EP2C8F256CXNAA vs EP2C8F256I8N Comparison

Detailed side-by-side comparison of EP2C8F256CXNAA by Intel and EP2C8F256I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2C8F256CXNAA EP2C8F256I8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $11.05 $21.95
Family Cyclone II β€”
Logic Elements 8,256 β€”
Embedded Memory (M4K blocks) 36 blocks (162 Kbits total) β€”
Embedded 18x18 Multipliers 18 Up to 36
PLLs 4 2
Maximum User I/O Pins 182 β€”
User Flash Memory 0 Kbits β€”
Process Technology 90 nm 90 nm CMOS (SRAM-based)
Core Supply Voltage 1.15 V to 1.25 V 1.2 V
I/O Standards LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) β€”
Package 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm β€”
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG β€”
Operating Temperature (Industrial) -40C to +85C (N suffix) β€”
RoHS Compliance Yes (lead-free) β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level 3 β€”
Series β€” Cyclone II
Logic Elements (LEs) β€” 8,256
Embedded Memory Bits β€” 165,888 bits
Total RAM Bits β€” 165,888
Logic Blocks / Logic Cells β€” 540 (Logic Cells)
User I/O Pins β€” 182
Number of LABs/CLBs β€” [DATA_NEEDED: LAB count]
Global Clock Networks β€” 16
I/O Supply Voltage β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Package Type β€” 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Operating Temperature β€” -40C to +85C (industrial)
Configuration Method β€” SRAM, loaded from external EPCS flash at power-up
RoHS Status β€” Compliant (Pb-free, lead-free reflow compatible)

Datasheets & Resources

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