral analog supply |
| Pin K1 | VDDS_DDR1 β DDR1 supply |
| Pin L1 | VDDS_DDR2 β DDR2 supply |
| Pin M1 | VDDS_DDR3 β DDR3 supply |
| Pin N1 | VDD_DSPEVE β DSPEVE AVS supply |
| Pin P1 | VDDSHV1 β High-voltage I/O supply 1 |
| Pin R1 | VDDSHV2 β High-voltage I/O supply 2 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TDA3MV is suitable for 6 applications: Front Camera Systems, Driver Monitoring Systems, Surround View Systems, Sensor Fusion Units, Battery-Operated Surveillance Cameras, Automotive Vision Processing.
Front Camera Systems
The TDA3MV is ideal for front camera systems in ADAS, providing real-time processing for object detection, lane departure warning, and traffic sign recognition. Its low power consumption and vision acceleration enable continuous operation in thermally constrained environments. The SoC supports multiple camera inputs via MIPI CSI-2, ensuring high-bandwidth data capture. With secure boot and hardware isolation, it meets functional safety requirements for automotive applications.
Recommended
Driver Monitoring Systems
The TDA3MV excels in driver monitoring systems, using its vision accelerators to analyze driver behavior in real-time. Its low power profile is crucial for always-on operation, and the integrated DSP handles complex algorithms for eye tracking and drowsiness detection. The SoC's secure boot ensures data integrity, while its compact 15mm package fits space-constrained designs. This enables reliable, continuous monitoring without excessive thermal load.
Recommended
Surround View Systems
The TDA3MV supports surround view systems by processing multiple camera feeds simultaneously, providing a 360-degree view around the vehicle. Its vision acceleration hardware efficiently handles image stitching and object detection, while the low power consumption allows continuous operation. The SoC's multiple MIPI CSI-2 interfaces enable connection to four or more cameras, and its secure boot protects against tampering. This makes it ideal for parking assistance and collision avoidance.
Recommended
Sensor Fusion Units
The TDA3MV is well-suited for sensor fusion units that combine data from cameras, radar, and lidar. Its heterogeneous architecture with DSP and vision accelerators enables real-time fusion of diverse sensor inputs, while low power consumption is essential for continuous operation. The SoC supports multiple interfaces for sensor connectivity, and its secure boot ensures reliable operation. This enables advanced ADAS features like adaptive cruise control and automatic emergency braking.
Recommended
Battery-Operated Surveillance Cameras
The TDA3MV is an excellent choice for battery-operated surveillance cameras due to its low power consumption and vision acceleration. It can process video streams locally, reducing the need for constant wireless transmission, thus extending battery life. The SoC's compact package and wide temperature range make it suitable for outdoor use. Its secure boot protects against unauthorized access, ensuring data security in surveillance applications.
Recommended
Automotive Vision Processing
The TDA3MV is designed for automotive vision processing, handling tasks like lane keeping assist and traffic sign recognition. Its integrated vision accelerators offload compute-intensive algorithms, freeing the CPU for decision-making. The low power consumption is critical for reducing heat in the vehicle cabin, and the secure boot ensures functional safety. The SoC's 15mm package is compact, fitting into small ECU designs, and supports multiple camera inputs for comprehensive vision coverage.
Recommended
Recommended Products Summary
Engineering reference data for TDA3MV β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TDA3MVRBFABFRQ1 | TDA3LX | TDA3XE |
|---|---|---|---|---|
| Package | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Automotive Grade | No (standard) | Yes (AEC-Q100) | No | No |
| Vision Acceleration | Yes | Yes | Yes | Enhanced |
| Power Consumption | Low | Low | Medium | Medium |
| Silicon Revision | 2.0 | 2.0 | [DATA_NEEDED] | [DATA_NEEDED] |
| Security Features | Secure boot, hardware isolation | Secure boot, hardware isolation | Secure boot | Secure boot, hardware isolation |
| Price (1pc) | $45.00 | $[DATA_NEEDED] | $[DATA_NEEDED] | $[DATA_NEEDED] |
Key Differentiators
- Low power consumption for ADAS SoC (vs TDA3LX)
- Automotive-grade variant available (vs TDA3LX)
- Integrated vision acceleration (vs TDA3LX)
Design Notes
The TDA3MV requires multiple power rails with specific sequencing. Use a dedicated PMIC or discrete regulators to provide core, I/O, and analog supplies. Ensure proper decoupling with 100nF and 10uF capacitors close to each power pin. Follow TI's recommended power-up sequence to avoid latch-up or damage.
The TDA3MV's power dissipation depends on workload. For continuous operation, ensure adequate heat sinking or airflow. The 15mm FCBGA package has a thermal resistance that requires a thermal vias and copper pour on the PCB. Use TI's thermal design guidelines to keep junction temperature below 125C.
For high-speed interfaces like MIPI CSI-2 and DDR3, maintain controlled impedance and minimize trace lengths. Use ground planes and proper termination. Place the SoC close to memory and camera connectors to reduce signal integrity issues. Follow TI's layout recommendations in the datasheet.
Compliance Information
RoHS compliant per TI product page. AEC-Q100 qualified variant available as TDA3MVRBFABFRQ1.
