EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
MPN: EP2SGX30CF780I3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2SGX30CF780I3 Overview
What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed serial interfaces on a single die. Stratix II GX sits in Altera's high-end transceiver-equipped FPGA hierarchy (Stratix II -> Stratix II GX -> Stratix III GX), built on a 90 nm CMOS process with 1.2 V core voltage. The 'GX' suffix specifically denotes integrated multi-gigabit transceivers, which differentiate this family from logic-only Stratix II devices.
Key features include 33,880 logic cells, 361 user I/O pins, embedded 6.375 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and 90 nm CMOS process technology. The 'I3' suffix indicates an industrial temperature grade (–40 °C to +85 °C ambient), while 'CF780' designates the 780-ball flip-chip BGA package.
The architecture combines ALM (Adaptive Logic Module) blocks with TriMatrix memory, supporting both distributed and block RAM. The integrated transceivers support common serial protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet, while the 90 nm process balances die size and dynamic power for high-density designs. Total internal memory and DSP block counts scale with the 33,880-cell capacity.
Typical applications include telecommunications line cards, high-end test and measurement equipment, broadcast video processing, and PCI Express-based add-in cards. The transceiver capability also makes it suitable for backplane aggregation and high-speed serial bridging between FPGAs.
When designing with this device, pay close attention to the transceiver reference clock architecture, power-sequencing requirements (1.2 V core, separate transceiver and I/O rails), and signal-integrity guidelines for the 1.0 mm-pitch BGA. A multi-layer PCB with controlled-impedance routing is required to meet transceiver performance targets.
This page synthesizes distributor availability, drop-in same-package alternatives from the Stratix II GX lineup, and practical design considerations that go beyond the manufacturer datasheet, helping engineers evaluate the part against newer Cyclone and Stratix families.
Drop-in alternatives for EP2SGX30CF780I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30CF780I3 (same form factor and footprint) — differing in Package, Speed Grade, Logic Elements, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30CF780C3
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View Datasheet →EP2SGX30CF780I3 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Cells | 33,880 |
| Logic Array Blocks (LABs) | 33,880 |
| Maximum Internal Frequency | 622.08 MHz |
| Number of User I/O Pins | 361 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) |
| Package | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Terminal Pitch | 1.0 mm |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Temperature Grade Suffix | I3 (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| Total Terminals | 780 |
| Package Code | BGA, square shape |
EP2SGX30CF780I3 bga, square shape Pin Configuration Guide
Pin configuration for EP2SGX30CF780I3 (bga, square shape package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30CF780I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30CF780I3 is suitable for 6 applications: Telecommunications Line Cards, PCI Express Endpoint Cards, High-Speed Test & Measurement Equipment, Broadcast Video Processing, Industrial Automation Backplanes, Aerospace & Defense Signal Processing.
Telecommunications Line Cards
The EP2SGX30CF780I3 fits telecom line-card designs through its combination of 33,880 logic cells and embedded multi-gigabit transceivers rated up to 6.375 Gbps. The transceivers support standard backplane protocols including SPI-4.2, Serial RapidIO, and XAUI, eliminating external PHY chips and reducing board area. With 361 user I/Os available on the 780-ball FC-FBGA, designers can connect to network processors, TCAMs, and external memory buses without multiplexing concerns. The industrial temperature grade (-40 °C to +85 °C) supports outdoor cabinet deployments. Compared to a discrete SERDES-plus-FPGA solution, this part integrates transceiver hard IP directly, cutting BOM cost and simplifying PCB routing.
Recommended
PCI Express Endpoint Cards
The EP2SGX30CF780I3's embedded transceivers implement PCI Express Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) hard IP, making it a natural fit for PCIe endpoint add-in cards. Altera's PCIe IP core in Quartus II bundles the physical layer, data link, and transaction layers directly on the transceiver, freeing the 33,880 logic cells for application logic. The 780-ball FC-FBGA package exposes enough I/O to drive PCIe edge connectors, on-card memory (DDR2/DDR3 via soft controller), and application-specific peripherals. Engineers evaluating this part for new PCIe designs should weigh Stratix IV GX or Cyclone V GX for longer-term availability as of 2026-09-09.
Recommended
High-Speed Test & Measurement Equipment
The EP2SGX30CF780I3 serves in oscilloscope, logic analyzer, and protocol-analyzer platforms where its 6.375 Gbps transceivers capture and process high-speed serial data streams in real time. The 33,880 logic cells accommodate deep capture buffers and parallel DSP processing paths, while the 361 user I/Os route analog front-end samples into on-chip memory and out to display interfaces. Industrial temperature grading is valuable for portable test instruments used in field environments. The 90 nm process gives predictable timing closure for multi-channel correlation logic. For new designs, Cyclone V GX or Stratix 10 provide higher transceiver rates and better power efficiency.
Recommended
Broadcast Video Processing
The EP2SGX30CF780I3 fits broadcast video processing cards handling SD-SDI, HD-SDI, and 3G-SDI streams through its integrated transceivers, which natively support the data rates required by SMPTE 259M, 292M, and 424M standards. The 33,880 logic cells run multi-stream processing, format conversion, and overlay/blending pipelines, while the 361 user I/Os connect to external DDR2 memory, video DACs, and HDMI/DisplayPort bridge chips. Industrial temperature supports broadcast equipment deployed in uncontrolled venues. Designers targeting 4K/UHD workflows should evaluate newer Cyclone V GX or Arria 10 parts, which offer higher transceiver rates and dedicated video processing IP.
Recommended
Industrial Automation Backplanes
The EP2SGX30CF780I3 integrates into industrial backplane controllers thanks to its multi-gigabit transceivers, which can drive proprietary backplane serial links, SERCOS III, or EtherCAT-over-serdes implementations. The 780-ball FC-FBGA provides 361 user I/Os for digital I/O expansion cards, while 33,880 logic cells run real-time control loops and protocol stacks concurrently. The -40 °C to +85 °C industrial temperature grade supports factory-floor deployment without additional thermal conditioning. The 1.2 V core voltage and 90 nm process yield acceptable power dissipation for sealed enclosures. Migration to Cyclone V GX or Cyclone 10 LP is recommended for new industrial platforms.
Recommended
Aerospace & Defense Signal Processing
The EP2SGX30CF780I3 supports defense signal-processing applications such as radar front-end preprocessing, software-defined radio baseband, and electronic-warfare subsystems where its integrated transceivers handle digitized RF data at multi-gigabit rates. The 33,880 logic cells accommodate FFT, channelization, and modulation pipelines, while 361 user I/Os interface to ADC/DAC devices and high-speed memory. The industrial temperature rating supports avionics bay environments. The 780-ball FC-FBGA's 1.0 mm pitch is PCB-friendly for ruggedized board builds. For new defense programs, designers should evaluate Stratix V GX, Arria V GX, or Microsemi/Microchip radiation-tolerant FPGAs for supply continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30CF780I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30CF780C3 | EP2SGX30CF780C4 | EP2SGX30CF780C5 | EP2SGX30CF780C6 | EP2SGX30CF780C7 |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (29x29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Cells | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) |
| Speed Grade | I3 (industrial speed bin) | C3 (slower) | C4 | C5 | C6 (faster) | C7 (fastest) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Transceivers | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| User I/O Pins | 361 | 361 | 361 | 361 | 361 | 361 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
Key Differentiators
- Industrial temperature rating for harsh environments (vs EP2SGX30CF780C3)
- Integrated multi-gigabit transceivers on a 33,880-cell die (vs EP2S60F672C5)
- Same-package drop-in compatibility within the Stratix II GX family (vs EP4SGX230KF40C2N (Stratix IV GX))
Design Notes
Estimated: The Stratix II GX EP2SGX30CF780I3 requires three primary rails — 1.2 V core, 2.5 V/3.3 V auxiliary, and 1.2 V/2.5 V transceiver analog — plus PLLs and I/O banks. Power sequencing must follow Altera's recommended order (transceiver analog -> PLL -> core -> I/O) to prevent latch-up. Estimated quiescent dissipation is approximately 1-2 W for core only at zero toggle, scaling up to 5-8 W at full utilization with active transceivers. Designers should budget 10 W total per device for thermal and supply sizing.
The 780-ball FC-FBGA uses 1.0 mm ball pitch, which requires PCB microvia (laser-drilled or plasma-etched) stack-up with at least 6 layers for clean transceiver routing. Transceiver channels must use 100 Ω differential impedance with length matching within 0.13 mm (5 mil) per the Altera Stratix II GX Handbook guidelines. Reference clock routing must be isolated from data lines and guarded by ground vias. Decoupling capacitors should be placed adjacent to every power ball pair.
Estimated: With a 1.0 mm FC-FBGA and typical 90 nm Stratix II GX power dissipation of 5-8 W, the junction-to-ambient thermal resistance (theta_JA) on a 6-layer JEDEC test board is roughly 15-20 °C/W. This yields a junction temperature rise of 75-160 °C above ambient at full load, which approaches the 125 °C maximum. A heatsink or aggressive thermal via array under the package thermal balls is recommended for industrial deployments where ambient can reach 85 °C.
Common pitfalls include: (1) failing to assign unused transceiver channels to a defined state (tie RX high, leave TX floating) per Altera's recommendations; (2) using a non-Altera-recommended configuration device, which can corrupt the Stratix II GX bitstream during warm reset; (3) ignoring pull-up requirements on configuration pins (nCONFIG, nSTATUS, CONF_DONE); and (4) selecting commercial-grade EP2SGX30CF780C3/C5 in place of I3 for outdoor deployments where ambient falls below 0 °C. Always validate the device tree in Quartus II before fabrication.
Compliance Information
Compliance data (RoHS, REACH, lead-free, halogen-free) was not present in the verified web data; marked unknown per Data Authenticity Rule 1. AEC-Q100 is not applicable to FPGAs (automotive discrete IC standard). Intel/Altera product environmental compliance should be verified directly via Intel's Product Compliance Declarations portal.
