EP2C8F256I8N vs EP2C8F256C6 Comparison
Detailed side-by-side comparison of EP2C8F256I8N by Intel and EP2C8F256C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2C8F256I8N | EP2C8F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.95 | $8.10 |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | β |
| Embedded Memory Bits | 165,888 bits | β |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | β |
| User I/O Pins | 182 | β |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | 516 |
| Embedded 18x18 Multipliers | Up to 36 | β |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | β |
| Core Supply Voltage | 1.2 V | β |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | β |
| Process Technology | 90 nm CMOS (SRAM-based) | β |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | β |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | β |
| RoHS Status | Compliant (Pb-free, lead-free reflow compatible) | [DATA_NEEDED: rohs status] |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Manufacturer | β | Intel (formerly Altera) |
| Logic Elements | β | 8,256 |
| Number of I/O | β | 182 |
| Number of Logic Elements/Cells | β | 8256 |
| Embedded Multipliers | β | 36 (18x18) |
| Package | β | 256-LBGA (FBGA) |
| Package Pin/Pin Count | β | 256 |
| Process Node | β | 90 nm |
| Supply Voltage | β | 1.15 V to 3.3 V (bank-dependent) |
| Configuration Mode | β | AS / PS / JTAG |
| MSL Level | β | [DATA_NEEDED: MSL level] |