EP2SGX30CF780I3 vs EP2SGX30CF780C5 Comparison

Detailed side-by-side comparison of EP2SGX30CF780I3 by Intel and EP2SGX30CF780C5 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ Last Time Buy
Intel
EP2SGX30CF780C5 EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel

EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel

EP2SGX30CF780C5 ⚠ Last Time Buy

Specification Comparison

Parameter EP2SGX30CF780I3 EP2SGX30CF780C5
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $171.00 $248.00
Family Stratix II GX Stratix II GX
Logic Cells 33,880 β€”
Logic Array Blocks (LABs) 33,880 1694
Maximum Internal Frequency 622.08 MHz β€”
Number of User I/O Pins 361 β€”
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V
Transceivers Embedded multi-gigabit transceivers (6.375 Gbps) Multi-gigabit transceivers with embedded CDR
Package 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) 780-ball FBGA
Terminal Pitch 1.0 mm β€”
Operating Temperature -40 Β°C to +85 Β°C (Industrial) β€”
Temperature Grade Suffix I3 (Industrial) β€”
Mounting Type Surface Mount (BGA) Surface Mount
Total Terminals 780 β€”
Package Code BGA, square shape β€”
RoHS Status [DATA_NEEDED: RoHS status not confirmed in supplied data] [DATA_NEEDED: RoHS status]
Logic Elements β€” 33880
Maximum User I/O Pins β€” 361
Operating Temperature Grade β€” Commercial (0C to +85C)
Speed Grade β€” -5
PLLs β€” 4
Embedded Memory β€” M512 / M4K / M-RAM blocks (totals per datasheet)
DSP Blocks β€” Embedded multiplier/DSP blocks
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

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