EP20K400CF672C8AA - 400K APEX 20K FPGA, 488 I/O FBGA | Intel
MPN: EP20K400CF672C8AA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $145 | $145,000.00 |
EP20K400CF672C8AA Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device in the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA), composed of configurable logic blocks (LEs), programmable routing, dedicated hardware multipliers or memory blocks, and a periphery of general-purpose I/Os. The APEX 20K family pioneered MultiCore integration by combining look-up-table logic, embedded system blocks for memory, and a high-bandwidth interconnect on a single die, enabling system-on-a-programmable-chip (SOPC) integration.
Key features of the EP20K400CF672C8AA include 16640 logic elements, 212 embedded system blocks delivering up to approximately 212 Kbits of on-chip SRAM, 488 user I/O pins terminated to 672 BGA balls, and an industry-standard 2.5 V core with multi-voltage I/O support. The device supports in-system programmability via a 4-wire JTAG interface and can be configured from external serial or parallel PROM sources, simplifying board-level bring-up.
Architecturally, the APEX 20K uses a MultiCore fabric that fuses lookup-table (LUT)-based logic with embedded array blocks (EABs/ESBs), providing predictable performance with typical propagation delays in the low nanosecond range. This combination delivers DSP-friendly throughput and block-RAM density that was advanced for its generation and remains useful for legacy system retrofits.
Typical applications include telecommunications line cards and baseband processing, industrial machine-vision and motor control, networking switches and protocol bridging, and military/aerospace signal processing. The high I/O count also makes it suitable for legacy ASIC prototyping and design verification platforms. When integrating this FPGA, plan JTAG chain access, decoupling, and a configuration PROM footprint, and validate thermal headroom using the FBGA junction-to-ambient resistance for your board stack-up.
Drop-in alternatives for EP20K400CF672C8AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CF672C8AA (same form factor and footprint) — differing in Operating Temperature, Process Technology, Package, Speed Grade, Propagation Delay.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400CF672C8
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K400CF672C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K400CF672C7N
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$160 / Unit
View Datasheet →EP20K400CF672C7GA
✅ Drop-In✓ In Stock
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View Datasheet →EP20K400CF672C7ES
✅ Drop-In✓ In Stock
$152 / Unit
View Datasheet →EP20K400CF672-8
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K400CF672-7ES
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K400CF672-7
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K400CF672C8AA Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Number of Logic Elements/Cells | 16640 |
| Embedded System Blocks (ESBs) | 212 |
| Number of User I/O Pins | 488 |
| Package Type | 672-ball Fine-Pitch BGA (FBGA) |
| Number of Pins/Balls | 672 |
| Supply Voltage (Core) | 2.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, HSTL (multi-voltage I/O) |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous |
EP20K400CF672C8AA 672-ball fine-pitch bga (fbga) Pin Configuration Guide
Pin configuration for EP20K400CF672C8AA (672-ball fine-pitch bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400CF672C8AA.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400CF672C8AA is suitable for 7 applications: Telecommunications Line Cards, Industrial Motor Control and Automation, Networking Switch and Router Fabric, ASIC and SoC Prototyping, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Medical Imaging Data Acquisition.
Telecommunications Line Cards
The EP20K400CF672C8AA fits telecom line-card designs that need a high-density reprogrammable fabric for channel aggregation, TDM crossbar switching, and ATM/SONET framer glue logic. With 16640 logic elements and 212 embedded system blocks providing up to about 212 Kbits of on-chip RAM, designers can implement deep packet buffers, lookup tables, and protocol engines without external memory. The 488 user I/Os route 16- to 32-bit wide parallel buses plus dedicated serial links, while the 2.5 V core and multi-voltage I/O banks support LVTTL, LVCMOS, PCI and SSTL interfacing to legacy line-card ASICs. Legacy telco-grade equipment relies on this density; long-lifecycle service contracts keep these FPGAs in production boards for decades.
Recommended
Industrial Motor Control and Automation
The 488-I/O APEX 20K device is well matched to multi-axis motor control and PLC backplanes where parallel encoder feedback, PWM generation, and fieldbus bridging must coexist on a single reprogrammable fabric. The embedded system blocks deliver deterministic on-chip RAM for state machines and lookup tables needed for current-loop and velocity-loop compensation, while the 16640 logic elements absorb the encoder counters, PWM generators, and EtherCAT/Profibus glue logic. The commercial 0-85 C operating range and 672-ball FBGA's PCB-friendly footprint simplify integration into factory-floor controller cards. Proven industrial reliability and long-term stock at independent distributors make this part a realistic choice for retrofitting existing automation lines.
Recommended
Networking Switch and Router Fabric
Switching and routing platforms historically used the EP20K400CF672C8AA as a control-plane and packet-classification engine, where the 16640 logic elements implement multi-gigabit lookup engines and the embedded system blocks store MAC tables and route caches. The 488 user I/Os handle 32+ bit datapath buses plus SPI/I2C management interfaces, while the 672-ball FBGA provides the routing headroom required for controlled-impedance multi-layer PCBs. The 2.5 V core and tolerant multi-voltage I/O banks allow direct connection to PHY devices, TCAMs, and packet processors. This FPGA is the modern control-plane of legacy carrier-grade switches still operating in telecom central offices.
Recommended
ASIC and SoC Prototyping
ASIC and SoC prototype platforms use the EP20K400CF672C8AA to validate multi-million-gate designs before tape-out, taking advantage of its 16640 logic elements, 212 embedded system blocks for memory modeling, and 488 user I/Os that mimic real ASIC pad counts. Designers map RTL into the MultiCore LUT fabric to verify timing closure, bus protocols, and JTAG/1149.1 boundary-scan behavior on real silicon rather than in simulation. The 672-ball FBGA footprint also gives adequate BGA-routing practice for ASIC package bring-up. Although newer prototyping platforms use Cyclone V or Stratix, retrofits and university courses still rely on APEX 20K boards.
Recommended
Military and Aerospace Signal Processing
Defense and aerospace signal-processing subsystems historically integrate the EP20K400CF672C8AA for radar front-end preprocessing, secure communications baseband, and electronic-warfare channelization where reprogrammable logic is mission-critical. The 16640 logic elements and 212 ESBs deliver DSP-grade throughput for FFT pipelines and matched filters, while the 488 I/Os handle multi-channel ADC/DAC interfaces. The industrial/extended temperature variants in the family (suffix 'I') serve harsher environments. Long-term support contracts with independent distributors sustain legacy avionics and naval platforms where PCB redesign is not feasible.
Recommended
Test and Measurement Instrumentation
Automated test equipment and bench instruments use the EP20K400CF672C8AA as a flexible pattern generator, timing sequencer, and protocol analyzer because the 16640 logic elements and 212 ESBs can be reconfigured for different DUT interfaces per test plan. The 488 user I/Os provide ample parallel pin electronics and trigger channels, while the 672-ball FBGA allows dense board placement alongside high-speed ADCs and DACs. The 2.5 V core plus multi-voltage I/O banks simplify interfacing with TTL, CMOS, and differential signaling standards. Legacy ATE platforms continue to operate this device because test program porting is costly.
Recommended
Medical Imaging Data Acquisition
Medical imaging systems such as ultrasound front-ends, MRI receiver arrays, and CT data-acquisition boards historically leveraged the EP20K400CF672C8AA for channel multiplexing, beamforming pre-processing, and high-speed image-data buffering. The 212 embedded system blocks provide deterministic on-chip line buffers for image pipelines, while 488 user I/Os handle parallel LVDS data streams from analog front-ends. The 672-ball FBGA's thermal performance suits fan-cooled chassis, and the 2.5 V core simplifies integration with low-voltage ADC/DAC front-ends. Long certification cycles and regulatory approval of medical devices mean legacy FPGAs continue to ship for 15-20 year product lifetimes.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CF672C8AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CF672C8 | EP20K400CF672C7 | EP20K400CF672C7N | EP20K400CF672C7GA | EP20K400CF672C7ES |
|---|---|---|---|---|---|---|
| Package | 672-ball FBGA | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded System Blocks | 212 | 212 | 212 | 212 | 212 | 212 |
| Speed Grade | C8 | C8 | C7 | C7 | C7 | C7 |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest pin-count APEX 20K option (vs EP20K400CB652I8)
- Multiple commercial speed-grade drop-in options (vs EP20K400CF672C7)
- Long-term APEX 20K inventory availability via independent distributors (vs Generic counterfeit-sourced EP20K400CF672C8AA)
Design Notes
The APEX 20K family is obsolete; do not start new designs on the EP20K400CF672C8AA without securing multi-year inventory. Plan migration to a Cyclone IV/V or Stratix equivalent early in the product lifecycle, recompile RTL with Quartus II 13.0 or MAX+plus II as the last validated toolchain, and archive the project. Counterfeit risk is elevated - insist on factory-sealed trays and lot traceability documentation from independent distributors.
VCCINT must be tied to 2.5 V and VCCIO banks configured per I/O standard. Decoupling must follow the manufacturer reference design: place 0.1 uF and 0.01 uF ceramic capacitors within 5 mm of each power pin, plus bulk capacitors on the supply rails. The MultiCore fabric has high transient current demand during configuration and JTAG operations - budget 1 A of core supply headroom beyond quiescent draw to avoid brown-outs.
The 672-ball FBGA requires microvia or via-in-pad PCB technology with a 1.0 mm ball pitch - verify your fab house supports the BGA fanout before finalizing layout. Maintain solid ground and power planes directly under the BGA to provide a low-impedance return path for the 488 I/O signals, and route differential pairs (LVDS, SSTL) with matched length and 100 ohm differential impedance. Keep high-speed signals on internal layers adjacent to a continuous reference plane to control impedance and EMI.
Multi-voltage I/O banks (LVTTL, LVCMOS, PCI, SSTL, HSTL) require careful bank-VCCIO assignment before pinout assignment in Quartus II - mismatched VCCIO on a bank can damage I/O buffers. Use IBIS models from the APEX 20K datasheet for SI simulation of high-speed parallel buses; for SSTL and HSTL interfaces add series-termination resistors to control overshoot. Keep JTAG signals away from high-frequency clock nets and route TMS, TCK, TDI, TDO with a quiet ground reference.
Estimate: at maximum logic utilization (90%) and 2.5 V core, the EP20K400CF672C8AA dissipates approximately 1.5-2.5 W of power. The 672-ball FBGA's theta_JA on a 4-layer JEDEC test board is approximately 18-22 C/W with adequate thermal vias, giving junction temperature rise of 30-50 C above ambient. For fan-cooled chassis this is acceptable, but for sealed enclosures add a heatsink or thermal interface material and verify with a thermal probe during worst-case testing.
Compliance Information
The EP20K400CF672C8AA was originally released by Altera (later acquired by Intel) before RoHS/REACH were widely mandated; lead-free and RoHS status are not confirmed in the verified web data. The standard C8AA suffix may be lead-bearing; the EP20K400CF672C7N and C7GA suffixes include lead-free finish indicators. AEC-Q100 is not applicable to FPGAs of this generation.
