EP2C8F256C6 - Cyclone II FPGA 8K LE 256-FBGA | Intel / Altera
MPN: EP2C8F256C6 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.66 | $16.66 |
| 10 | $14.2 | $142.00 |
| 100 | $11.5 | $1,150.00 |
| 500 | $9.4 | $4,700.00 |
| 1,000 | $8.1 | $8,100.00 |
EP2C8F256C6 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions through a sea of configurable logic blocks, embedded memory, and routing resources that are post-fabrication programmed via an SRAM configuration bitstream. FPGAs sit between fixed-function ASICs (high NRE, low unit cost) and discrete logic (flexible but bulky), and within the broader semiconductor taxonomy they belong to programmable logic devices (PLDs) within the digital logic IC category. Cyclone II specifically targets the low-power, low-cost segment where FPGAs previously could not compete with microcontrollers or DSPs on price.
Key features of the EP2C8F256C6 include 8,256 logic elements, 36 embedded 18x18 multipliers (typical), 165,888 RAM bits organized into M4K memory blocks, 182 user I/O pins distributed across multiple I/O banks, 4 phase-locked loops (PLLs) for clock management, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and configuration via active serial (AS), passive serial (PS), or JTAG interfaces. The 256-FBGA package offers a compact 17x17 mm footprint suitable for space-constrained board layouts.
The Cyclone II architecture separates logic into Logic Array Blocks (LABs) of 16 logic elements each, with a 4-input look-up table (LUT), carry chain, and register per logic element. The embedded M4K memory blocks can be configured as SRAM, ROM, or FIFO, while the embedded multipliers accelerate DSP functions such as FIR filters without consuming general-purpose logic.
Typical applications for the EP2C8F256C6 include industrial motor control, video processing and display bridging, low-cost DSP co-processing, glue logic replacement, communications protocol bridging (UART, SPI, I2C, PCIe soft cores), and educational/development platforms. The combination of moderate logic density, embedded multipliers, and abundant I/O makes it well suited to mid-complexity designs where a microcontroller lacks throughput but a high-end FPGA is over-spec and over-budget.
When designing with this device, ensure that configuration mode (AS/PS/JTAG) is selected to match your system's boot topology, and verify I/O bank voltage compatibility for mixed-voltage interfaces. The 256-FBGA package requires a 1.0 mm or finer pitch PCB land pattern and reflow profile compliant with JEDEC J-STD-020 moisture sensitivity level handling.
Drop-in alternatives for EP2C8F256C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C8F256C6 (same form factor and footprint) — differing in Package, RoHS Status, Speed Grade, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C8F256C6N
✅ Drop-In✓ In Stock
$31.2 / Unit
View Datasheet →EP2C8F256C7
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$18.2 / Unit
View Datasheet →EP2C8F256C8
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$28.4 / Unit
View Datasheet →EP2C8F256C8N
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Contact for price
View Datasheet →EP2C8F256I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2C8F256I8N
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$21.95 / Unit
View Datasheet →EP2C8AF256A7N
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$41.5 / Unit
View Datasheet →EP2C8AF256I8N
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$21.4 / Unit
View Datasheet →EP2C8F256C6 Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 8,256 |
| Total RAM Bits | 165,888 |
| Number of I/O | 182 |
| Number of LABs/CLBs | 516 |
| Number of Logic Elements/Cells | 8256 |
| Embedded Multipliers | 36 (18x18) |
| PLLs | 4 |
| Package | 256-LBGA (FBGA) |
| Package Pin/Pin Count | 256 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Process Node | 90 nm |
| Supply Voltage | 1.15 V to 3.3 V (bank-dependent) |
| Configuration Mode | AS / PS / JTAG |
EP2C8F256C6 256 Pin Configuration Guide
Pin configuration for EP2C8F256C6 (256 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C8F256C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C8F256C6 is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Bridging, DSP Co-Processing, Communications Protocol Bridging, Glue Logic Replacement, Educational and Development Platforms.
Industrial Motor Control
The EP2C8F256C6's 8,256 logic elements, 36 embedded 18x18 multipliers, and 182 user I/O pins make it an excellent fit for industrial motor control platforms where multiple PWM generators, encoder interfaces, and current/voltage sampling loops must execute in deterministic hardware. Its 90 nm low-power Cyclone II architecture delivers high Fmax on multiply-accumulate paths at low dynamic power, enabling field-oriented control (FOC) loops at 20-50 kHz switching frequencies. Compared with running motor control on a microcontroller, the FPGA offers deterministic latency, parallel execution of multiple control loops, and hardware-accelerated space-vector modulation. The 256-FBGA package provides adequate I/O density for multi-axis drives with Hall/quadrature encoder and resolver inputs.
Recommended
Video Processing and Display Bridging
With 165,888 embedded RAM bits organized into M4K blocks and 182 user I/O pins supporting LVDS pairs, the EP2C8F256C6 is widely deployed as a video format converter or display bridge between cameras, sensors, and TFT/LCD panels. The M4K memory blocks implement line buffers and frame buffers efficiently, while embedded multipliers accelerate color-space conversion and scaling. The Cyclone II architecture supports LVDS at hundreds of MHz, which is sufficient for parallel RGB, BT.656, and CSI-2 deserialization bridges. Compared with a dedicated bridge ASIC, the FPGA gives flexibility to support multiple input/output formats in a single BOM and supports custom gamma curves or color correction that ASICs cannot.
Recommended
DSP Co-Processing
The EP2C8F256C6 integrates 36 embedded 18x18 multipliers and abundant M4K memory, providing a low-cost DSP co-processor for FIR filters, FFT engines, and arbitrary transform kernels that would otherwise starve a microcontroller of MIPS. The Cyclone II multiplier blocks deliver 250+ MHz performance, enabling multi-tap FIR filters at audio sample rates and small FFTs at kilohertz block rates. In typical co-processing topologies the FPGA offloads inner-loop arithmetic while a host MCU or DSP handles sequencing and I/O. Designers gain a hardware-accelerated DSP path without the cost of a dedicated DSP chip and with the flexibility to re-target the multipliers as algorithms evolve.
Recommended
Communications Protocol Bridging
The EP2C8F256C6 excels at converting between serial communication protocols such as UART, SPI, I2C, CAN, USB soft-core, PCIe soft-core, and Ethernet MAC, providing a single chip that replaces several bus-converter ICs. With 182 user I/O pins and flexible I/O standards including LVTTL and LVCMOS, the FPGA can simultaneously drive multiple bus voltages. The 8K logic elements comfortably fit multi-channel bridge cores with FIFO buffering implemented in M4K blocks. Compared with a discrete bridge IC, the Cyclone II allows firmware-reprogrammable protocol mapping and field-upgradeable protocol support, which is valuable for industrial gateways and protocol translators.
Recommended
Glue Logic Replacement
The EP2C8F256C6 is a cost-effective drop-in for legacy discrete glue logic boards that contain dozens of 74-series TTL chips, address decoders, bus arbiters, and custom state machines. Designers port the discrete schematic to VHDL or Verilog, capture the design in Quartus II, and consolidate the entire board onto a single 256-FBGA package. The FPGA reduces PCB real-estate, eliminates trace-by-trace ECO cycles, and provides a programmable platform for late-stage design changes. Compared with re-spinning the board as an ASIC, the Cyclone II NRE is essentially zero and unit cost is acceptable for low-to-mid volume production.
Recommended
Educational and Development Platforms
The EP2C8F256C6's combination of moderate logic capacity, abundant I/O, and low price point makes it a popular choice for university FPGA courses and open-source development boards such as the Altera DE2 board. Students learn HDL design, finite state machines, CPU soft-cores such as Nios II, and embedded systems on a device with enough headroom for non-trivial lab projects. The Quartus II toolchain is free for Cyclone II development, and JTAG programming is built into the device. Compared with cutting-edge FPGAs, the EP2C8F256C6 offers the same fundamental programmable-logic teaching value at a fraction of the cost, making it ideal for large classroom lab deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP2C8F256C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C8F256C6N | EP2C8F256C8N | EP2C8F256I8N | EP2C8AF256A7N |
|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 |
| Speed Grade | -6 (commercial) | -6 (commercial) | -8 (faster) | -8 (industrial temp) | -7 (automotive) |
| Temperature Grade | Commercial 0C to 85C | Commercial 0C to 85C | Commercial 0C to 85C | Industrial -40C to 100C | Automotive -40C to 125C |
| User I/O Pins | 182 | 182 | 182 | 182 | 182 |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Last Time Buy status with broad distributor inventory remains available (vs EP2C8F256I8N (industrial temperature variant))
- 8,256 logic elements with 36 embedded multipliers in a compact 256-FBGA (vs EP2C5F256C6 (5K LE alternative))
- Cost-optimized Cyclone II family member with mature Quartus II toolchain support (vs Higher-cost Cyclone IV (EP4CE) family)
Design Notes
The EP2C8F256C6 requires multiple supply rails: VCCINT (1.15V to 1.25V core), VCCIO (3.3V, 2.5V, 1.8V, 1.5V depending on bank I/O standard), and VCCA (2.5V PLL analog). Decouple each rail with 0.1 uF X7R ceramic capacitors placed as close as possible to each dedicated supply pin, and add a bulk 10-47 uF tantalum or polymer capacitor near the supply entry point. Estimated: at typical commercial junction temperatures and 50% toggle activity, the EP2C8 core draws 200-400 mA from VCCINT, so verify your regulator's continuous current rating with margin. Source: Cyclone II Handbook Power section.
The 256-FBGA package has a theta-JA of approximately 20-25 C/W with a standard 4-layer JEDEC PCB and adequate thermal via array under the package center. Estimated: at full utilization (high toggle rate, high utilization of embedded multipliers and M4K blocks) the device may dissipate 1.0-1.5 W, which yields a junction temperature rise of 25-40 C above ambient. For designs operating in enclosed industrial enclosures without airflow, follow Altera's thermal via recommendations and consider a small heatsink for hot spots. Source: Cyclone II Package Thermal Resistance document.
Use a minimum 4-layer PCB stack-up with continuous ground and power planes. Route all high-speed differential pairs (LVDS, clock) with 100 ohm differential impedance and matched lengths within the timing budget. Place the EPCS configuration memory as close to the FPGA's DCLK and DATA0 pins as possible, and route the nCONFIG, nSTATUS, and CONF_DONE signals to a pull-up resistor and a status LED for boot diagnostics. Verify the JTAG chain length and tap ordering before board fabrication. Source: Cyclone II Hardware Design Guidelines.
Do not mix I/O standards on the same I/O bank without verifying VCCIO compatibility; mixing LVTTL (3.3V) with LVDS (2.5V) on the same bank will damage output drivers. Ensure the configuration mode is selected correctly via MSEL pins at power-up; an incorrect MSEL setting will leave the FPGA unconfigured. Always verify that the JTAG chain includes the correct device ordering when chaining multiple FPGAs. Finally, when migrating from the EP2C8F256C6 to the lead-free EP2C8F256C6N, reflow profile must be RoHS-compliant (peak temperature 245-260 C). Source: Cyclone II Configuration and I/O Standards chapters.
Compliance Information
RoHS status is not explicitly stated in the Verified Web Data for the base EP2C8F256C6; the 'N' suffixed variants (e.g. EP2C8F256C6N, EP2C8F256C8N) are typically lead-free per Altera/Intel ordering information. AEC-Q100 is not applicable to the base part - choose EP2C8AF256A7N for automotive. Compliance values marked [DATA_NEEDED] in specs require datasheet verification.
