EP20K400CF672C8AA vs EP20K400CF672C8N Comparison

Detailed side-by-side comparison of EP20K400CF672C8AA by Intel and EP20K400CF672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP20K400CF672C8AA EP20K400CF672C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $145.00 $68.40
Family APEX 20K APEX 20KC
Number of Logic Elements/Cells 16640 β€”
Number of Logic Units (LEs) [DATA_NEEDED: number of LUs] β€”
Embedded System Blocks (ESBs) 212 β€”
On-chip RAM Bits [DATA_NEEDED: total embedded memory bits] β€”
Number of User I/O Pins 488 β€”
Package Type 672-ball Fine-Pitch BGA (FBGA) β€”
Number of Pins/Balls 672 β€”
Supply Voltage (Core) 2.5 V 1.8 V
I/O Standards Supported LVTTL, LVCMOS, PCI, SSTL, HSTL (multi-voltage I/O) β€”
Propagation Delay [DATA_NEEDED: typical propagation delay] 2.5 ns (C speed grade)
Operating Temperature 0 C to 85 C (Commercial) 0 Β°C to +85 Β°C (commercial)
Mounting Type Surface Mount Surface Mount (BGA)
Packaging Tray β€”
Moisture Sensitivity Level (MSL) 3 (168 Hours) β€”
Configuration Interface JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous β€”
RoHS Status [DATA_NEEDED: RoHS status] β€”
Device Logic Elements β€” 16,640 (Macros / Cells)
Maximum System Gates β€” 400,000
Maximum User I/O β€” 488
Embedded Memory β€” 212,992 bits
Package β€” 672-ball FineLine BGA (FC-FBGA672)
Package Body Size β€” 27 Γ— 27 mm
Ball Pitch β€” 1.0 mm
Logic Family β€” CMOS
Process Technology β€” 0.15 Β΅m all-layer copper CMOS
Maximum Internal Frequency β€” 301.21 MHz
Lead-Free / RoHS β€” Yes (N suffix)

Datasheets & Resources

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