EP2S180F1508C3 - 180K Logic Elements FPGA | Altera | Embedded
MPN: EP2S180F1508C3 β End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2S180F1508C3 Overview
An FPGA is a programmable semiconductor whose logic cells, interconnects, and I/O blocks can be configured after manufacturing. In the system hierarchy, EP2S180F1508C3 is an FPGA, a programmable logic device, and an integrated circuit used for implementing digital hardware. Unlike a fixed-function application-specific integrated circuit, an FPGA can support changing protocols, parallel datapaths, control logic, and signal-processing architectures through configuration. Its high gate count and large I/O count make it suitable for complex communication, industrial, test, and embedded processing systems.
The device provides 8,970 logic array blocks, 1,170 I/Os, and a 1.2 V-class supply identified as 1.15 V to 1.25 V in the verified cross-reference data. The exact operating temperature grade, logic-element count, embedded-memory count, transceiver count, and package thermal data are not available in the supplied source snippets, so those values are intentionally marked as data-needed rather than inferred. The part is listed as a 1508-BBGA, FCBGA device with ball-grid-array mounting.
For system architecture, the FPGA can consolidate control-plane logic, data-path processing, interface adaptation, and state-machine functions. The 1,170-I/O capacity is particularly useful for systems that aggregate many parallel signals, while the 8,970 logic-array blocks provide a large programmable fabric for custom accelerators and protocol implementations. Designers must validate configuration, clocking, power sequencing, I/O standards, signal integrity, and thermal behavior against the complete manufacturer datasheet before release.
Typical applications include industrial automation controllers, communications equipment, test and measurement systems, image or video processing equipment, and high-end embedded digital platforms. The device is appropriate when design flexibility and interface density outweigh the power and development considerations associated with a very large FPGA. Its legacy Stratix II architecture also requires careful toolchain and lifecycle planning.
When designing with EP2S180F1508C3, confirm the exact ball map, supported configuration modes, clock constraints, I/O electrical limits, and recommended decoupling network in the manufacturer documentation. The verified sources provide package and capacity information but do not provide complete electrical limits or a complete pin assignment, so the pinout remains data-needed. Pricing and availability should be confirmed with the distributor at the time of purchase.
This product page combines verified distributor specifications, package and capacity details, sourcing links, and carefully separated data-needed fields to help engineers distinguish confirmed facts from parameters that require manufacturer-datasheet verification.
Drop-in alternatives for EP2S180F1508C3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S180F1508C3 (same form factor and footprint) β differing in Package, Logic Elements, Speed Grade, DSP Blocks, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S180F1508C4N
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View Datasheet βEP2S180F1508C4
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View Datasheet βEP2S180F1020C3
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View Datasheet βEP2S130GF1508C3N
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View Datasheet βEP2S180F1508C3 Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Stratix II |
| Logic Array Blocks | 8,970 LABs |
| Gate Count | 180,000 gates |
| User I/Os | 1,170 I/Os |
| Supply Voltage | 1.15 V to 1.25 V |
| Package | 1508-BBGA, FCBGA |
| Supplier Device Package | 1508-FBGA (30x30 mm) |
| Mounting Type | Surface Mount |
| Terminal Form | Ball |
| Number of Terminals | 1,508 |
| Package Code | BGA |
EP2S180F1508C3 bga Pin Configuration Guide
Pin configuration for EP2S180F1508C3 (bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S180F1508C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S180F1508C3 is suitable for 6 applications: Industrial Automation Controller, Communications Equipment, Test and Measurement Instrument, Video and Image Processing Platform, Aerospace and Defense Digital System, Legacy Embedded Processing Platform.
Industrial Automation Controller
EP2S180F1508C3 fits industrial automation controllers that require extensive programmable logic and a high number of external interfaces. Its confirmed 8,970 logic array blocks can support motor-control state machines, sequencing logic, safety-related control partitions, and multiple communication bridges on one programmable device. The 1,170-I/O count helps aggregate sensor inputs, actuator controls, encoder signals, and fieldbus interfaces without requiring many smaller logic devices. Its 1,508-ball FCBGA package provides high-density interconnect for complex backplanes, but PCB escape routing and controlled-impedance layout are critical. The supplied data confirms a 1.15 V to 1.25 V supply range and a 30 mm by 30 mm supplier-device package format. Operating-temperature grade, industrial qualification, power dissipation, and complete I/O limits are not provided here. Engineers should therefore validate the exact ordering-code environment, thermal design, configuration interface, and supported I/O standards in the official manufacturer datasheet before production release.
Recommended
Communications Equipment
EP2S180F1508C3 is suitable for communications equipment that needs parallel processing, packet handling, protocol conversion, and many low- to high-speed digital interfaces. The confirmed 8,970 logic array blocks provide capacity for traffic managers, framing logic, statistics counters, and protocol-specific datapaths, while 1,170 I/Os support multiple physical interfaces and backplane connections. The FPGA can be used to combine functions that otherwise require separate glue logic, controllers, and interface devices. Because the supplied data does not confirm transceiver count, supported I/O standards, maximum clock rate, or timing specifications, designers must not assume a particular line rate or interface capability. The 1,508-ball FCBGA package also demands careful power distribution and signal-integrity planning. Use the official device documentation to verify differential-I/O support, clocking resources, configuration flow, termination requirements, and timing constraints. The result is best suited to systems where programmable flexibility and interface density are more important than the lowest possible power consumption.
Recommended
Test and Measurement Instrument
EP2S180F1508C3 can serve as the central programmable logic device in test and measurement equipment where acquisition, timing, control, and data formatting must operate together. The confirmed 8,970 logic array blocks support instrument sequencing, trigger processing, buffer management, waveform analysis, and custom test algorithms. The 1,170-I/O count is useful for connecting converters, switches, measurement front ends, display or control interfaces, and high-density test connectors. The FPGA's programmable fabric allows the instrument platform to support different measurement modes or customer configurations without changing the printed circuit board. However, the supplied source data does not provide logic-element count, embedded-memory capacity, timing limits, thermal resistance, or converter-interface specifications. Those values must be obtained from the complete manufacturer datasheet. The 1,508-ball package also requires careful fanout, decoupling, clock distribution, and signal-integrity review. EP2S180F1508C3 is therefore most appropriate when measurement flexibility and logic capacity are primary requirements and the design team can complete device-level timing and power validation.
Recommended
Video and Image Processing Platform
EP2S180F1508C3 fits image and video processing platforms that need parallel pixel manipulation, frame buffering control, format conversion, and high-bandwidth interface aggregation. The confirmed 8,970 logic array blocks can implement pipelines, filters, synchronization logic, overlays, and format conversion, while the 1,170-I/O count supports multiple image sensors, displays, memory interfaces, and control paths. Its programmable architecture allows the processing chain to be adapted to different resolutions, frame rates, or customer-specific image formats. The supplied data does not confirm embedded memory, multiplier count, maximum clock frequency, transceiver support, or exact I/O electrical characteristics, so those capabilities must not be assumed. Designers should use the official datasheet to verify the available memory blocks, DSP resources, clock networks, I/O standards, and power requirements. The large 1508-ball FCBGA package is appropriate for a high-density processing board, but it requires a multilayer PCB, short escape routes, continuous reference planes, and thorough signal-integrity simulation. Choose this device when algorithmic flexibility and interface density outweigh the development cost of a high-capacity FPGA.
Recommended
Aerospace and Defense Digital System
EP2S180F1508C3 may be considered for aerospace and defense digital systems that require a large programmable fabric, extensive I/O, and the ability to consolidate multiple processing functions. The confirmed 8,970 logic array blocks can support sensor aggregation, command and telemetry processing, control logic, encryption or protocol functions, and redundant signal paths. The 1,170-I/O count is useful for high-density digital interfaces across sensors, converters, communication modules, and backplanes. The supplied data does not state the temperature grade, radiation tolerance, qualification status, reliability program, or supported security features, so the part cannot be qualified for aerospace or defense use from these snippets alone. The complete manufacturer documentation and applicable system qualification evidence are mandatory. The 1,508-ball FCBGA package also presents significant board-level challenges, including controlled impedance, power integrity, thermal management, and ball-map verification. Treat EP2S180F1508C3 as a candidate for legacy or already-qualified designs, not as an automatically qualified modern safety-critical component. Confirm configuration security, errata, environmental limits, and lifecycle availability before selection.
Recommended
Legacy Embedded Processing Platform
EP2S180F1508C3 is appropriate for legacy embedded platforms that need a large amount of configurable logic and high I/O availability. The device's 8,970 logic array blocks can integrate custom processors, peripheral controllers, memory-interface glue, data formatting, and real-time control. Its 1,170 I/Os can support many board-level devices and parallel buses, while the 1,508-ball FCBGA package enables a high-density design. The supplied data confirms a 1.15 V to 1.25 V supply range and 1508-FBGA, 30 mm by 30 mm supplier-device format, but it does not confirm logic-element count, embedded memory, DSP blocks, transceiver count, or operating temperature. Those missing values should be obtained from the manufacturer datasheet before coding or PCB design. Because the part belongs to the Stratix II family, the design team should also verify the available synthesis, place-and-route, simulation, programming, and configuration tools. The best fit is an established platform that already has validated tool flow, firmware, board constraints, and long-term sourcing strategy. For new high-speed or low-power designs, compare current-generation alternatives rather than assuming the legacy FPGA is the lowest-risk choice.
Recommended
Recommended Products Summary
Engineering reference data for EP2S180F1508C3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S180F1508C4N | EP2S180F1508C4 | EP2S130GF1508C3N |
|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 1508-BBGA, FCBGA | 1508-FBGA | 1508-FBGA | 1508-FBGA |
| Device Class | Stratix II EP2S180 | Stratix II EP2S180 | Stratix II EP2S180 | Stratix II EP2S130 |
| Ordering-Code Compatibility | Reference part | Related C4N code; drop-in equivalence not verified | Related C4 code; drop-in equivalence not verified | Different device class; drop-in equivalence not verified |
| Distributor Listing | Listed by DigiKey, Mouser, and Octopart | Listed in comparison search results | Listed in comparison search results | Listed in internal MPN inventory |
Key Differentiators
- Confirmed logic-array capacity (vs EP2S130GF1508C3N)
- High I/O density (vs EP2S180F1508C4N)
- Large high-density package (vs EP2S180F1020C3)
Design Notes
The verified data lists a 1.15 V to 1.25 V supply range, but it does not provide current limits, power-on sequencing, or recommended decoupling values. Before layout release, obtain the official datasheet and create a power-distribution network with local low-impedance decoupling at every applicable supply domain. Use the complete design utilization and clock activity to estimate power, then confirm the estimate against measured current. Keep high-current return paths away from sensitive clock and configuration regions. Do not treat the supply range as a substitute for the device's operating electrical table.
The 1,508-ball FCBGA package requires a controlled multilayer PCB with continuous reference planes and carefully planned escape routing. Place decoupling capacitors adjacent to the relevant power balls using the shortest possible return path, and follow the manufacturer ball-map symbols rather than an unverified online pin assignment. Maintain uniform via fields under the package where the land pattern permits, control impedance for high-speed interfaces, and verify stack-up tolerances before fabrication. Because the complete ball map is absent from the supplied snippets, the official package drawing and footprint are mandatory inputs.
EP2S180F1508C3 has a confirmed 1508-FBGA, 30 mm by 30 mm supplier-device format, but no verified thermal resistance or maximum power specification is supplied. Estimate heat dissipation from the final utilization, clock frequencies, I/O toggle rates, and configuration activity, then provide adequate copper spreading, thermal vias, and airflow as required. Start with a worst-case activity estimate rather than nominal utilization. Verify junction temperature and package temperature limits in the manufacturer documentation and use measured board data to refine the thermal model.
The 1,170-I/O interface capacity makes signal-integrity planning central to the design. The supplied sources do not list supported I/O standards, maximum toggle rates, differential-pair limits, or timing numbers, so no high-speed electrical conclusion should be drawn from the I/O count alone. Classify interfaces by direction, speed, termination, and voltage domain; route clock and differential pairs over a continuous reference plane; and use manufacturer-recommended termination and via transitions. Perform pre-layout constraints and post-layout extraction for clocks, memory interfaces, and high fanout control signals.
Do not substitute a similarly numbered FPGA based only on the package family or gate-count class. The supplied cross-reference data shows related 1508-FBGA parts, but it does not prove identical ball maps, speed grades, configuration behavior, electrical limits, or tool compatibility. Review the exact ordering code, datasheet ordering information, errata, temperature designation, and supported configuration interface. Confirm the configuration-memory requirements and legacy toolchain availability before board fabrication, and preserve the exact target part as the baseline until equivalence has been demonstrated.
Compliance Information
The supplied web data does not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 declarations. AEC-Q100 is marked not_applicable for the generic product category statement, but no automotive qualification claim is made. Verify compliance directly with the manufacturer or authorized distributor.
