TPSM82866C - 6A Step-Down Power Module I2C | Texas Instruments
MPN: TPSM82866C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.95 | $3.95 |
| 10 | $3.55 | $35.50 |
| 100 | $3.1 | $310.00 |
| 500 | $2.75 | $1,375.00 |
| 1,000 | $2.4 | $2,400.00 |
Drop-in alternatives for TPSM82866C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TPSM82866A
✅ Drop-In✓ In Stock
$2.95 / Unit
View Datasheet →TPSM82866CB2PRCFR
✅ Drop-In📋 Reference alternative (not in catalog)
TPSM82866CA1PRCFR
✅ Drop-In📋 Reference alternative (not in catalog)
TPSM82864x
✅ Drop-In📋 Reference alternative (not in catalog)
TPSM82866C Maximum Ratings & Electrical Characteristics
| Topology | Synchronous step-down (buck) power module |
| Input Voltage Range | 2.4 V to 5.5 V |
| Output Current | 6 A |
| Output Voltage (B2 variant) | 0.4 V to 1.675 V |
| Output Voltage (A1 variant) | 0.2 V to 0.838 V |
| Integrated Inductor | 200 nH shielded inductor |
| Control Interface | I2C |
| Package | MagPack QFN (RCF), 2.3 mm x 3 mm |
| Power Density | Approx. 1 A per 1 mm2 |
| Number of Outputs | 1 |
| Isolation | Non-Isolated |
| Protection Features | Overcurrent protection, thermal shutdown, soft-start |
| Family Compatibility | Pin-to-pin and BOM-to-BOM compatible with TPSM82864x (4A) |
| Mounting Type | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| Switching Frequency | [DATA_NEEDED: switching frequency] |
| RoHS Status | Compliant |
TPSM82866C magpack qfn (rcf), 2.3 mm x 3 mm Pin Configuration Guide
Complete pinout information for TPSM82866C (magpack qfn (rcf), 2.3 mm x 3 mm package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for TPSM82866C.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TPSM82866C is suitable for 6 applications: FPGA / ASIC Core Power, Server and Datacenter PoL, Networking and Communication Equipment, Industrial Automation and PLC, Test and Measurement Instruments, Processor and DSP Embedded Systems.
FPGA / ASIC Core Power
The TPSM82866C fits FPGA and ASIC core rails because its 6A output, 2.4V-5.5V input, and I2C dynamic voltage scaling directly match the current and voltage-adjustment demands of modern programmable logic. Its 2.3mm x 3mm footprint permits placement directly adjacent to the load, minimizing parasitic impedance. Placed after a 5V intermediate rail with proper input capacitance, the I2C interface enablesVID-style voltage optimization to cut power consumption, while telemetry supports adaptive management of core voltage margins.
Recommended
Server and Datacenter PoL
In server and datacenter equipment, the TPSM82866C delivers point-of-load conversion for processor auxiliary rails, memory controllers, and ASIC assist rails. The module's I2C telemetry reports output voltage, current, and temperature to system health monitoring, supporting predictive maintenance. Its shielded integrated inductor reduces EMI in dense boards, and near-1A-per-1mm2 power density conserves board area, making it well suited for high-channel-count power systems where each rail must be monitored and efficiently regulated.
Recommended
Networking and Communication Equipment
The TPSM82866C suits switches, routers, and optical modules that need compact, low-noise PoL conversion from 3.3V or 5V backplanes. Its 200nH shielded inductor and MagPack shielding suppress radiated emissions, easing CISPR-class EMC compliance in dense RF-adjacent layouts. The 6A capacity covers SERDES, MAC, and PHY rails, while I2C-based dynamic voltage scaling allows the same PCB to serve multiple SKUs through firmware-configured output voltages rather than board respins.
Recommended
Industrial Automation and PLC
Industrial control systems benefit from the TPSM82866C's robust protection set, including overcurrent protection and thermal shutdown, which improve fault tolerance in electrically noisy factory environments. Converting 5V distributed power to 1-3.3V logic rails, the module's integrated magnetics simplify layout in vibration-prone equipment where discrete inductors add reliability risk. The I2C interface enables supervisory telemetry of rail health, while its small footprint fits dense I/O and drive-control boards with limited space.
Recommended
Test and Measurement Instruments
Bench instruments and modular measurement cards require clean, adjustable rails for analog front ends and DSPs. The TPSM82866C's I2C voltage programming allows runtime rail tuning during calibration routines, and its integrated shielded inductor limits switching noise near sensitive measurement paths. The compact 2.3mm x 3mm package fits tightly spaced plug-in card power trees, and pin-to-pin compatibility with 4A TPSM82864x parts lets instrument families scale rail current without changing the PCB footprint.
Recommended
Processor and DSP Embedded Systems
Embedded systems built around TI C2000 or Sitara processors use the TPSM82866C for core and DDR termination rails. Its 6A rating covers typical DSP core currents with margin, and soft-start plus power-good behavior integrate cleanly into sequenced power-up designs. The module's efficiency at light and full loads reduces thermal load inside sealed enclosures, while I2C telemetry lets host firmware verify rail health at boot, improving field reliability in always-on embedded deployments.
Recommended
Recommended Products Summary
Engineering reference data for TPSM82866C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TPSM82866A | TPSM82866CB2PRCFR | TPSM82864x | TPSM82816 | IRPS5401MTRPBF |
|---|---|---|---|---|---|---|
| Package | MagPack QFN (RCF) 2.3x3mm | MagPack QFN (RCF) - same footprint | MagPack QFN (RCF) - same | MagPack QFN (RCF) - same | MagPack (different footprint) | Infineon power module QFN (different) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Infineon |
| Output Current | 6 A | 6 A | 6 A | 4 A | 6 A | [DATA_NEEDED] |
| Input Voltage Range | 2.4 V to 5.5 V | 2.4 V to 5.5 V | 2.4 V to 5.5 V | 2.4 V to 5.5 V | [DATA_NEEDED: widest range in family] | [DATA_NEEDED] |
| I2C Interface | Yes | Yes | Yes | Yes | No | Digital interface (PMBus-type) |
| Integrated Inductor | 200 nH shielded | 200 nH shielded | 200 nH shielded | 200 nH shielded | Integrated | Integrated |
| Pin-to-Pin Compatibility | TPSM8286xx family | Yes | Yes | Yes (BOM-to-BOM) | No | No |
| Lifecycle Status | Active | Active | Active | Active | Active | [DATA_NEEDED] |
Key Differentiators
- I2C-configurable output voltage with telemetry (vs TPSM82816)
- True BOM-to-BOM current scalability (vs TPSM82864x)
- Industry-leading power density (vs IRPS5401MTRPBF)
Design Notes
Place input and output ceramic capacitors as close to the VIN and VOUT pins as possible. Use low-ESR ceramics (e.g., 22uF input, 47uF output per datasheet recommendation - verify exact values in tpsm82866c.pdf Table of External Components). A solid ground plane under the module minimizes loop area and radiated EMI; the integrated shielded 200nH inductor already reduces emissions, but via stitching along the module perimeter further contains high-frequency fields.
Configure the output voltage before power-up via the I2C interface or VSET resistors; changing VOUT during operation should follow the datasheet's dynamic voltage scaling limits to avoid exceeding downstream device ratings. Verify the I2C address strapping does not conflict with other PMBus/I2C devices on the bus, and respect bus rise-time limits when adding telemetry loads.
Do not exceed the 5.5V absolute maximum input, including transient overshoot from upstream supplies. Because the ordering code determines the VOUT range (A1: 0.2-0.838V, B2: 0.4-1.675V), confirm the correct suffix for your rail before purchase - a B2 part cannot reach sub-0.4V rails. Keep load transients within the module's bandwidth; add output bulk capacitance if fast load steps cause excessive droop.
The MagPack package achieves near-1A-per-1mm2 power density, so PCB copper area drives thermal performance. Provide at least 4-6 thermal vias under the module's thermal pad to internal ground planes. At 6A loads with moderate VIN-VOUT delta, junction temperature can rise significantly; verify TJ with the datasheet thermal calculator for your worst-case conditions.
Compliance Information
RoHS compliant per TI product page and DigiKey listings. Detailed REACH and halogen data available on TI.com quality pages.
