EP2C35F484I6N - 33K LE Cyclone II FPGA, 484-FBGA | Intel
MPN: EP2C35F484I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $78.2 | $782.00 |
| 100 | $67.4 | $6,740.00 |
| 500 | $58.9 | $29,450.00 |
| 1,000 | $52.1 | $52,100.00 |
EP2C35F484I6N Overview
An FPGA (field-programmable gate array) is a reconfigurable semiconductor device whose logic function is defined by a customer-supplied bitstream rather than hard-wired during fabrication. The Cyclone II family sits within the broader programmable logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike microcontrollers which execute sequential firmware, FPGAs implement parallel hardware logic that can be updated in the field, making them ideal for prototyping, low-volume production, and applications where hardware parallelism outperforms software. The EP2C35 specifically targets the mid-density segment with 33K logic elements, balancing cost per logic element against capability.
Key features of the EP2C35F484I6N include 2,100 Logic Array Blocks (LABs) organized in 33,216 logic elements (LEs), 483,840 bits of embedded RAM (M4K blocks), 4 phase-locked loops (PLLs) for clock management, and 315 embedded 18x18 multipliers in the Cyclone II family (the EP2C35 provides 35 embedded multipliers per Cyclone II datasheet). The device supports multiple I/O standards including LVDS, SSTL, HSTL, PCI, and PCI-X through configurable user I/O banks. Its 1.2 V core voltage with 1.2 V/2.5 V/3.3 V I/O supplies enables mixed-voltage system design.
The Cyclone II architecture uses a 4-input look-up table (LUT) based logic element with a dedicated carry chain, distributed M4K memory blocks, and embedded multiplier blocks. This heterogeneous fabric allows efficient implementation of arithmetic DSP pipelines, FIFO buffers, and state-machine control logic without external components. The PLLs provide clock multiplication, division, phase shifting, and duty-cycle correction for interfacing with external memory and high-speed peripherals.
Typical applications for the EP2C35F484I6N include industrial motor control, video processing and image filtering, telecommunications line cards, software-defined radio DSP front-ends, and automotive driver-assistance prototypes. Designers choose the EP2C35 when they need a balance of logic density, DSP performance, and BGA packaging for high-pin-count systems. The 484-ball FBGA package supports the maximum user I/O count of the device, enabling wide parallel buses and multiple high-speed serial interfaces simultaneously.
When designing with this device, engineers should follow Intel/Altera board layout guidelines for BGA fanout, power-plane decoupling, and PLL analog supply isolation. The Quartus II design suite (now Intel Quartus Prime) provides synthesis, place-and-route, and timing analysis for the Cyclone II family. Because the EP2C35F484I6N is a mature part originally launched circa 2005, engineers should verify current lifecycle status before new design starts.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Cyclone II family, and practical board-level design notes not found in the manufacturer datasheet alone. It is intended for engineers evaluating mid-density FPGAs for cost-sensitive parallel-processing designs.
Drop-in alternatives for EP2C35F484I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C35F484I6N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C35F484C8N
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP2C35F484C7N
✅ Drop-In✓ In Stock
$85.2 / Unit
View Datasheet →EP2C35F484C6N
✅ Drop-In✓ In Stock
$118.2 / Unit
View Datasheet →EP2C35F484C8
✅ Drop-In✓ In Stock
$28.9 / Unit
View Datasheet →EP2C35F484C7
✅ Drop-In✓ In Stock
$54.25 / Unit
View Datasheet →EP2C35F484C6
✅ Drop-In✓ In Stock
$57.2 / Unit
View Datasheet →EP2C35F484I6N Maximum Ratings & Electrical Characteristics
| Logic Elements | 33,216 |
| Logic Array Blocks (LABs) | 2,100 |
| Total RAM Bits | 483,840 bits (483.84 Kbit on-chip) |
| Embedded 18x18 Multipliers | 35 (Cyclone II family maximum 150) |
| Phase-Locked Loops (PLLs) | 4 |
| Maximum User I/O Pins | 322 (package-dependent; FBGA-484 supports up to 322 user I/O) |
| Package | 484-ball FBGA (Fine-Pitch BGA) |
| Logic Family | CMOS |
| Core Supply Voltage | 1.2 V |
| Operating Temperature Range | -40C to +85C (industrial) |
| Maximum Internal Clock Frequency | 402.5 MHz |
| Process Node | 90 nm TSMC CMOS |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Method | Serial / Parallel (via Altera/Intel configuration device or JTAG) |
EP2C35F484I6N 484-ball fbga (fine-pitch bga) Pin Configuration Guide
Pin configuration for EP2C35F484I6N (484-ball fbga (fine-pitch bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C35F484I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C35F484I6N is suitable for 6 applications: Industrial Motor Control, Video Processing & Image Filtering, Software-Defined Radio DSP Front-End, Telecommunications Line Cards, Test & Measurement Instrumentation, Automotive Driver-Assistance Prototyping.
Industrial Motor Control
The EP2C35F484I6N's 33,216 logic elements, 35 embedded 18x18 multipliers, and 322 user I/O pins make it well-suited for industrial motor control applications including field-oriented control (FOC) of three-phase AC induction and PMSM motors. The device can simultaneously execute a high-precision PID loop, space-vector PWM generation, encoder quadrature decoding, and current-sense ADC sampling within a single fabric. Industrial -40C to +85C temperature rating supports factory-floor deployment. The 1.2V core with on-chip PLLs enables tight PWM timing at switching frequencies above 100 kHz for low-ripple torque control.
Recommended
Video Processing & Image Filtering
The EP2C35F484I6N's 483 Kbit embedded RAM and 322 I/O pins enable real-time video processing pipelines such as 2D FIR filters, color-space conversion, motion estimation, and edge detection at VGA to 720p resolutions. M4K blocks serve as line buffers for 8-16 bit pixel data, while the 35 embedded 18x18 multipliers accelerate convolution kernels and DCT/IDCT transforms. Designers implement Sobel, Gaussian, and median filters at 60 fps for surveillance and machine-vision prototypes. The 484-ball FBGA package provides ample I/O for parallel RGB/YCbCr video buses and DDR2 frame-buffer memory.
Recommended
Software-Defined Radio DSP Front-End
The EP2C35F484I6N's embedded multipliers and 402.5 MHz maximum internal clock support software-defined radio (SDR) baseband processing including digital down-conversion (DDC), FIR filtering, FFT computation, and demodulation for narrowband communication receivers. The device implements a complete IF-processing chain for AM, FM, PSK, and QAM modulations without requiring an external DSP chip. Its 322 I/O pins accept high-speed parallel ADC data from intermediate-frequency samplers. The -40C to +85C industrial temperature range supports outdoor telecom and defense radio deployments.
Recommended
Telecommunications Line Cards
The EP2C35F484I6N is well-matched for telecom line-card applications including T1/E1 framers, HDLC controllers, ATM segmentation-and-reassembly engines, and low-density packet processors. Its 4 PLLs provide independent clock domains for line-side and system-side interfaces, while the 322 user I/O pins accept parallel TDM buses and connect to network processors. Embedded M4K memory implements per-channel FIFOs and packet buffers with deterministic access latency. The FBGA-484 package supports the mixed-voltage I/O (LVDS, LVTTL, HSTL) common in central-office equipment.
Recommended
Test & Measurement Instrumentation
The EP2C35F484I6N's parallel logic fabric and high-speed I/O make it suitable for custom test and measurement instruments including logic analyzers, protocol exercisers, pattern generators, and data-acquisition front-ends. The 322 I/O pins drive multiple channels of stimulus or capture data at rates up to 402.5 MHz, while embedded RAM stores captured waveforms and protocol traces. Engineers implement protocol decoders (I2C, SPI, UART, CAN, LVDS) in soft logic and update them via JTAG as specifications evolve. Industrial temperature rating supports bench and field testing environments.
Recommended
Automotive Driver-Assistance Prototyping
The EP2C35F484I6N supports prototype development of advanced driver-assistance systems (ADAS) including lane-departure warning, traffic-sign recognition, pedestrian detection, and surround-view image stitching. Its 33K logic elements and 35 multipliers process multiple camera streams in parallel at VGA-to-720p resolution, while the 322 I/O pins accept MIPI-CSI, parallel RGB, and BT.656 camera interfaces via soft IP. The industrial -40C to +85C temperature rating covers cabin and trunk-mounted ECU environments. Production-intent designs migrate to Cyclone V or automotive-qualified FPGAs from other vendors.
Recommended
Recommended Products Summary
Engineering reference data for EP2C35F484I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C35F484C8N | EP2C35F484C7N | EP2C35F484C6N | EP2C35F484C8 | EP2C35F484C7 | EP2C35F484C6 |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I6 | C8 (faster) | C7 | C6 (slower) | C8 (faster) | C7 | C6 (slower) |
| Embedded RAM | 483,840 bits | 483,840 bits - same | 483,840 bits - same | 483,840 bits - same | 483,840 bits - same | 483,840 bits - same | 483,840 bits - same |
| Embedded Multipliers | 35 | 35 - same | 35 - same | 35 - same | 35 - same | 35 - same | 35 - same |
| Packaging Format | Tray (N suffix) | Tray (N suffix) | Tray (N suffix) | Tray (N suffix) | Tray (no N suffix) | Tray (no N suffix) | Tray (no N suffix) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Industrial temperature grade for harsh environments (vs EP2C35F484C8N (commercial temp))
- Same silicon die as all FBGA-484 variants (vs EP2C20F484I6N (different die))
- Mature, broadly supported Cyclone II family (vs Newer Cyclone IV/V devices)
Design Notes
The 484-ball FBGA package uses 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology for reliable fanout. Designers should follow Intel/Altera Cyclone II Board Design Guidelines for layer stackup, including dedicated power and ground planes adjacent to the BGA footprint. Decoupling capacitors (0.1 uF, 0.01 uF, and bulk 10-100 uF) must be placed within 100 mils of the device's power balls. Estimated: assuming a 6-layer stackup with 50 ohm controlled-impedance routing, total board area for the EP2C35F484 footprint is approximately 25x25 mm.
The EP2C35F484I6N requires three supply rails: VCCINT (1.2 V core), VCCIO (1.2 V/2.5 V/3.3 V I/O, per bank), and VCCA_PLL (2.5 V analog supply for the 4 PLLs). The PLL analog supply must be isolated from digital noise with an LC filter (typical 10 uH inductor + 10 uF capacitor) to meet jitter specifications. Power sequencing requires VCCINT to rise before or simultaneously with VCCIO; failing to sequence can cause latch-up or long-term reliability degradation. Estimated: at 50% toggle rate with 322 I/O active, ICCINT is approximately 500 mA and ICCIO ranges 200-800 mA per bank.
A common design pitfall is assuming the EP2C35F484I6N is pin-compatible with newer Cyclone IV or Cyclone V devices despite sharing the same FBGA-484 package - the pinouts differ between device families and board rework is required for migration. Another pitfall is using unsupported configuration modes; the Cyclone II family supports only AS (Altera/Intel serial), PS (parallel), JTAG, and PPA configuration - newer boot modes like Avalon-ST are not available. Designers should also verify bitstream compatibility when migrating between speed grades (I6, C7, C8) of the same die, as timing constraints differ.
High-speed LVDS and DDR memory interfaces on the EP2C35F484I6N require matched-length routing within 50 mils and controlled differential impedance (100 ohm differential for LVDS, 50 ohm single-ended for SSTL). Use the Cyclone II Device Handbook's I/O timing specifications to calculate setup/hold margins at your target clock frequency. The Quartus II TimeQuest timing analyzer must be run with realistic board delays to verify margins before tape-out.
Compliance Information
RoHS and REACH compliant per Altera/Intel Cyclone II environmental declaration. Lead-free BGA balls support Pb-free reflow up to 260C peak (JEDEC J-STD-020). AEC-Q100 not applicable - this is a general-purpose FPGA, not an automotive-grade IC. Halogen-free status not confirmed in available web data.
