EP20K400CF672C8N - APEX 20KC FPGA, 400K Gates, 488 I/O | Intel
MPN: EP20K400CF672C8N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $87.5 | $875.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $72.1 | $36,050.00 |
| 1,000 | $68.4 | $68,400.00 |
EP20K400CF672C8N Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device (PLD) containing an array of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and digital semiconductors, and the APEX 20KC family pioneered MultiCore integration of LUT logic and embedded memory for system-on-a-programmable-chip (SOPC) designs, predating modern SoC FPGAs. The 'C' speed grade corresponds to a 2.5 ns propagation delay (per DigiChip specifications), and the '8' speed/power descriptor combined with the 'N' suffix indicates a commercial-temperature 0 °C to 85 °C device in lead-free packaging.
Key features include 16,640 logic elements organized as LUTs and EABs, 488 maximum user I/O, embedded system blocks for memory, MultiCore interconnect optimized for high-speed datapaths, and pin-compatibility with the APEX 20KE family. The FineLine BGA-672 package is a 27 × 27 mm body with 1.0 mm ball pitch, suitable for high-density surface-mount designs. The device is built with a low-power copper interconnect that yields 25–35% faster design performance than the preceding APEX 20KE generation.
Architecturally, the EP20K400C integrates four MegaLAB structures per device, each containing 24 Logic Array Blocks (LABs) of 10 Logic Elements (LEs) per LAB, alongside embedded memory blocks and a FastTrack2 interconnect that routes signals between MegaLABs. The embedded memory provides distributed RAM, ROM, and CAM functions, and the I/O structure supports LVTTL, LVCMOS, PCI, and other popular interface standards through the same package as other APEX 20K family members.
Typical applications include telecommunications infrastructure (line cards, custom protocol engines), high-speed image processing, custom DSP datapath acceleration, networking equipment, and legacy industrial-control logic consolidation. The APEX 20K series is widely used in pre-SoC-FPGA designs where separate DSPs and glue logic must be replaced by a single programmable device. Designers migrating legacy APEX 20K designs can also use this device as a drop-in pin-compatible upgrade for APEX 20KE designs in the same F672 package.
When designing with the EP20K400C, observe the I/O-bank supply grouping rules documented in the Altera APEX 20KC datasheet: each bank shares VCCIO, so multiple I/O standards require careful bank planning. Provide a minimum of four 0.1 µF decoupling capacitors around the package perimeter plus bulk capacitors on each VCC rail.
This page synthesizes distributor pricing, parametric drop-in alternatives from the same APEX 20K family, and practical design notes that are not collected in any single manufacturer document.
Drop-in alternatives for EP20K400CF672C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CF672C8N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Propagation Delay, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400CF672C8
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K400CF672C8ES
✅ Drop-In✓ In Stock
$158.4 / Unit
View Datasheet →EP20K400CF672C8AA
✅ Drop-In✓ In Stock
$145 / Unit
View Datasheet →EP20K400CF672C7N
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP20K400CF672-8
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K400EFC672-1XN
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K400CF672C8N Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Device Logic Elements | 16,640 (Macros / Cells) |
| Maximum System Gates | 400,000 |
| Maximum User I/O | 488 |
| Embedded Memory | 212,992 bits |
| Package | 672-ball FineLine BGA (FC-FBGA672) |
| Package Body Size | 27 × 27 mm |
| Ball Pitch | 1.0 mm |
| Supply Voltage (Core) | 1.8 V |
| Logic Family | CMOS |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Propagation Delay | 2.5 ns (C speed grade) |
| Maximum Internal Frequency | 301.21 MHz |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (N suffix) |
EP20K400CF672C8N 27 × 27 mm Pin Configuration Guide
Pin configuration for EP20K400CF672C8N (27 × 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400CF672C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400CF672C8N is suitable for 6 applications: Telecom Line-Card Interface Logic, Legacy Industrial Control Consolidation, High-Speed Custom DSP Datapath Acceleration, Networking Switch Glue Logic, Custom Imaging and Video Pipeline, Aerospace and Defense Avionics (Legacy).
Telecom Line-Card Interface Logic
The EP20K400CF672C8N's 16,640 logic elements and 488 user I/Os make it well-suited for telecom line cards that integrate custom framing, channelization, and protocol bridging logic. With 212,992 bits of embedded memory the device can buffer packet headers and time-slot data without external SRAM, simplifying PCB layout and BOM cost. The 1.8 V core keeps power dissipation manageable in densely packed shelf equipment. Designers typically instantiate UART, HDLC, and proprietary PHY glue around the APEX 20KC fabric using VHDL or Verilog synthesized in Quartus II.
Recommended
Legacy Industrial Control Consolidation
Industrial controllers built in the early 2000s often used several 74-series logic ICs plus a small MCU; the EP20K400CF672C8N can replace all of them in a single BGA, reducing board area and improving firmware upgradability. The 488 available I/Os are sufficient to absorb dozens of discretes, and the 27 × 27 mm BGA keeps the footprint smaller than the equivalent 74-series array. Designers should observe the I/O-bank grouping rules from the APEX 20KC datasheet to mix LVTTL and 3.3 V PCI-compatible signals on the same device.
Recommended
High-Speed Custom DSP Datapath Acceleration
The MultiCore architecture of the EP20K400CF672C8N interleaves LUT logic with embedded memory blocks, enabling parallel FIR filters, correlators, and FFT datapaths at hundreds of MHz. Combined with the 301 MHz internal frequency capability, the device can accelerate image-processing and baseband DSP functions that previously required a dedicated ASIC. The 2.5 ns propagation delay (C8 speed grade) supports pipelined designs at moderate clock rates. Existing Quartus II cores for FIR, FFT, and Viterbi decoding can be instantiated directly into the fabric.
Recommended
Networking Switch Glue Logic
Mid-generation Ethernet switches and routers used FPGAs to glue PHY transceivers to network processors, perform protocol bridging, and implement custom statistics counters. The EP20K400CF672C8N's 488 I/Os accommodate multiple GMII/RGMII PHY interfaces and the 212 Kbit embedded memory can store ACL and rate-limit tables. The 672-FBGA package provides sufficient pin density for these multi-PHY designs. Designers benefit from the APEX 20K family's pin-compatibility with APEX 20KE, allowing a single PCB layout to support both commercial and industrial temperature grades.
Recommended
Custom Imaging and Video Pipeline
Real-time image-processing pipelines for machine vision, surveillance, and broadcast equipment require parallel pixel-domain operations performed at video line rates. The EP20K400CF672C8N delivers the LUT density and on-chip memory to implement line buffers, color-space converters, and simple noise-reduction kernels without external SDRAM. The 488 I/Os allow direct connection to CMOS image sensors and LVDS display interfaces. Quartus II IP cores for I2C, I2S, and CMOS sensor interfacing are available for this device family.
Recommended
Aerospace and Defense Avionics (Legacy)
Many aerospace and defense platforms adopted the APEX 20K family in the early-to-mid 2000s for radar signal preprocessing, custom avionics bus interfaces, and stores-management systems. The EP20K400CF672C8N's commercial temperature grade (0 °C to +85 °C) and the APEX 20KE's industrial-grade sibling cover a wide range of platform environments. Designers should note that long-term availability is constrained, so new aerospace programs should evaluate Cyclone IV or Cyclone V with appropriate QML-V or military screening.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CF672C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CF672C8 | EP20K400CF672C8ES | EP20K400CF672C8AA | EP20K400CF672C7N | EP20K400CF672-8 | EP20K400EFC672-1XN |
|---|---|---|---|---|---|---|---|
| Package | 672-FBGA (F672), 27×27 mm, 1.0 mm pitch | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (Macros) | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Maximum System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Embedded Memory | 212,992 bits | 212,992 bits | 212,992 bits | 212,992 bits | 212,992 bits | 212,992 bits | 212,992 bits |
| Speed Grade | C8 (2.5 ns propagation delay) | C8 | C8 | C8 | C7 (slower) | Speed grade 8 | APEX 20KE -1 speed grade (slower than 20KC C8) |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KE |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (engineering sample) | 0 °C to +85 °C (extended screening) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (engineering sample) | Obsolete (extended screening) | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pin-compatible with entire APEX 20KC F672 family (vs EP20K400CF672C8 (without N suffix))
- 25–35% faster than APEX 20KE family (vs EP20K400EFC672-1XN (APEX 20KE))
- MultiCore architecture with 212 Kbit embedded memory (vs Cyclone series FPGAs)
Design Notes
Estimated: the EP20K400CF672C8N core draws approximately 200–400 mA at 1.8 V depending on toggle rate and logic utilization. Provide at least four 0.1 µF ceramic decoupling capacitors placed as close as possible to the package perimeter, plus 10 µF and 100 µF bulk capacitors on each VCC rail. The VCCIO pins for each I/O bank must each be decoupled separately because I/O bank supplies cannot be combined.
The 672-FBGA package uses a 27 × 27 mm body with 1.0 mm ball pitch. PCB design must use laser-drilled microvias (8 mil or smaller) and a 4-layer stack-up with continuous ground and power planes directly beneath the device. A solder-mask-defined or non-solder-mask-defined land pattern can be used, but pad diameter should follow Altera's APEX 20KC package specification to avoid bridging during reflow.
Group I/O signals by bank: each I/O bank shares a single VCCIO supply and a group of I/O standards. Mixing incompatible standards (for example, 3.3 V PCI and 2.5 V LVCMOS) within the same bank will damage the device. Refer to the APEX 20KC datasheet I/O-bank assignment table before finalizing pin assignments; many legacy designs require pinout adjustments to balance bank utilization.
Quartus II support for the APEX 20K family was discontinued after Quartus II 9.0; do not attempt to use Quartus Prime or newer versions because device libraries have been removed. Existing Quartus II 9.0 projects must be retained on legacy workstations. Also note that the 'N' suffix indicates lead-free / RoHS-compliant packaging, but many counterfeit parts lack proper RoHS materials - always source through authorized distributors to avoid reliability issues.
Compliance Information
The 'N' suffix indicates lead-free / RoHS-compliant packaging per the Altera APEX 20KC datasheet. AEC-Q100 is not applicable - this is a commercial-temperature FPGA; the AA suffix variant provides extended screening but is not AEC-Q100 qualified. Halogen-free status was not stated in the verified web data.
