EP2A40F33C-9 - APEX II 40K FPGA, F33 FBGA-672 | Intel / Altera
MPN: EP2A40F33C-9 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128 | $1,280.00 |
| 100 | $108 | $10,800.00 |
| 500 | $92 | $46,000.00 |
| 1,000 | $78 | $78,000.00 |
EP2A40F33C-9 Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks, all of which can be reconfigured by the designer after manufacturing. FPGAs sit at the boundary between general-purpose processors and ASICs: unlike microcontrollers they execute logic in hardware parallelism, and unlike ASICs they ship as blank silicon that customers customize in minutes rather than months. APEX II was Altera's high-density flagship prior to the Stratix era, targeting ASIC replacement, high-speed DSP datapaths, and bus-interface bridging.
Key features of the EP2A40F33C-9 include 1.6 million maximum system gates, 65 Kbytes of embedded memory, four Delay-Locked Loops (PLLs) for clock conditioning, multi-voltage I/O support, and embedded LVDS channels capable of gigabit-per-second signaling. The F33 FineLine BGA package provides 672 balls on a 1.27 mm pitch, supporting dense board layouts and high pin-count signaling for parallel buses and memory interfaces. The -9 speed grade sits in the middle of the APEX II speed binning, balancing performance and power for cost-sensitive applications.
The architecture is built on a Look-Up Table (LUT)-based fabric combined with dedicated multiplier, memory, and I/O elements. Embedded CAM blocks enable content-addressable memory applications such as network lookups and translation tables. The device supports hot-socketing, in-system programmability via JTAG, and configuration via serial PROM or parallel flash, allowing field updates without removing the device from its socket.
Typical applications include ASIC prototyping and replacement, telecommunications switching equipment, high-speed serial protocol bridging, image and video processing pipelines, and military/aerospace control systems where legacy Altera design IP must remain supported. The wide I/O count makes it well suited to parallel processor glue logic and backplane interface bridging.
When designing with this device, pay attention to the FineLine BGA breakout: 1.27 mm pitch requires at least 4-layer PCB stackup with microvias or HDI technology. The APEX II architecture requires the Quartus II (or MAX+PLUS II legacy) design software; verify tool support status before committing the design to a new schematic, since APEX II was classified NRND/EOL several years ago and many newer tool versions no longer target it.
This page synthesizes distributor pricing for surplus stock, drop-in alternatives from the same Altera APEX II family that share the F33 FBGA-672 footprint, and practical design notes that go beyond what the manufacturer datasheet provides in isolation.
Drop-in alternatives for EP2A40F33C-9 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F33C-9 (same form factor and footprint) β differing in Package, Speed Grade, Configuration Method, Peak Reflow Temperature, Logic Elements.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2A40F33C-8
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP2A40F33C-7
β Drop-Inβ In Stock
$112 / Unit
View Datasheet βEP2A40F33C-9 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Maximum System Gates | 1,600,000 |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) |
| Package | 672-ball FineLine BGA (F33), 1.27 mm pitch |
| Speed Grade | -9 |
| Operating Temperature | 0C to +85C (commercial) |
| Process Technology | 0.15 micrometer CMOS |
| PLLs | 4 |
| LVDS Channels | 16 high-speed LVDS channels |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM |
| Configuration Method | JTAG, serial PROM, parallel flash |
| MSL Level | 3 |
| Peak Reflow Temperature | 220 C |
| Mounting Type | Surface Mount (BGA) |
EP2A40F33C-9 Pin Configuration
| Pin A1 | I/O β General purpose I/O bank (see pin list) |
| Pin B1 | I/O β General purpose I/O bank (see pin list) |
| Pin A2 | VCCINT β Core supply voltage |
| Pin B2 | GND β Ground |
| Pin A3 | I/O β General purpose I/O |
| Pin B3 | I/O β General purpose I/O |
| Pin A4 | VCCIO β I/O supply voltage |
| Pin B4 | I/O β General purpose I/O |
| Pin A5 | GND β Ground |
| Pin B5 | I/O β General purpose I/O |
| Pin A6 | I/O β General purpose I/O |
| Pin B6 | VCCINT β Core supply voltage |
| Pin A7 | I/O β General purpose I/O |
| Pin B7 | I/O β General purpose I/O |
| Pin A8 | GND β Ground |
| Pin B8 | VCCIO β I/O supply voltage |
| Pin A9 | I/O β General purpose I/O |
| Pin B9 | I/O β General purpose I/O |
| Pin A10 | DCLK β Configuration clock input |
| Pin B10 | nCONFIG β Configuration start (active low) |
Typical Applications
EP2A40F33C-9 is suitable for 6 applications: ASIC Prototyping and Replacement, Telecommunications Switching Equipment, High-Speed Serial Protocol Bridging, Image and Video Processing Pipelines, Military and Aerospace Legacy Systems, Industrial Control and Parallel Processor Glue Logic.
ASIC Prototyping and Replacement
The EP2A40F33C-9's 1.6 million system gate capacity and APEX II multi-core architecture make it suitable for ASIC prototyping where designers validate gate-level RTL before committing to mask costs. The F33 672-ball FineLine BGA exposes enough I/O for full ASIC-pin replication including DDR-style memory buses, parallel datapaths, and JTAG/boundary-scan chains. With 65 Kbytes of embedded RAM the device supports realistic pre-silicon verification of moderate embedded-memory designs. Compared to modern Stratix/Cyclone families, APEX II limits maximum clock rates but offers proven Quartus II tool flow for legacy design reuse.
Recommended
Telecommunications Switching Equipment
The 16 high-speed LVDS channels and four on-chip PLLs of EP2A40F33C-9 are well matched to telecom backplane bridging, where the device aggregates parallel TDM streams, performs framing, and forwards data to higher-layer ASICs. The FineLine BGA-672 footprint provides sufficient I/O for OC-48/STM-16 rate designs and parallel RapidIO-style fabrics. Commercial 0-85 C temperature range suits central-office deployments; industrial customers should look to the EP2A40F33I-9 industrial-grade variant. The APEX II CAM blocks also enable fast network-address lookup tables.
Recommended
High-Speed Serial Protocol Bridging
The APEX II architecture's LVDS capability makes EP2A40F33C-9 a useful protocol bridge between legacy parallel buses and emerging serial standards such as SPI-4.2, SGMII, and low-lane-count PCI Express. Designers can implement serializer/deserializer (SerDes) state machines in the LUT fabric while using the embedded CAM blocks for header lookup. The 672-ball package easily accommodates the multi-bridge pin counts typical of switch-fabric interface cards. Tool flow is mature in Quartus II 13.0 and earlier for these legacy protocols.
Recommended
Image and Video Processing Pipelines
With 1.6 M system gates and 65 Kbytes of embedded RAM, the EP2A40F33C-9 can implement mid-resolution video processing pipelines such as HD-SDI reformatting, deinterlacing, and color-space conversion in a single device. The four PLLs derive multiple pixel clocks from a single reference, while the LVDS channels accept high-speed camera-sensor data at hundreds of MHz. The 672-ball FineLine BGA easily absorbs the wide parallel buses typical of broadcast video standards. For cost-sensitive consumer video applications the APEX II was eventually superseded by Cyclone IV and Cyclone V families.
Recommended
Military and Aerospace Legacy Systems
Many defense and aerospace programs designed in the late 1990s and early 2000s standardized on APEX II for mission-critical control logic, and these systems remain in service decades later requiring spare-parts replenishment. The EP2A40F33C-9's proven reliability and stable bitstream format make it ideal for maintaining these long-life-cycle platforms. The commercial 0-85 C temperature range suffices for temperature-controlled equipment bays; extended-temperature military variants use the EP2A40F33I-9 designation. Excess-stock distributors serve as the primary replenishment channel as of 2026.
Recommended
Industrial Control and Parallel Processor Glue Logic
The EP2A40F33C-9 functions as flexible glue logic between microprocessors, DSPs, memories, and peripheral buses in legacy industrial controllers. The 1.6 M gate capacity accommodates large state machines, custom interrupt controllers, and proprietary bus arbiters that cannot be implemented in standard microcontrollers. The 672-ball package supports parallel interfaces to external SRAM, NOR flash, and FIFO buffers commonly found in PLC backplanes. Industrial customers should verify availability of the I-grade (industrial temperature) variant for harsh environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F33C-9 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F33C-8 | EP2A40F33C-7 | EP2A40B724C9 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 672-ball FineLine BGA (F33) | 672-ball FineLine BGA (F33) - same | 672-ball FineLine BGA (F33) - same | 724-ball BGA - different footprint |
| Family | APEX II | APEX II | APEX II | APEX II |
| Speed Grade | -9 (slowest) | -8 (mid) | -7 (fastest) | -9 |
| Maximum System Gates | 1,600,000 | 1,600,000 | 1,600,000 | 1,600,000 |
| Embedded RAM | 65 Kbytes | 65 Kbytes | 65 Kbytes | 65 Kbytes |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
| Bitstream Compatible | Reference baseline | Yes - same family, faster | Yes - same family, fastest | Partial - different package |
Key Differentiators
- Highest-density APEX II in commercial temperature grade (vs EP2A40F33C-8)
- Established 672-ball FineLine BGA footprint (vs EP2A40B724C9 (724-ball BGA))
- Mature Quartus II tool flow with extensive legacy IP (vs Modern Stratix/Cyclone FPGAs)
Design Notes
The 672-ball FineLine BGA at 1.27 mm pitch requires a 4-layer minimum PCB stackup with microvias or HDI technology for breakout routing. Use 0.8 mm via-in-pad with filled and plated-over copper cap if escape routing demands it; the standard dog-bone fan-out works for outer signals. Power decoupling requires 100 nF X7R 0402 caps on every VCCINT/VCCIO ball pair as documented in the Altera APEX II Hardware Reference Guide.
APEX II bitstreams are NOT compatible with later Stratix or Cyclone families. Designers migrating to newer devices must resynthesize their RTL using current Quartus Prime and verify all IP cores against the new device library. Do not assume an existing APEX II bitstream can be loaded onto a Stratix equivalent - configuration schemes differ and will fail at startup. Also verify that all legacy IP cores (especially Altera Megafunction partners) are still licensed for the new toolchain.
Configure the device from a serial configuration PROM (EPC16 or EPC8 family) for production boards; JTAG-only configuration is acceptable for prototype bring-up but is not field-reprogrammable without a download cable. Place the configuration PROM within 50 mm of the F33 device to keep the DCLK and DATA traces short and impedance-controlled. Add a 10 kohm pull-up on nCONFIG and a 1 kohm pull-up on nSTATUS per the APEX II configuration handbook to prevent spurious reconfiguration during power-up.
Compliance Information
Compliance certifications not stated in the verified distributor data. APEX II launched before RoHS took effect so compliance varies by manufacturing date - request certificate from distributor at order time. AEC-Q100 not applicable to FPGAs in this class.
