EP2C8F256CXNAA - Cyclone II FPGA 8K LE, 256-FBGA | Intel
MPN: EP2C8F256CXNAA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $12.54 | $1,254.00 |
| 500 | $11.82 | $5,910.00 |
| 1,000 | $11.05 | $11,050.00 |
EP2C8F256CXNAA Overview
A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit within the integrated circuit (IC) hierarchy alongside ASICs, microcontrollers, and DSPs. Cyclone II FPGAs specifically target cost-sensitive, high-volume applications and represent the second generation of Altera's low-cost FPGA family.
Key features of the EP2C8F256CXNAA include 8,256 logic elements at 90 nm process technology, 36 M4K RAM blocks (4,608 bits each) totaling 162 Kbits, 18 dedicated 18x18 hardware multipliers for DSP operations, and 4 PLLs for clock management. The device supports configuration via active serial (AS), passive serial (PS), and JTAG modes, with 0 Kbits of on-chip user flash memory. Its 256-ball FBGA package uses a 1.0 mm ball pitch and is RoHS compliant.
Architecturally, Cyclone II FPGAs use a lookup-table (LUT)-based logic fabric with embedded memory columns and multiplier blocks distributed across the die. The four PLLs support clock multiplication, division, phase shifting, and external clock output, enabling complex multi-clock domain designs. The 18x18 multipliers accelerate DSP functions such as FIR filters, FFTs, and video processing without consuming general-purpose logic resources.
Typical applications include digital signal processing, video processing pipelines, industrial control and factory automation, communications protocol bridging, motor control, and consumer electronics prototyping. The combination of low unit cost, moderate logic density, and integrated DSP blocks makes the EP2C8 ideal for glue logic replacement, custom peripheral interfacing, and parallel processing tasks. A specific use case is LED video wall controllers, where the 18 multipliers handle brightness/color scaling and the 162 Kbits of RAM buffer scan-line data.
When designing with this part, pay close attention to the four independent PLL blocks - they require dedicated power pins (VCCA_PLL) and ground isolation, and each PLL has a dedicated analog supply of 1.2V. The 256-FBGA package is a wirebond BGA with 1.0 mm pitch, requiring PCB design with microvia technology (not compatible with 6/6 mil standard 2-layer boards). Use Intel Quartus II for synthesis, place-and-route, and configuration file generation.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone II family, and practical design notes not found in the manufacturer datasheet alone. Engineers evaluating the EP2C8F256CXNAA for new designs should note that Cyclone II is a mature, end-of-life family, so long-term availability planning is essential.
Drop-in alternatives for EP2C8F256CXNAA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C8F256CXNAA (same form factor and footprint) — differing in Package, RoHS Status, Process Technology, Speed Grade, Operating Temperature.
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EP2C8F256C8N
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View Datasheet →EP2C8F256C7N
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$8.31 / Unit
View Datasheet →EP2C8F256C6N
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$31.2 / Unit
View Datasheet →EP2C8F256CXN
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$15.2 / Unit
View Datasheet →EP2C8F256C8
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$28.4 / Unit
View Datasheet →EP2C8F256C7
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$18.2 / Unit
View Datasheet →EP2C8F256CXNAA Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 8,256 |
| Embedded Memory (M4K blocks) | 36 blocks (162 Kbits total) |
| Embedded 18x18 Multipliers | 18 |
| PLLs | 4 |
| Maximum User I/O Pins | 182 |
| User Flash Memory | 0 Kbits |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.15 V to 1.25 V |
| I/O Standards | LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) |
| Package | 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| Operating Temperature (Industrial) | -40C to +85C (N suffix) |
| RoHS Compliance | Yes (lead-free) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
EP2C8F256CXNAA 256-ball fineline bga (f256), 1.0 mm pitch, 17x17 mm Pin Configuration Guide
Pin configuration for EP2C8F256CXNAA (256-ball fineline bga (f256), 1.0 mm pitch, 17x17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C8F256CXNAA.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C8F256CXNAA is suitable for 6 applications: Industrial Motor Control, Digital Signal Processing (DSP) / FIR Filter, Video Processing / LED Video Wall Controller, Industrial Communication Protocol Bridge, Custom Peripheral Glue Logic Replacement, Educational / Development Board Platform.
Industrial Motor Control
The EP2C8F256CXNAA is a strong fit for industrial motor control applications, where its 18 dedicated 18x18 hardware multipliers and 8,256 logic elements support field-oriented control (FOC) algorithms for three-phase PMSM and BLDC motors. The 4 PLLs generate multiple clock domains for PWM generation (typically 10-20 kHz), ADC sampling (1-2 MSPS), and encoder feedback. With 182 user I/O pins, the FPGA can interface simultaneously with multi-axis encoders, current-sense ADCs, gate drivers, and communication peripherals such as RS-485 or CAN. The 36 M4K RAM blocks (162 Kbits) provide ample buffer for sine tables, ramp data, and PID state without external memory. For three-axis servo control, the EP2C8 sits between a Cortex-M host MCU (which handles HMI) and the power-stage gate drivers (powered by dedicated IGBT or SiC gate drivers). Engineers should note that Cyclone II is NRND, so the migration path is Cyclone IV E (EP4CE8) or Cyclone 10 LP for new motor-control designs.
Recommended
Digital Signal Processing (DSP) / FIR Filter
The EP2C8F256CXNAA's 18 dedicated 18x18 multipliers operate at up to 250 MHz, enabling real-time FIR filtering of 18 multiply-accumulate operations per clock cycle. For an audio-rate FIR filter at 48 kHz with 64 taps, the FPGA uses 2 multipliers and finishes in microseconds with massive headroom for additional processing. Compared to a software FIR running on a microcontroller, the FPGA delivers deterministic latency, freeing the host CPU for other tasks. The 36 M4K RAM blocks (162 Kbits total) hold coefficient tables and circular delay-line samples on-chip, eliminating the need for external SRAM in most audio and control applications. In a typical deployment, the EP2C8 sits between an ADC (e.g., 16-bit at 1 MSPS) and a DAC, performing decimation/interpolation and filtering at the system rate. The 4 PLLs derive the ADC and DAC clocks from a single reference. Engineers should be aware that the 0 Kbits of user flash memory means configuration must be loaded from an external EPCS serial flash at every power-up.
Recommended
Video Processing / LED Video Wall Controller
The EP2C8F256CXNAA's combination of 18 hardware multipliers and 36 M4K RAM blocks makes it well suited for entry-level video processing applications such as LED video wall scan-line conversion, color-space conversion (YUV to RGB), and basic image scaling. The 182 user I/O pins can drive a 16-bit parallel RGB interface at up to 80 MHz pixel clock, supporting resolutions up to 1024x768 at 60 Hz. The 8,256 logic elements handle the address generator and timing control for up to 32 scan lines, while the 162 Kbits of RAM buffer two full scan lines of data. In a typical LED video wall controller, the EP2C8 receives a DVI or HDMI input (decoded externally by a TFP401 receiver), performs gamma correction and brightness scaling in real time, and outputs a multi-port parallel data stream to the LED driver chips. A 3-channel configuration (per color) reduces per-port speed requirements. The 4 PLLs derive independent pixel clocks for input and output. For new designs, Cyclone 10 LP or Cyclone IV E provide modern alternatives with more RAM.
Recommended
Industrial Communication Protocol Bridge
The EP2C8F256CXNAA is well matched to industrial communication protocol bridging applications, where its 8,256 logic elements, 162 Kbits of RAM, and 182 user I/O pins can implement a multi-protocol gateway on a single chip. Typical use cases include bridging between RS-485 Modbus RTU, CAN 2.0B, SPI, I2C, and Ethernet, with the FPGA performing protocol conversion, frame parsing, and message queuing in hardware. The 4 PLLs generate independent baud-rate clocks for each protocol domain, eliminating the need for separate oscillator circuits. The 36 M4K RAM blocks serve as FIFO buffers for asynchronous protocol conversion. In a typical deployment, the EP2C8 sits between a sensor network (multi-drop RS-485) and an industrial Ethernet backbone, providing deterministic, low-latency message routing. The 0 Kbits of user flash memory means the configuration must load from a serial flash at power-up. Engineers should note that Cyclone II is NRND; new designs should use Cyclone IV E or Cyclone 10 LP with software-compatible migration.
Recommended
Custom Peripheral Glue Logic Replacement
The EP2C8F256CXNAA excels at replacing multiple discrete glue-logic ICs (CPLDs, bus transceivers, FIFOs, address decoders, custom state machines) with a single programmable device. The 8,256 logic elements can replace 10-20 standard 74-series logic packages, reducing PCB area, BOM count, and inventory complexity. The 36 M4K blocks provide up to 36 independent FIFO or dual-port RAM buffers, eliminating the need for external IDT7200-series FIFOs in many cases. The 182 user I/O pins support wide parallel buses (up to 64-bit) and multiple serial interfaces simultaneously. In a typical glue-logic replacement design, the EP2C8 implements a custom ASIC's external companion logic, a system controller, an address decoder, and multiple bus arbiters. The 4 PLLs generate system clocks and per-bus clocks. The 0 Kbits of user flash memory means configuration loads from EPCS serial flash. For new designs, Cyclone 10 LP (10CL008) provides a software-compatible successor with lower power.
Recommended
Educational / Development Board Platform
The EP2C8F256CXNAA is widely used in university courses, hobbyist dev boards, and FPGA training platforms due to its low cost (around USD 12 at 100-piece quantity), well-documented Cyclone II architecture, and free Quartus II Web Edition design software. A typical educational board exposes a 50 MHz clock, pushbuttons, switches, 7-segment displays, VGA output, PS/2 keyboard, audio CODEC, and SRAM to the 182 user I/O pins. Students can implement CPU cores (NIOS II soft processor), state machines, communication protocols, and DSP functions in a hands-on learning environment. The 8,256 logic elements support RISC-V soft cores up to 32-bit, and the 162 Kbits of RAM is sufficient for small operating systems and frame buffers. The 18 multipliers enable real-time DSP lessons. The 4 PLLs teach clock management fundamentals. The 0 Kbits of user flash means every power-cycle loads a new configuration from the PC or serial flash. For new educational designs, the Cyclone 10 LP 10CL006 or Cyclone IV EP4CE6 are the recommended modern alternatives.
Recommended
Recommended Products Summary
Engineering reference data for EP2C8F256CXNAA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C8F256C8N | EP2C8F256C7N | EP2C8F256C6N | EP2C8F256CXN | EP2C8F256C8 | EP2C8F256C7 |
|---|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (F256) | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 |
| Speed Grade | C8 (slowest) | C8 | C7 (faster) | C6 (fastest) | C8 (CX variant) | C8 | C7 |
| Embedded RAM (Kbits) | 162 | 162 | 162 | 162 | 162 | 162 | 162 |
| Embedded 18x18 Multipliers | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| RoHS Compliant | Yes (lead-free) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Lead-free / RoHS A-grade material set (vs EP2C8F256C8N)
- Same die, more speed grade options available (vs EP2C8F256C6N (faster speed grade))
- Lowest cost 8K-LE Cyclone II in F256 package (vs EP2C20F256C8N (2x LEs, ~30% higher cost))
Design Notes
The 256-ball FineLine BGA uses a 1.0 mm ball pitch, which is at the limit of standard 4-layer PCB manufacturing (6/6 mil trace/space). For new designs, use 0.8 mm pitch or microvia stack-up technology (laser-drilled vias) to improve yield. The BGA requires 4-6 ground balls in the center thermal array to be soldered to a continuous ground pour on the top layer for thermal dissipation. Per Intel Cyclone II Device Handbook (CII51001), the maximum junction temperature is 125C; with a typical 17x17 mm FBGA, theta_JA is approximately 18 C/W on a JEDEC 4-layer test board, allowing up to 4-5W of internal dissipation. Always include a keepout zone of at least 5 mm around the BGA for escape routing, and use via-in-pad with filled-and-plated-over vias for high-speed signals. Do not route high-speed signals (DDR, parallel video) under the BGA's power balls; route them on inner layers with continuous reference planes.
Estimated: the EP2C8F256CXNAA requires four separate power rails. VCCINT (core) is 1.15-1.25V at up to 600 mA typical and 1.2A peak during configuration. VCCIO for each of the 4 banks is independently 3.3V, 2.5V, 1.8V, or 1.5V, totaling 50-200 mA per bank. VCCA_PLL (4 analog supplies for the PLLs) is 1.2V at 30-50 mA each, requiring a ferrite-bead-isolated supply with 10 uF + 0.1 uF decoupling. A common mistake is to share VCCINT and VCCA_PLL directly - this introduces noise on the PLL supplies and degrades jitter. Recommended: route VCCA_PLL from VCCINT through a 10-ohm ferrite bead to provide isolation. Use a power-sequencer (e.g., TPS3808) to ensure VCCIO is stable before VCCINT ramps, otherwise the I/O buffers can back-power the core through ESD diodes. Include a 4.7 uF bulk capacitor on each VCCIO bank and a 0.1 uF + 0.01 uF pair on every ball group of 4-8 balls.
Common pitfalls with the EP2C8F256CXNAA include: (1) Configuration mode pin (MSEL) must be tied to VCCIO or GND via 1k resistor - leaving them floating causes intermittent configuration failures. The MSEL[2:0] settings are: 000=AS, 001=PS, 010 or 011=JTAG-based. (2) The nCE (chip enable) must be tied to GND for single-FPGA configurations, and to the previous device's nCEO in multi-FPGA chains. (3) DCLK (configuration clock) must not exceed 40 MHz in AS mode or 133 MHz in PS mode. (4) The CONF_DONE pin is open-drain and requires a 10k pull-up to VCCIO bank 1. (5) Leave JTAG pins (TCK, TMS, TDI, TDO) accessible for in-system programming - the JTAG chain must be 4-wire (or 5-wire with TRST not used in Cyclone II). (6) The 0 Kbits of user flash means you cannot store bitstream key or NIOS II boot code in the FPGA - use an external EPCS serial flash (EPCS4, EPCS16, or EPCS64) for configuration storage. (7) Cyclone II is NRND - do not design into new products without a migration plan to Cyclone IV E or Cyclone 10 LP.
For 50-100 MHz DDR-style interfaces, the Cyclone II requires matched-length traces within +/- 50 ps. The I/O banks are organized as 4 groups (banks 1-4), each with its own VCCIO. Place each interface (e.g., 16-bit SRAM) in a single bank to keep reference voltages and impedance matched. The 256-FBGA has 16 banks of 16 balls per side; the bank pinout is documented in the Cyclone II pin tables. For high-speed LVDS inputs, route on inner stripline layers with 100-ohm differential impedance and maintain 2W (2x dielectric thickness) spacing from other signals. The PLL analog supply (VCCA_PLL) balls are interleaved with the PLL clock output balls; place the ferrite bead and decoupling capacitors within 100 mils of the BGA. JTAG chain signals should be daisy-chained with 22-ohm source termination at each device. The nCONFIG, nSTATUS, and CONF_DONE signals should be treated as asynchronous and bypassed with 0.1 uF capacitors near the BGA.
Compliance Information
RoHS compliant per Cyclone II Device Handbook. The 'A' suffix in CXNAA indicates lead-free materials. Not AEC-Q100 qualified (industrial / commercial grade only). For automotive applications, use Cyclone IV E (EP4CE) or newer AEC-Q100-qualified families.
