EP2C35F484I6N vs EP2C35F484C6 Comparison

Detailed side-by-side comparison of EP2C35F484I6N by Intel and EP2C35F484C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2C35F484I6N

EP2C35F484I6N - 33K LE Cyclone II FPGA, 484-FBGA | Intel

EP2C35F484I6N Nrnd
Intel
EP2C35F484C6

EP2C35F484C6 - Cyclone II FPGA 33K LE 484-FBGA | Intel

EP2C35F484C6 βœ“ Active

Specification Comparison

Parameter EP2C35F484I6N EP2C35F484C6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $52.10 $57.20
Logic Elements 33,216 β€”
Logic Array Blocks (LABs) 2,100 β€”
Total RAM Bits 483,840 bits (483.84 Kbit on-chip) β€”
Embedded 18x18 Multipliers 35 (Cyclone II family maximum 150) 35
Phase-Locked Loops (PLLs) 4 β€”
Maximum User I/O Pins 322 (package-dependent; FBGA-484 supports up to 322 user I/O) β€”
Package 484-ball FBGA (Fine-Pitch BGA) 484-ball FineLine BGA (FBGA)
Logic Family CMOS β€”
Core Supply Voltage 1.2 V β€”
Operating Temperature Range -40C to +85C (industrial) β€”
Maximum Internal Clock Frequency 402.5 MHz β€”
Process Node 90 nm TSMC CMOS β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant Compliant
Configuration Method Serial / Parallel (via Altera/Intel configuration device or JTAG) β€”
Family β€” Cyclone II
Logic Elements (LE) β€” 33,216
Embedded Memory Bits β€” 483,840 bits (105 M4K blocks x 4 Kbit)
Maximum User I/O β€” 322
Process Technology β€” 90 nm low-k CMOS
Core Voltage (VCCINT) β€” 1.2 V
PLL Analog Supply (VCCA) β€” 2.5 V
I/O Standards β€” LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V), SSTL, HSTL, PCI, differential LVDS, RSDS
Speed Grade β€” -6
Operating Temperature (Commercial) β€” 0 C to +85 C
PLLs β€” 4
Global Clock Networks β€” 16
Configuration Modes β€” Active Serial (AS), Passive Serial (PS), JTAG
Lead-Free β€” Yes

Datasheets & Resources

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