EP2SGX60DF780C3 vs EP2SGX60DF780C4N Comparison
Detailed side-by-side comparison of EP2SGX60DF780C3 by Intel and EP2SGX60DF780C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N ObsoleteSpecification Comparison
| Parameter | EP2SGX60DF780C3 | EP2SGX60DF780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $218.00 | $365.00 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | β |
| Logic Elements / Cells | 60,440 | β |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | 2,544,192 |
| Number of I/O | 364 | β |
| Number of Transceivers | Up to 20 | β |
| Transceiver Data Rate | Up to 6.375 Gbps | β |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | β |
| Internal Frequency (max) | ~717 MHz | β |
| Package | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount | β |
| Operating Temperature (TJ) | 0 Β°C to +85 Β°C (commercial, C speed grade) | β |
| Speed Grade | C3 (fastest commercial) | C4 |
| RoHS Status | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Lead-free (per part suffix N) |
| Logic Elements | β | 60,440 |
| Adaptive Logic Modules (ALMs) | β | 24,176 |
| User I/Os | β | 364 |
| Embedded Multipliers (18x18) | β | 144 |
| DSP Blocks | β | 36 |
| Transceivers | β | Up to 20 (up to 6.375 Gbps) |
| PLLs | β | 4 |
| Global Clock Networks | β | 16 |
| Process Node | β | 90 nm CMOS |
| Maximum Internal Frequency | β | 717 MHz |
| Operating Temperature | β | Commercial 0C to +85C |