EP2S180F1508C4 vs EP2S180F1508C3 Comparison
Detailed side-by-side comparison of EP2S180F1508C4 by Intel and EP2S180F1508C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2S180F1508C4 | EP2S180F1508C3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Unknown |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Product Type | Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| Series | Stratix II | Stratix II |
| Logic Elements/Cells | 179,400 cells | β |
| Total RAM Bits | 9,383,040 bits | β |
| Number of I/O | 1,170 I/O | β |
| Supply Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm | β |
| Operating Frequency | 711.24 MHz | β |
| Supplier Device Package | 1508-FBGA (40 mm x 40 mm) | 1508-FBGA (30x30 mm) |
| Package / Case | 1508-BBGA, FCBGA | β |
| Terminal Count | 1,508 terminals | β |
| Terminal Form | Ball | Ball |
| Packaging | Tray | β |
| Time@Peak Reflow Temperature-Max | 30 s | β |
| Moisture Sensitivity Level | MSL 4 (72 hours) | β |
| Package Shape | Square | β |
| Configuration Technology | SRAM-based FPGA | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Logic Array Blocks | β | 8,970 LABs |
| Gate Count | β | 180,000 gates |
| User I/Os | β | 1,170 I/Os |
| Package | β | 1508-BBGA, FCBGA |
| Mounting Type | β | Surface Mount |
| Number of Terminals | β | 1,508 |
| Package Code | β | BGA |
| Logic Elements | β | [DATA_NEEDED: logic element count] |
| Embedded Memory | β | [DATA_NEEDED: embedded memory capacity] |
| Transceivers | β | [DATA_NEEDED: transceiver count and speed] |
| AEC-Q100 Qualification | β | [DATA_NEEDED: AEC-Q100 status] |