EP2A40F33C-9 vs EP2A40F33I-7 Comparison

Detailed side-by-side comparison of EP2A40F33C-9 by Intel and EP2A40F33I-7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F33C-9 EP2A40F33I-7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $78.00 $119.00
Family APEX II β€”
Maximum System Gates 1,600,000 β€”
Embedded RAM 65 Kbytes (approximately 540 Kbits depending on configuration) β€”
Package 672-ball FineLine BGA (F33), 1.27 mm pitch β€”
Speed Grade -9 β€”
Operating Temperature 0C to +85C (commercial) β€”
Process Technology 0.15 micrometer CMOS Altera APEX II CMOS programmable logic
PLLs 4 β€”
LVDS Channels 16 high-speed LVDS channels β€”
Logic Elements [DATA_NEEDED: exact LE count] [DATA_NEEDED: logic element count]
Maximum User I/O [DATA_NEEDED: max user I/O count] β€”
Multi-Core Architecture MegaLAB structure with embedded memory and CAM β€”
Configuration Method JTAG, serial PROM, parallel flash JTAG / serial configuration flash
MSL Level 3 β€”
Peak Reflow Temperature 220 C 220 C (Pb-free profile)
RoHS Status [DATA_NEEDED: not stated in provided data] [DATA_NEEDED: RoHS compliance per PCN]
Core Voltage [DATA_NEEDED: nominal core voltage] β€”
Mounting Type Surface Mount (BGA) Surface Mount
Device Family β€” APEX II (EP2A)
Device Member β€” EP2A40 (high-density)
Package Type β€” Fine-pitch BGA (FBGA)
Package Pin/Ball Count β€” 33 balls
Pitch β€” [DATA_NEEDED: ball pitch]
Operating Temperature Grade β€” Industrial (-40 C to +85 C)
Moisture Sensitivity Level (MSL) β€” 3 (per JEDEC J-STD-020)
Floor Life at MSL3 β€” 168 hours (factory conditions < 30 C / 60% RH)
Design Tool β€” Altera Quartus
Lead-Free Reflow Compatible β€” Yes (peak 220 C)
Voltage Supply β€” [DATA_NEEDED: VCCINT / VCCIO]

Datasheets & Resources

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