EP2AGZ300FF35I4 - Arria II GZ FPGA, 298K LE, 1152-BGA | Intel
MPN: EP2AGZ300FF35I4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1325 | $13,250.00 |
| 100 | $1180 | $118,000.00 |
| 500 | $1095 | $547,500.00 |
| 1,000 | $1015 | $1,015,000.00 |
EP2AGZ300FF35I4 Overview
What is an FPGA? A Field Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected via programmable interconnect, surrounded by hard I/O blocks such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the programmable logic hierarchy above CPLDs and below ASICs, offering ASIC-class performance and density combined with full reprogrammability. The Arria II GZ family targets mid- to high-end transceiver-based applications requiring a balance of logic capacity, DSP throughput, and serial bandwidth without the power envelope of the high-end Stratix family.
Key features include 298,000 logic elements (LEs), 11,920 LABs/CLBs, 554 maximum user I/O pins, embedded 12.5 Gbps transceivers, dedicated hardware DSP blocks for high-throughput signal processing, and on-chip M20K memory blocks distributed across the fabric. The 40 nm process node delivers higher logic density at lower static power than the preceding 65 nm Stratix IV family. The industrial temperature grade and 1152-ball flip-chip BGA package make this part suitable for harsh-environment embedded systems.
Architecture-wise, the Arria II GZ device combines a sea-of-LABs programmable fabric with column-based DSP and memory resources, hard PCIe Gen2 IP blocks, and up to 16 transceivers capable of 12.5 Gbps operation. The fabric supports partial reconfiguration, allowing portions of the design to be reprogrammed while other sections remain active - a capability leveraged in software-defined radio, in-system upgrade, and fault-tolerant compute.
Typical applications include high-speed serial protocol bridging (PCIe Gen2, XAUI, CEI-6G, CPRI), software-defined radio and digital front-end processing, test and measurement instrumentation, broadcast video processing, radar and remote sensing front-end processing, and defense/aerospace signal processing payloads.
When designing with this device, ensure proper PCB stack-up and power-rail decoupling for the 0.9 V core and 1.5 V/2.5 V/3.3 V auxiliary supplies; refer to the Altera/Intel Arria II GZ handbook for pin connection guidelines. The transceiver channels require careful impedance-controlled routing and AC-coupling capacitor selection for jitter compliance.
This page synthesizes distributor pricing tiers, drop-in package-compatible alternatives from the Arria II GZ family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP2AGZ300FF35I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300FF35I4 (same form factor and footprint) — differing in Package, Transceivers, Logic Elements, Embedded Memory, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGZ300FF35I3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3500 / Unit
View Datasheet →EP2AGZ300FF35C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1350 / Unit
View Datasheet →EP2AGZ300FF35I3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1230 / Unit
View Datasheet →EP2AGZ300FF35C4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2240 / Unit
View Datasheet →EP2AGZ300FF35C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1480 / Unit
View Datasheet →EP2AGZ300FF35C3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1395 / Unit
View Datasheet →EP2AGZ300FF35I4 Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Logic Elements | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 |
| Maximum User I/O | 554 |
| Operating Frequency (Max) | 500 MHz |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Package | 1152-ball FC-FBGA (FF35) |
| Temperature Grade | Industrial (-40 C to +100 C) |
| Number of Pins/Balls | 1152 |
| Terminal Form | Ball (BGA) |
| Transceivers | 12.5 Gbps integrated |
| Embedded Memory | M20K blocks (distributed) |
| DSP Blocks | Hard DSP columns (variable precision) |
| PCIe Support | PCIe Gen2 hard IP |
| Mounting Type | Surface Mount (flip-chip BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2AGZ300FF35I4 1152-ball fc-fbga (ff35) Pin Configuration Guide
Pin configuration for EP2AGZ300FF35I4 (1152-ball fc-fbga (ff35) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300FF35I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300FF35I4 is suitable for 6 applications: High-Speed Serial Protocol Bridging, Software Defined Radio / Digital Front-End, Test & Measurement Instrumentation, Broadcast Video Processing, Radar & Remote Sensing Front-End, Defense / Aerospace Signal Processing.
High-Speed Serial Protocol Bridging
The EP2AGZ300FF35I4 fits high-speed serial protocol bridging applications because it integrates 12.5 Gbps transceivers and hard PCIe Gen2 IP blocks, enabling native bridging between PCIe Gen2, XAUI, CEI-6G, SATA, and CPRI protocols without external PHY chips. The 298,000 logic elements provide ample headroom for protocol state machines, buffer management, and DMA engines. Placed on the system board as the central interconnect element with 0.9 V core and 1.5/2.5/3.3 V auxiliary supplies, it eliminates the latency of discrete ASSP bridges and supports protocol-aware packet processing. The 1152-ball FC-FBGA package allows 554 user I/O for parallel expansion ports.
Recommended
Software Defined Radio / Digital Front-End
The EP2AGZ300FF35I4 is well-suited for software-defined radio (SDR) and digital front-end (DFE) processing because its 298K logic elements combined with hard DSP blocks and M20K memory blocks deliver the multi-GSPS sample-rate processing required for LTE, 5G NR, and proprietary waveform demodulation. The 12.5 Gbps transceivers accept digitized RF directly from high-speed ADCs, while the 554 user I/O enable parallel connection to DACs, mixers, and RF front-end modules. Used as the central baseband processor between transceiver ADCs/DACs and host CPU, it allows real-time reconfiguration for multi-mode/multi-band operation. The 40 nm process and industrial temperature grade support deployment in outdoor base-station and tactical radio chassis.
Recommended
Test & Measurement Instrumentation
The EP2AGZ300FF35I4 fits high-end test and measurement instrumentation because its 298K logic elements with hard DSP and 500 MHz fabric allow real-time signal conditioning, FFT processing, and protocol-aware triggering for oscilloscopes, logic analyzers, BERT systems, and arbitrary waveform generators. The integrated 12.5 Gbps transceivers enable direct acquisition of high-speed serial data streams (PCIe, USB 3.0, SATA) for protocol analysis. With 554 user I/O, the device can interface to high-speed ADC/DAC channels, display controllers, and trigger buses. Industrial temperature rating and the FF35 package suit laboratory and field-portable instrument enclosures where thermal margins matter.
Recommended
Broadcast Video Processing
The EP2AGZ300FF35I4 suits broadcast video processing applications because its 298K logic elements and hard DSP blocks deliver real-time multi-stream SD/HD/3G-SDI processing, up/down/cross conversion, color-space conversion, and overlay compositing. The 12.5 Gbps transceivers enable native SDI and HDMI 2.0 I/O without external serializer/deserializer chips, while the 554 user I/O support audio embedding, GPI/GPO, and tally interfaces. Integrated PCIe Gen2 hard IP allows direct host attachment for file-based ingest/playout. The industrial temperature grade supports broadcast studio, master control, and outside broadcast vehicle environments.
Recommended
Radar & Remote Sensing Front-End
The EP2AGZ300FF35I4 fits radar and remote sensing front-end processing because its 298K logic elements combined with M20K memory blocks and hard DSP columns enable real-time pulse compression, MTI/MTD filtering, beamforming, and SAR image formation. The 12.5 Gbps transceivers accept digitized IF/RF directly from high-speed ADCs, while the 554 user I/O enable parallel control of antenna arrays, ADC/DAC banks, and timing/trigger distribution. Industrial temperature grade and the FF35 package suit airborne, naval, and ground-mobile radar platforms. Quartus II DSP Builder and System Generator tool flows accelerate beamforming and FFT IP development.
Recommended
Defense / Aerospace Signal Processing
The EP2AGZ300FF35I4 supports defense and aerospace signal processing payloads because its 298K logic elements, 12.5 Gbps transceivers, and industrial temperature grade meet the requirements for SIGINT, ELINT, and electronic warfare subsystems. The FF35 1152-ball FC-FBGA package withstands high-vibration environments when properly board-mounted, and the 40 nm process delivers deterministic latency for time-sensitive signal processing. PCIe Gen2 hard IP enables integration with VPX/OpenVPX backplane architectures. Designers should consult Intel/Altera industrial temperature and reliability documentation for ruggedization guidance.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300FF35I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300FF35I3N | EP2AGZ300FF35C4N | EP2AGZ300FF35I3G | EP2AGZ300FF35C4G | EP2AGZ300FF35C3N | EP2AGZ300FF35C3G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (FF35) | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same |
| Logic Elements | 298,000 | 298,000 | 298,000 | 298,000 | 298,000 | 298,000 | 298,000 |
| LABs/CLBs | 11,920 | 11,920 | 11,920 | 11,920 | 11,920 | 11,920 | 11,920 |
| Speed Grade | -4 | -3 | -4 | -3 | -4 | -3 | -3 |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) |
| Max User I/O | 554 | 554 | 554 | 554 | 554 | 554 | 554 |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Transceiver Speed | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
Key Differentiators
- Highest density Arria II GZ variant in FF35 package (vs EP2AGZ225FF35I4N)
- Speed grade -4 vs -3 alternatives (vs EP2AGZ300FF35I3N)
- Industrial vs commercial temperature grade (vs EP2AGZ300FF35C4N)
- Higher transceiver bandwidth than Arria II GX (vs EP2AGX260FF35I5N)
Design Notes
The EP2AGZ300FF35I4 requires multiple supply rails: 0.9 V core (VCC), 1.5 V/1.8 V/2.5 V/3.3 V auxiliary supplies for I/O banks, and a separate PLL analog supply (VCCA_PLL). Decouple each rail with bulk ceramic capacitors placed close to the FF35 ball-pad entries; typical recommendations are 100 uF bulk plus 10 uF/0.1 uF/1 nF decoupling per power pin group. Power sequencing must follow the Arria II GZ handbook - core supply must ramp before auxiliary supplies. Estimated: at 100% resource utilization the core can draw up to several amps; verify with the PowerPlay early-power estimator tool.
The FF35 1152-ball FC-FBGA package demands a high-density PCB stack-up with microvia (laser-drilled) vias and fine-pitch escape routing. Use the Intel/Altera FF35 PCB footprint and pin-out files as the authoritative source for ball-pad geometry and via-in-pad design. Route 12.5 Gbps transceiver channels on the top layers with controlled 100 ohm differential impedance, length matching to within the budget specified in the Transceiver Design Guide, and AC-coupling capacitors placed close to the transmitter output pads.
The 1152-ball FC-FBGA package dissipates heat primarily through the ball grid into the PCB; a thermal pad is not exposed. Estimated: at full transceiver utilization and high toggle rates, junction temperature can approach the industrial 100 C ceiling, so provide adequate PCB copper area on inner and outer layers connected to the FF35 thermal balls. Use the Thermal Models in the Arria II GZ device handbook (theta_JA, theta_JC) to size copper pours and airflow. Industrial temperature grade limits junction to 100 C ambient operation.
Common pitfalls with the EP2AGZ300FF35I4 include: (1) ignoring Quartus II pin-out assignment for unused transceiver channels - leave them tied per the handbook; (2) omitting the MSEL configuration-mode pins - must be tied high/low to select the desired configuration scheme (AS, PS, JTAG); (3) not connecting JTAG TCK/TMS/TDO/TDI for boundary-scan test, even if not used in production; (4) using the wrong Quartus II version - Arria II GZ is supported by Quartus II v13.0 and earlier, not Quartus Prime. Refer to the device handbook Errata for known issues.
For 12.5 Gbps transceiver channels, follow the Arria II GZ Transceiver Design Guide for pre-emphasis, de-emphasis, and equalization settings. AC-coupling capacitors should be 0402 or 0201 size with 0.1 uF or 100 nF capacitance and placed within 1 mm of the transmitter pads. Reference clock routing requires 100 ohm differential impedance with length matching to the data channels. Use HyperLynx or ANSYS SI for channel simulation before tape-out.
Compliance Information
RoHS and lead-free compliance per Intel/Altera product markings on FF35 parts. AEC-Q100 not applicable - this is a high-end FPGA not targeting automotive. Halogen-free and conflict-minerals status not explicitly stated in the verified data; set to 'unknown'.
