EP20K600CF672-3X vs EP20K600CF672 Comparison
Detailed side-by-side comparison of EP20K600CF672-3X by Intel and EP20K600CF672 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP20K600CF672-3X - 600K Gate APEX 20KC FPGA, F672, -3X Speed | Intel / Altera
EP20K600CF672-3X ObsoleteIntel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Specification Comparison
| Parameter | EP20K600CF672-3X | EP20K600CF672 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | [DATA_NEEDED: lifecycle status] |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $98.00 | $0.00 |
| Series | APEX 20KC | β |
| Family | APEX 20K (MultiCore) | β |
| Typical Gates | 600,000 | β |
| Logic Elements | 24,480 | [DATA_NEEDED: logic element count] |
| Maximum System Gates | 1,537,000 | β |
| Embedded System Blocks (ESBs) | 312 | β |
| Maximum RAM Bits | 311,296 | β |
| Maximum User I/O Pins | 508 | β |
| PLLs | 4 | β |
| Package | 672-pin FineLine BGA (F672) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Speed Grade | -3X (fastest) | β |
| Operating Temperature | 0C to +85C (commercial) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Process Technology | 0.18 um CMOS, SRAM-based | 0.15 um all-layer copper-metal process for supplied family references |
| Configuration Method | SRAM, serial/parallel, EPC support | β |
| RoHS Status | [DATA_NEEDED: rohs status] | unknown |
| MSL Level | [DATA_NEEDED: MSL level] | β |
| Product Type | β | Field-Programmable Gate Array (FPGA) |
| Product Family | β | APEX-20KC |
| Manufacturer | β | Altera / Intel |
| User I/O Lines | β | 508 I/O |
| Propagation Delay | β | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | β | SPLD |
| Performance Claim | β | Up to 35% faster than APEX 20KE devices |
| Package Type | β | 672-ball BGA, FCBGA |
| Package Dimensions | β | 45 mm x 45 mm |
| Ball Pitch | β | 1.27 mm |
| Configuration Device Type | β | Enhanced Configuration (EPC) device |
| Core Voltage | β | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | β | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | β | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | β | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | β | unknown |
| AEC-Q100 Status | β | unknown |