Intel

EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel

MPN: EP2AGX260FF35I3G ⚠ Last Time Buy

In Stock Ships in 1-3 business days

0.9 V Vdss 1152-BBGA, FCBGA Package I3 Speed 12038144 Memory

From $1985 USD / Unit

MOQ: 1 |

Price updated: 2026-09-08

Volume Pricing

Qty	Unit Price	Extended
1	$2850	$2,850.00
10	$2680	$26,800.00
100	$2420	$242,000.00
500	$2190	$1,095,000.00
1,000	$1985	$1,985,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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EP2AGX260FF35I3G Overview

The Intel (formerly Altera) EP2AGX260FF35I3G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FC-FBGA) package. The Arria II GX family is engineered for high-throughput serial connectivity, providing up to 16 transceivers at data rates suitable for PCI Express Gen2, Serial RapidIO, and multi-gigabit serial interfaces in a single programmable device. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and the speed grade 3 (I3) variant balances timing margin and maximum frequency for industrial temperature operation.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers and memory blocks. FPGAs occupy the top of the programmable-logic taxonomy: PLA -> CPLD -> FPGA -> SoC FPGA, and are widely used when time-to-market and design flexibility outweigh the per-unit cost advantage of an ASIC. The Arria II GX family specifically targets the mid-range transceiver-integrated segment between Cyclone (low cost) and Stratix (highest performance).

Key features include embedded transceivers, hard PCI Express Gen2 IP cores, embedded memory blocks with byte-enable parity, dedicated DSP blocks for high-throughput signal processing, and configuration support via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes. The device supports hot-socketing and in-system programming for production-line flexibility. Industrial temperature grade (I3 suffix) supports -40 C to +100 C operation, while the trailing G indicates lead-free / RoHS-compliant lead finish on the BGA balls.

Typical applications include wireless baseband processing, high-speed serial bridging between ASICs, military radar signal processing, broadcast video engines, and PCI Express endpoint / root-port prototyping. For new designs, designers should consider migrating to Intel Cyclone V GT, Arria V GX, or Arria 10 GX families, as Arria II GX is in its end-of-life window and is increasingly sourced through distributors rather than direct Intel channels.

A practical design tip: Arria II GX transceivers require careful attention to reference-clock jitter and PCB stack-up for the channel. Use the Quartus II transceiver toolkit to characterize link margin, and de-rate the line rate by at least 10-15% during board bring-up to absorb manufacturing tolerance.

This page synthesizes distributor stock and pricing, parametric alternatives, and design notes not found in the Altera Arria II GX Device Handbook, providing an at-a-glance procurement reference for engineers and NPI buyers evaluating this legacy high-density FPGA.

Drop-in alternatives for EP2AGX260FF35I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2AGX260FF35I3G (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Family.

EP2AGX190FF35I3G

Altera

Package: 1152-ball FC-FBGA (FF35), 35 mm body

Operating Temperature: -40 °C to +100 °C (industrial, suffix I)

Speed Grade: 3