EP2AGZ300FF35I3G vs EP2AGZ300FF35C4N Comparison

Detailed side-by-side comparison of EP2AGZ300FF35I3G by Intel and EP2AGZ300FF35C4N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FF35I3G EP2AGZ300FF35C4N
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,230.00 $1,350.00
Family Arria II GZ β€”
Logic Elements (LE) 300000 β€”
Number of User I/O 554 (maximum) β€”
Number of Transceivers 8 β€”
Transceiver Data Rate Up to 6.375 Gbps β€”
Process Node 40 nm β€”
Operating Temperature -40C to +100 C (I3 industrial) β€”
Package 1152-ball FBGA (FF35) β€”
Mounting Type Surface Mount Surface Mount
Supply Voltage [DATA_NEEDED: core and I/O supply voltage values] β€”
Embedded Memory (Mbits) 16.4 β€”
DSP Blocks [DATA_NEEDED: number of DSP blocks] [DATA_NEEDED: number of DSP blocks]
PLLs [DATA_NEEDED: number of PLLs] [DATA_NEEDED: PLL count]
Memory Interfaces DDR3, QDRII+, RLDRAM II β€”
Configuration Method Serial, Parallel, JTAG β€”
RoHS Status Compliant Compliant (per Besenchips / DigiKey listing)
MSL Level 3 (168 hours) β€”
Lead-Free Yes β€”
Series β€” Arria II GZ
Logic Elements β€” 298,000
Logic Array Blocks (LABs) β€” 11,920
Embedded Memory (bits) β€” 18,854,912 (~17.9 Mbit)
User I/O Count β€” 554
Number of I/O Banks β€” [DATA_NEEDED: number of I/O banks]
Process Technology β€” 40 nm
Core Voltage β€” 0.9 V
Package Type β€” 1152-BBGA, FCBGA (flip-chip)
Terminal Form β€” Ball
Package Code (JEDEC) β€” HBGA
Operating Temperature Grade β€” Commercial (C4 = 0C to +85C)
Configuration Memory β€” SRAM-based (volatile, requires boot device)
Transceivers β€” Multi-gigabit transceivers integrated
Lead-Free Status β€” Lead free (per Besenchips listing)
Maximum Operating Frequency β€” 500 MHz

Datasheets & Resources

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