EP2AGX260FF35C6N vs EP2AGX260FF35I3G Comparison
Detailed side-by-side comparison of EP2AGX260FF35C6N by Intel and EP2AGX260FF35I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2AGX260FF35C6N
EP2AGX260FF35C6N - Arria II GX 244K LE FPGA, 1152-FBGA | Intel
EP2AGX260FF35C6N β ActiveIntel
EP2AGX260FF35I3G
EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel
EP2AGX260FF35I3G β Last Time BuySpecification Comparison
| Parameter | EP2AGX260FF35C6N | EP2AGX260FF35I3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,320.00 | $1,985.00 |
| Device Type | FPGA - Field Programmable Gate Array | β |
| Series | Arria II GX | β |
| Logic Elements | 244,188 | 244188 |
| Logic Array Blocks (LABs) | 10,260 | β |
| User I/O Count | 612 | β |
| Embedded Memory Bits | 12,038,144 | 12038144 |
| Operating Frequency | 400 MHz | β |
| Process Technology | 40 nm CMOS | 40 nm |
| Core Supply Voltage | 0.9 V | 0.9 V |
| Package Type | 1152-BBGA, FCBGA (FBGA-1152) | β |
| Package Pin Count | 1152 | β |
| Pin/Package Form | BALL, HBGA, SQUARE | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature Grade | Commercial (C6) | β |
| Speed Grade | 6 | I3 |
| RoHS Status | Compliant | β |
| Device Family | β | Arria II GX |
| Maximum User I/O | β | 612 |
| Package | β | 1152-BBGA, FCBGA |
| Operating Temperature | β | -40 C to +100 C (Industrial) |
| Configuration | β | JTAG / Active Serial / Passive Serial / FPP |
| DSP Blocks | β | [DATA_NEEDED: DSP block count] |
| Transceivers | β | [DATA_NEEDED: number of transceiver channels] |
| Lead-Free (RoHS) | β | Yes (G suffix indicates Pb-free finish) |
| Tray Standard Quantity | β | [DATA_NEEDED: tray qty] |