EP2AGZ300FF35I4 vs EP2AGZ300FF35I3G Comparison
Detailed side-by-side comparison of EP2AGZ300FF35I4 by Intel and EP2AGZ300FF35I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300FF35I4 | EP2AGZ300FF35I3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,015.00 | $1,230.00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | β |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | β |
| Maximum User I/O | 554 | β |
| Operating Frequency (Max) | 500 MHz | β |
| Process Technology | 40 nm | β |
| Core Voltage | 0.9 V | β |
| Package | 1152-ball FC-FBGA (FF35) | 1152-ball FBGA (FF35) |
| Temperature Grade | Industrial (-40 C to +100 C) | β |
| Number of Pins/Balls | 1152 | β |
| Terminal Form | Ball (BGA) | β |
| Transceivers | 12.5 Gbps integrated | β |
| Embedded Memory | M20K blocks (distributed) | β |
| DSP Blocks | Hard DSP columns (variable precision) | [DATA_NEEDED: number of DSP blocks] |
| PCIe Support | PCIe Gen2 hard IP | β |
| Mounting Type | Surface Mount (flip-chip BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | β | 300000 |
| Number of User I/O | β | 554 (maximum) |
| Number of Transceivers | β | 8 |
| Transceiver Data Rate | β | Up to 6.375 Gbps |
| Process Node | β | 40 nm |
| Operating Temperature | β | -40C to +100 C (I3 industrial) |
| Supply Voltage | β | [DATA_NEEDED: core and I/O supply voltage values] |
| Embedded Memory (Mbits) | β | 16.4 |
| PLLs | β | [DATA_NEEDED: number of PLLs] |
| Memory Interfaces | β | DDR3, QDRII+, RLDRAM II |
| Configuration Method | β | Serial, Parallel, JTAG |
| MSL Level | β | 3 (168 hours) |