EP2S180F1508C4 - 179,400-Cell Stratix II FPGA | Intel
MPN: EP2S180F1508C4 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9072.9971 | $9,073.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2S180F1508C4 Overview
An FPGA is a semiconductor integrated circuit whose logic function is defined through programmable configuration rather than fixed interconnect. Unlike a general-purpose processor that executes software instructions, an FPGA can implement parallel datapaths, state machines, interface bridges, and digital-signal-processing functions in configurable hardware. Within an electronic system, an FPGA sits between fixed-function controllers or processors and high-speed peripheral circuitry, providing reconfigurable timing, protocol, and data-processing resources.
The EP2S180F1508C4's primary differentiating resources are its 179,400 logic cells, 9,383,040 RAM bits, and 1,170 I/O pins. The high cell count supports large logic networks, while the embedded memory supports buffering, lookup tables, packet storage, and other data-retention functions. Its 1,170 I/O resources are significant for designs that must connect numerous buses, memory interfaces, control signals, or high-speed parallel links. A published operating-frequency value of 711.24 MHz is available for this family search result, but designers should verify the relevant speed-grade timing conditions before using it as a system-level guarantee.
Stratix II devices use SRAM-based FPGA technology and a 90 nm process, according to the supplied FPGAkey result. The architecture supports hardware parallelism and configuration-defined I/O behavior, which can shorten development cycles for algorithms that map efficiently into combinational and pipelined logic. Because the device is SRAM-based, the system must define how configuration data is loaded and retained during operation, including any applicable configuration memory, controller, boot process, and recovery strategy.
Typical applications include high-throughput communications equipment, industrial inspection and automation systems, and complex test or measurement platforms. In communications equipment, the FPGA can implement protocol conversion, packet processing, and interface aggregation. In industrial systems, it can coordinate multiple sensors, motion-control channels, and machine-vision data streams. In instrumentation, it can provide deterministic capture, trigger, formatting, and transport logic. These applications benefit from parallel processing and the device's large I/O count, although exact memory, clock, transceiver, signaling, and power requirements must be confirmed from the manufacturer datasheet before design freeze.
A key design consideration is that EP2S180F1508C4 is a high-pin-count BGA device, not a simple through-hole or small surface-mount FPGA. PCB planning must accommodate the 40 mm by 40 mm package, controlled impedance for high-speed signals, adequate power distribution, and verified BGA assembly capability. Firmware and board design teams should also confirm configuration support, available development tools, pin assignments, and migration implications before selecting a replacement.
This page combines the supplied manufacturer and distributor information with package-aware drop-in references, application context, and explicit markers for unverified electrical details. The result is a practical engineering summary for sourcing, feasibility review, and legacy-system maintenance without presenting missing specifications as confirmed facts.
Drop-in alternatives for EP2S180F1508C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S180F1508C4 (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, Logic Elements, Supplier Device Package.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S180F1508C4N
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$985 / Unit
View Datasheet βEP2S180F1508I4N
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$445 / Unit
View Datasheet βEP2S180F1508C3
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View Datasheet βEP2S180F1508C3N
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$1200 / Unit
View Datasheet βEP2S180F1508C3NAA
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$285 / Unit
View Datasheet βEP2S180F1508C4 Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Stratix II |
| Logic Elements/Cells | 179,400 cells |
| Total RAM Bits | 9,383,040 bits |
| Number of I/O | 1,170 I/O |
| Supply Voltage | 1.15 V to 1.25 V |
| Process Technology | 90 nm |
| Operating Frequency | 711.24 MHz |
| Supplier Device Package | 1508-FBGA (40 mm x 40 mm) |
| Package / Case | 1508-BBGA, FCBGA |
| Terminal Count | 1,508 terminals |
| Terminal Form | Ball |
| Packaging | Tray |
| Time@Peak Reflow Temperature-Max | 30 s |
| Moisture Sensitivity Level | MSL 4 (72 hours) |
| Package Shape | Square |
| Configuration Technology | SRAM-based FPGA |
EP2S180F1508C4 square Pin Configuration Guide
Pin configuration for EP2S180F1508C4 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S180F1508C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S180F1508C4 is suitable for 6 applications: Industrial Automation Controllers, Communications Protocol Equipment, Test and Measurement Platforms, Machine Vision Processing, Aerospace and Defense Data Handling, Legacy System Modernization.
Industrial Automation Controllers
EP2S180F1508C4 fits industrial automation controllers that need substantial parallel logic and many external connections. Its 179,400 logic cells can coordinate sensor aggregation, motion-control sequencing, safety-related state machines, and machine-vision preprocessing, while the 1,170 I/O lines can connect multiple encoders, actuators, field buses, and inter-board interfaces. The 9,383,040 bits of RAM provide local buffering for control samples, protocol frames, and diagnostic data. Place the FPGA between deterministic controllers, sensors, and high-speed data-conversion circuitry, using the 1.15 V to 1.25 V supply range only as the starting point for a complete power-tree design. The 1508-ball FC-FBGA package requires controlled escape routing and verified BGA assembly. Confirm industrial temperature grade, timing limits, I/O-bank voltages, and configuration behavior from the manufacturer datasheet before release.
Recommended
Communications Protocol Equipment
EP2S180F1508C4 can serve communications equipment requiring parallel protocol processing and interface aggregation. The 179,400 logic cells support packet inspection, framing, header processing, error handling, and traffic-management state machines, while 9,383,040 RAM bits can buffer packets, descriptors, and lookup data. Its 1,170 I/O lines are useful when a chassis must connect several parallel data paths, management interfaces, or board-to-board links. The supplied 711.24 MHz value indicates the scale of the reported clocking information, but it must not be treated as a guaranteed line rate. Verify supported I/O standards, clocking resources, internal memory configurations, and any interface-specific timing in the manufacturer documentation. The 1508-ball FC-FBGA package also demands careful impedance control and power integrity. Design the FPGA as a configurable datapath engine between network PHY or switch devices and higher-level processing boards.
Recommended
Test and Measurement Platforms
EP2S180F1508C4 is a strong fit for test and measurement platforms that need deterministic capture, triggering, data formatting, and transport. The 179,400 logic cells can implement multiple channel-processing pipelines in parallel, and the 9,383,040 RAM bits can hold captured samples, histograms, correlation results, or temporary analysis buffers. The 1,170 I/O lines support simultaneous connection to converters, sensors, front-panel controls, and high-speed output interfaces. A 90 nm Stratix II process and reported 711.24 MHz operating-frequency value support substantial configurable processing capacity, but actual measurement bandwidth depends on I/O standards, clock architecture, placement, and timing closure. The 1.15 V to 1.25 V supply range must be translated into a carefully decoupled multi-rail design. Use controlled-impedance routing and verified BGA manufacturing because the 1508-ball package is the physical interface anchor. Confirm the exact device speed grade, supported I/O banks, and configuration method from the official datasheet.
Recommended
Machine Vision Processing
EP2S180F1508C4 suits machine-vision processing where pixel data, line triggers, and control signals must be processed with deterministic latency. The 179,400 logic cells can implement filtering, line buffering, defect detection, region-of-interest processing, and control of image-data streams. The 9,383,040 RAM bits support frame-line storage, temporary buffers, and lookup or correction data, while the 1,170 I/O lines can connect cameras, frame grabbers, sensors, encoders, and actuators. Its parallel FPGA architecture allows several operations to execute concurrently, unlike a sequential processor-only implementation. The supplied 1.15 V to 1.25 V supply range identifies the core supply range but does not replace a full power and thermal analysis. The 1508-ball FC-FBGA package requires high-density PCB routing and controlled impedance for high-speed image links. Verify the actual supported I/O standards, clock rates, memory bandwidth, and industrial temperature requirements before selecting it for a camera or inspection system.
Recommended
Aerospace and Defense Data Handling
EP2S180F1508C4 may be considered for aerospace and defense data-handling designs requiring configurable interfaces, deterministic processing, and high logic density. The 179,400 logic cells can support telemetry parsing, command validation, sensor fusion preprocessing, encryption-control sequencing, and multi-format data routing. The 9,383,040 RAM bits can hold telemetry buffers and protocol state information, while 1,170 I/O lines provide capacity for multiple sensors, memory devices, and communication interfaces. Parallel hardware execution is valuable when latency and deterministic timing matter, but the supplied data does not establish radiation tolerance, military temperature grade, or aerospace qualification. Treat those requirements as unverified and obtain the appropriate manufacturer documentation. The 1.15 V to 1.25 V supply range, 90 nm process, and 711.24 MHz reported value are useful starting facts, not application approvals. The 1508-ball FC-FBGA package also demands robust power integrity, controlled impedance, and qualified assembly. Confirm configuration, clocking, environmental, and reliability requirements before use.
Recommended
Legacy System Modernization
EP2S180F1508C4 is relevant to legacy system modernization when an existing board already uses a Stratix II FPGA and the objective is maintain, qualify, or source a replacement. Its 179,400 logic cells, 9,383,040 RAM bits, and 1,170 I/O lines preserve the scale of the original high-density programmable platform. The 1508-ball FC-FBGA package is particularly important: a replacement must match not only the device family but also the land pattern, ball map, I/O-bank allocation, power pins, and configuration connections. The supplied cross-reference data identifies EP2S180F1508C4N and EP2S180F1508I4N as candidates with comparable package and principal characteristics. Before redesign, compare bitstream support, speed grade, temperature classification, pinout, firmware, and toolchain compatibility. The listed $9,072.9971 unit price and variable stock status make sourcing planning important. Use a controlled qualification plan because package equivalence alone does not guarantee timing or functional equivalence. This is a maintenance strategy, not a recommendation for a new board without a complete design review.
Recommended
Recommended Products Summary
Engineering reference data for EP2S180F1508C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S180F1508C4N | EP2S180F1508I4N | EP2S180F1508C3 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1508-FBGA (40 mm x 40 mm) | 1508-FBGA (40 mm x 40 mm) | 1508-FBGA (40 mm x 40 mm) | 1508-FBGA (40 mm x 40 mm) |
Key Differentiators
- Large logic density (vs EP2C50F672C8N)
- Extensive embedded RAM (vs EP2S15F484C5N)
- Very large I/O interface (vs EP2S15F484C5N)
- Reported 90 nm Stratix II implementation (vs EP2C35F672C8N)
Design Notes
The verified data specifies a 1.15 V to 1.25 V supply range and identifies a 1.2 V nominal supply, but it does not provide current, power, or rail-by-rail requirements. Treat any power estimate as a preliminary design calculation and confirm the final core, I/O, auxiliary, and configuration rails in the manufacturer datasheet. Provide local decoupling at the appropriate supply balls, controlled power sequencing where required, and enough copper area to support the expected FPGA current. The 1,170 I/O lines and 179,400 logic cells make power integrity especially important because simultaneous switching can create supply noise and thermal load.
No verified thermal-resistance or maximum-junction-temperature value is supplied for EP2S180F1508C4. Do not use a generic BGA estimate as a guaranteed limit. Build an activity-based power estimate from the implemented logic, clock frequencies, toggle rates, I/O loading, and configuration; label the result as an estimate. Use the result to size ground and power copper, airflow, heat spreaders, and any heat sink, then verify against the device's official thermal data and reliability requirements. The 40 mm by 40 mm package provides a large thermal path but also creates a high-density board-design and assembly challenge.
The 1508-ball FC-FBGA package requires a manufacturer-approved land pattern and a controlled-impedance stack-up. Confirm ball numbering, power and ground groups, I/O-bank locations, clock pins, configuration pins, and differential-pair routing from the official pinout before schematic capture. Escape the BGA with sufficient vias and layers, minimize via stubs on high-speed signals, and use length-matching rules appropriate to the selected I/O standard. The supplied data confirms the package and 1,508 terminals but does not include the complete ball map, so no pin name should be inferred from the package description alone.
A common replacement error is to treat the suffix or family name as proof of drop-in compatibility. For EP2S180F1508C4, the supplied cross-reference data identifies EP2S180F1508C4N and EP2S180F1508I4N as same-package candidates, but the data does not verify every timing, temperature, configuration, or firmware detail. Before production substitution, compare the official pinout, speed grade, operating temperature, voltage rails, package dimensions, bitstream support, and development-tool compatibility. Similarly, do not interpret the reported 711.24 MHz value as a guaranteed data rate for every I/O interface; use the relevant timing and interface specifications instead.
Compliance Information
The supplied results do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals compliance. AEC-Q100 is not identified for this FPGA, so no automotive qualification is assumed.
