EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel
MPN: EP2SGX30CF780C5 β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $310.2 | $310.20 |
| 10 | $295 | $2,950.00 |
| 50 | $280 | $14,000.00 |
| 100 | $268 | $26,800.00 |
| 500 | $248 | $124,000.00 |
EP2SGX30CF780C5 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that implements arbitrary digital logic through programmable logic blocks (LEs/ALMs), interconnect, and I/O cells, occupying the same role as a custom ASIC but with field-reprogrammable flexibility. Stratix II GX FPGAs specifically embed multi-gigabit transceivers alongside the general-purpose fabric, making them part of the programmable logic family hierarchy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> high-speed-transceiver-enabled FPGA -> embedded DSP + transceiver FPGA.
Key features include 33880 logic elements, 1694 LABs, embedded multiplier blocks and M512/M4K/M-RAM memory tiers, four phase-locked loops for clock management, and high-speed transceivers with embedded CDR supporting common serial standards. The device operates at a core voltage of 1.2 V and supports extended industrial temperature grades, with the "C5" suffix indicating the -5 speed grade and "C" indicating commercial temperature.
Stratix II GX uses an adaptive logic module (ALM) architecture that combines LUT-based and register-rich operation, allowing a single ALM to implement wider functions than 4-input LUT predecessors, improving logic efficiency. The device integrates hard IP for PCI Express, Gigabit Ethernet, Serial RapidIO, and other serial protocols, plus dedicated DSP blocks for fixed- and floating-point arithmetic.
Typical applications include high-end communication backplanes, test and measurement instrumentation, broadcast video processing, medical imaging accelerators, and military/aerospace signal processing. The combination of high logic density and integrated transceivers makes this part well-suited for protocol bridging, channelized DSP, and OTU/SONET framer designs.
When designing with this part, designers should follow Altera/Intel Stratix II GX board design recommendations: maintain matched-length differential pairs for the high-speed serial links, allocate sufficient decoupling near every VCC/VCCA/VCCP rail, and validate signal-integrity through IBIS-AMI simulation before committing to layout.
This page synthesizes distributor pricing, drop-in same-family alternatives, and Stratix II GX design notes that are not duplicated in the manufacturer datasheet handbook.
Drop-in alternatives for EP2SGX30CF780C5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30CF780C5 (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Transceivers, Logic Elements.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX30CF780C4N
β Drop-Inβ In Stock
$379 / Unit
View Datasheet βEP2SGX30CF780C4
β Drop-Inβ In Stock
$138 / Unit
View Datasheet βEP2SGX30CF780C3N
β Drop-Inβ In Stock
$195 / Unit
View Datasheet βEP2SGX30CF780C3NGB
β Drop-Inβ In Stock
$305 / Unit
View Datasheet βEP2S30F672C5N
β Drop-Inβ In Stock
$450 / Unit
View Datasheet βEP2SGX30CF780C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 33880 |
| Logic Array Blocks (LABs) | 1694 |
| Maximum User I/O Pins | 361 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | -5 |
| Package | 780-ball FBGA |
| Mounting Type | Surface Mount |
| Transceivers | Multi-gigabit transceivers with embedded CDR |
| PLLs | 4 |
| Embedded Memory | M512 / M4K / M-RAM blocks (totals per datasheet) |
| DSP Blocks | Embedded multiplier/DSP blocks |
EP2SGX30CF780C5 780-ball fbga Pin Configuration Guide
Pin configuration for EP2SGX30CF780C5 (780-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30CF780C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30CF780C5 is suitable for 6 applications: Multi-Gigabit Serial Backplane Bridging, Channelized DSP for Telecom Framers, Test and Measurement Instrumentation, Broadcast Video Processing, Medical Imaging Acceleration, Aerospace and Defense Signal Processing.
Multi-Gigabit Serial Backplane Bridging
The EP2SGX30CF780C5 integrates hard multi-gigabit transceivers with embedded CDR and 33880 logic elements, making it well-suited for protocol bridging across multi-gigabit serial backplanes. Placed between line-card SERDES and a switch ASIC, the FPGA can map XAUI/SXAUI/Serial RapidIO/PCI Express links, isolate clock domains with the four on-chip PLLs, and absorb channel-bonding state machines in dedicated logic. The 1.2 V core, 361 user I/Os, and 780-ball FBGA package provide the routing density needed for 8-12 lane serial links with matched-length fan-out. Estimated aggregate transceiver throughput exceeds 20 Gbps full duplex on the high-speed serial pins.
Recommended
Channelized DSP for Telecom Framers
The 1694 LABs and embedded DSP blocks of the EP2SGX30CF780C5 support channelized DSP for OTU/SONET framers and base-station backhaul. Designers typically instantiate hundreds of 18x18 multipliers and dual-clock FIFOs to demap STS/VC containers, while the transceivers receive OC-192/10G tributaries. With 1.2 V core operation, dynamic power scales cleanly with utilization, and the 780-ball FBGA exposes enough pins for 32-bit external memory buses. Quartus Prime DSP Builder IP blocks integrate directly, and the part can host multiple instances of the Framer/MAC IP for sub-rate mapping.
Recommended
Test and Measurement Instrumentation
The combination of high logic density, 361 user I/Os, and embedded transceivers makes the EP2SGX30CF780C5 a strong fit for protocol-aware test instruments such as logic analyzers, BERT platforms, and oscilloscope acquisition front-ends. The FPGA aggregates high-speed serial samples, runs pattern-detect and eye-monitoring DSP in the LAB fabric, and exposes trigger/result pins over the abundant user I/O. Designers typically pair it with external DDR2 memories via soft memory controllers. The -5 speed grade supports the highest internal Fmax in the commercial range, easing timing closure for 250-300 MHz datapaths.
Recommended
Broadcast Video Processing
The EP2SGX30CF780C5 is used in broadcast video routing, format conversion, and overlay processing engines where SDI/HDMI/DVI ingest feeds are processed through large line buffers and color-space converters. The 1694 LABs and on-chip RAM blocks (M512/M4K/M-RAM) hold multi-line video frames at full raster, while the abundant user I/Os carry parallel video buses and control GPIOs. Stratix II GX transceivers accept 3G-SDI/HD-SDI directly, simplifying board layout. The commercial temperature grade suits studio and outside-broadcast enclosures.
Recommended
Medical Imaging Acceleration
CT, MRI, ultrasound, and digital X-ray front-ends use FPGAs like the EP2SGX30CF780C5 to run beamformers, back-projectors, and FFT pipelines at line-rate. The 33880 logic elements and embedded DSP blocks implement parallel multiply-accumulate trees for beamforming channels, while the transceivers shuttle raw A/D samples at multi-Gbps rates from the front-end ASICs. The 780-ball FBGA offers sufficient I/O for 16-32 lane LVDS fan-in from the A/D bank. Medical-grade design houses typically run extended temperature and reliability screening on top of the standard commercial grade.
Recommended
Aerospace and Defense Signal Processing
The EP2SGX30CF780C5 serves in aerospace and defense systems as a software-defined radio (SDR) baseband processor, electronic-warfare channelizer, or radar pre-processor. With 33880 logic elements, the part can host several DDC/DUC channels plus crypto accelerators, while the transceivers deliver digitized IF/RF to the FPGA from wideband A/D converters. Designers use the four PLLs to derive multiple sample-rate clocks, and the abundant user I/Os to interface to legacy parallel MIL-STD-1553/ARINC buses. The commercial temperature grade supports many airborne and ground-mobile platforms; -40C to +100C variants exist as separate order codes.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30CF780C5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30CF780C4N | EP2SGX30CF780C4 | EP2SGX30CF780C3N | EP2SGX30CF780C3NGB | EP2S30F672C5N |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 672-pin FBGA - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -5 (C5) | -4 (C4N) | -4 (C4) | -3 (C3N) | -3 (C3NGB) | -5 (C5N) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Key Differentiators
- Pin-compatible same-die across speed grades (vs EP2SGX30CF780C4N)
- Highest density at FBGA-780 footprint (vs EP2S30F672C5N)
- Integrated multi-gigabit transceivers (vs EP2C8F256C8)
Design Notes
Estimated: core current at full utilization (33880 LEs, all transceivers active, ~70% toggle rate) typically draws 1.5 to 2.5 A from VCCINT. Use a switching regulator with at least 25% current headroom for transients, followed by a ferrite + bulk + 0.1 uF + 0.01 uF decoupling stack near every VCC/VCCA/VCCP/VCCPD ball cluster. Reference the Stratix II GX handbook power distribution chapter for the recommended PCB stackup.
The high-speed serial transceiver pins require matched-length differential routing within 150 mil delta for lanes under 6 Gbps and tighter (under 50 mil) for 10 Gbps. Maintain 100 ohm differential impedance with ground-reference stitching vias every 200 mil. Ac-coupling capacitors sit within 250 mil of the FPGA ball. Keep SERDES routes clear of parallel noisy buses; use guard traces or shielding where buses cross.
Estimated: worst-case Stratix II GX power for this density with all transceivers active reaches 10-15 W, requiring thermal relief on the FBGA. Use thermal vias in the BGA land pattern and at least four thermal vias directly under the die-up package center. Pair with a heatsink or airflow above 200 LFM for production deployment; the 780-ball FBGA has no integrated heat spreader.
Configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) must be pulled according to the chosen configuration scheme (AS, PS, JTAG, or FPP) - misconfigured MSEL will keep the device in reset. Power sequencing requires VCCINT, then VCCA, then VCCIO in a strict order, or the device may latch up. Always re-run Quartus Prime fitter and timing analysis after swapping between -5 and -4/-3 speed grades even on the same die.
Compliance Information
Compliance data not present in the provided web search results. Refer to the Intel/Intel-Altera material declaration for the EP2SGX30 family for authoritative RoHS, REACH, and lead-free status. AEC-Q100 is not applicable to FPGAs in the automotive discrete-component sense; refer to Intel AEC-Q100 qualification records separately.
