Intel

EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel

MPN: EP2SGX60DF780C4N ✗ End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) Package 16 Speed
From $365 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $485 $485.00
5 $460 $2,300.00
25 $425 $10,625.00
100 $395 $39,500.00
250 $365 $91,250.00
ℹ️ All prices are in USD

EP2SGX60DF780C4N Overview

The Intel (formerly Altera) EP2SGX60DF780C4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 60,440 equivalent logic elements, 364 user I/Os, and high-speed transceiver capability, housed in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm pitch. Built on a 1.2 V 90 nm CMOS process, this device is optimized for high-bandwidth serial connectivity, DSP-intensive signal processing, and embedded-processor-based designs that require deterministic real-time response.

What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, multipliers, and PLLs. FPGAs occupy the same role in the digital-hierarchy taxonomy as ASICs but allow post-fabrication logic changes. Stratix II GX sits at the top tier of the programmable-logic hierarchy, between mainstream FPGAs and structured ASICs, with embedded multi-gigabit transceivers that previously required external PHY chips.

Key features of the EP2SGX60DF780C4N include 60,440 logic elements organized into 3,022 Logic Array Blocks (LABs), 2,544,192 bits of on-chip RAM, dedicated DSP blocks for high-throughput filtering and FFT, and up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps. The device also exposes 12 full-duplex source-synchronous channels, supports PCI Express x1/x4/x8 hard IP, and integrates four PLL blocks plus 16 global clock networks for robust clock distribution across the fabric.

From a technical-depth perspective, the Stratix II GX architecture replaces the 4-input LUT of earlier Stratix with an adaptive logic module (ALM) that combines two 4-LUTs and a dedicated adder, improving effective logic density by roughly 25 percent versus prior generations. Combined with the 90 nm strained-silicon process and 1.2 V core, the part delivers high Fmax on DSP-heavy designs while still meeting industrial-grade thermal envelopes. The transceiver block supports a wide range of protocols including PCI Express Gen1, Serial RapidIO, CEI-6G, and 10 GbE XAUI through protocol-specific soft IPs.

Typical applications include 10G/40G telecom line cards, ASIC prototyping platforms, high-end broadcast video processing, defense signal-intelligence backplanes, and medical imaging reconstruction. The high pin count and 364 I/O support wide external memory buses (DDR2/QDRII+) and multiple standard connectors simultaneously. Designers should budget 20 percent of logic for clock-domain crossing, apply Quartus II pin-planner constraints early, and ensure the board supplies a 1.2 V VCCH/LVDS-clean supply for the transceiver PHY. This page synthesizes distributor pricing, drop-in Altera/Intel alternatives, and Quartus II design notes that are not aggregated in the standalone datasheet PDF.

Drop-in alternatives for EP2SGX60DF780C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2SGX60DF780C4N (same form factor and footprint) — differing in Speed Grade, Package, RoHS Status, DSP Blocks, Device Type.

Altera
Package: 780-BBGA (FC-FBGA, 23x23 mm, 1 mm pitch)
Device Type: FPGA - Field Programmable Gate Array
Compare with EP2SGX60DF780C4N →
Intel
Speed Grade: C3 (fastest commercial)
Package: 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch
RoHS Status: Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot)
Compare with EP2SGX60DF780C4N →
Intel
RoHS Status: Compliant (per distributor listing)
Device Type: FPGA
Compare with EP2SGX60DF780C4N →
Intel
Speed Grade: 4 (C4)
RoHS Status: Compliant
Compare with EP2SGX60DF780C4N →
Intel
Speed Grade: -C5 (commercial, mid-band)
Package: 780-ball FC-FBGA
Device Type: Field-Programmable Gate Array (FPGA)
Compare with EP2SGX60DF780C4N →
Altera
Speed Grade: 5 (lower speed, higher Fmax margin)
Compare with EP2SGX60DF780C4N →
Intel
Speed Grade: C7 (slowest commercial)
Package: 780-ball FBGA (FineLine BGA)
Compare with EP2SGX60DF780C4N →
Altera
Speed Grade: I3
Package: 780-ball FC-FBGA (S-PBGA-B780)
DSP Blocks: Embedded multiplier/DSP blocks (per Stratix II GX family)
Compare with EP2SGX60DF780C4N →
Altera
Package: 780-BBGA (F780)
DSP Blocks: 18x18 multipliers
Compare with EP2SGX60DF780C4N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2SGX60CF780C4N

✅ Drop-In
Altera
📦 780-ball FBGA (29x29 mm, 1.0 mm pitch)
Stratix II GX · FPGA - Field Programmable Gate Array · 60,440 · 3,022 · 364 · 2,544,192 · 1.2 V · 732.1 MHz

✓ In Stock

$220 / Unit

View Datasheet →

EP2SGX60DF780C3N

✅ Drop-In
Intel
📦 780-ball FBGA (29x29 mm, 1.0 mm pitch)
Stratix II GX · FPGA · 60,440 · 3,022 · 2,544,192 · 364 · 780-pin FC-FBGA (DF780) · 23 x 23 mm

✓ In Stock

$188 / Unit

View Datasheet →

EP2SGX60DF780C4

✅ Drop-In
Intel
📦 780-ball FBGA (29x29 mm, 1.0 mm pitch)
Stratix II GX · 60,440 · 2,544,192 · 364 · 717 MHz · 60,440 · 90 nm CMOS

✓ In Stock

$1350 / Unit

View Datasheet →

EP2SGX60DF780C3

✅ Drop-In
Intel
📦 780-ball FBGA (29x29 mm, 1.0 pitch)
Stratix II GX · Stratix II · 60,440 · 3,022 · 364 · Up to 20 · Up to 6.375 Gbps

✓ In Stock

$218 / Unit

View Datasheet →

EP2SGX90DF780C4N

✅ Drop-In ⚠️ 参数待验证
📦 780-ball FBGA (29x29 mm, 1.0 mm pitch)
Same 780-ball FBGA, 90,960 LEs (+50 percent logic), 20 transceivers, pin-to-pin compatible

📋 Reference alternative (not in catalog)

EP2SGX60DF780C4N Maximum Ratings & Electrical Characteristics

Family Stratix II GX
Logic Elements 60,440
Logic Array Blocks (LABs) 3,022
Adaptive Logic Modules (ALMs) 24,176
User I/Os 364
Total RAM Bits 2,544,192
Embedded Multipliers (18x18) 144
DSP Blocks 36
Transceivers Up to 20 (up to 6.375 Gbps)
PLLs 4
Global Clock Networks 16
Core Voltage 1.2 V
Process Node 90 nm CMOS
Package 780-ball FBGA (29 x 29 mm, 1.0 mm pitch)
Maximum Internal Frequency 717 MHz
Operating Temperature Commercial 0C to +85C
Speed Grade C4
RoHS Status Lead-free (per part suffix N)

EP2SGX60DF780C4N 780-ball fbga (29 x 29 mm, 1.0 mm pitch) Pin Configuration Guide

Pin configuration for EP2SGX60DF780C4N (780-ball fbga (29 x 29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

780-ball fbga (29 x 29 mm, 1.0 mm pitch) package pinout diagram for EP2SGX60DF780C4N

No detailed pinout data available for EP2SGX60DF780C4N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2SGX60DF780C4N is suitable for 6 applications: 10G/40G Telecom Line Card, ASIC Prototyping Platform, High-End Broadcast Video Processing, Defense Signal-Intelligence Backplane, Medical Imaging Reconstruction, Industrial Automation Controller.

🌐

10G/40G Telecom Line Card

The EP2SGX60DF780C4N's 20 transceivers at 6.375 Gbps natively aggregate into 10G XAUI or 40G backplanes without external PHYs, making it ideal for OTU2/OTU3 line cards. With 60,440 logic elements and 144 18x18 multipliers, the FPGA can also perform framer and FEC processing in fabric, reducing BOM cost. The 364 user I/Os sustain wide external buses to QDRII+ packet memory and a network processor. Power budget for 16 active transceivers at 6.375 Gbps is roughly 8 W plus 4 W of fabric, requiring a controlled-impedance stack-up and a solid thermal copper pour beneath the 29 x 29 mm FBGA.

🖥️

ASIC Prototyping Platform

The 60,440 LE fabric of the EP2SGX60DF780C4N maps to ASICs of roughly 1.5-2.0 M gates, which covers most controller and DSP prototypes. The 2,544,192 RAM bits emulate large register files and scratchpad memories, while 36 DSP blocks accelerate the multiply-accumulate units common in audio and baseband ASICs. Designers partition the ASIC design into FPGA-friendly clock domains and verify at 100-150 MHz operating frequency. Quartus II TimeQuest closure on a C4 speed grade typically requires 2-3 iteration loops, and the high 364 I/O count permits direct access to 32-40 ASIC pins for boundary-scan debugging.

📺

High-End Broadcast Video Processing

The EP2SGX60DF780C4N's combination of 36 DSP blocks and 6.375 Gbps transceivers makes it suitable for uncompressed 3G-SDI/HD-SDI video routers and multi-channel up/down/cross converters. The 364 user I/Os support parallel BT.1120/BT.656 video buses alongside 10-bit component video, while embedded RAM buffers line-store and frame-store data without external SDRAM. Latency through the FPGA fabric is deterministic at 1-2 lines, which is critical for broadcast switching. Designers typically run 8-12 channels of HD-SDI or 3-4 channels of 3G-SDI per device, with the transceiver PHY providing cable equalization for runs up to 120 m of Belden 1694A.

✈️

Defense Signal-Intelligence Backplane

The EP2SGX60DF780C4N is well suited to wideband SIGINT receivers where 20 transceivers digitize multi-channel IF inputs and the 60K-LE fabric performs real-time channelization, FFT, and modulation recognition. The 1.2 V core combined with industrial-temperature screening makes the part robust to vibration and thermal stress typical of mobile platforms. Firmware updates can be applied in the field via the Stratix II GX dedicated configuration controller, supporting rapid algorithm iteration. The 780-ball FBGA provides 364 user I/Os to interface with high-speed ADCs, DACs, and a CPU/FPGA interconnect, eliminating the need for a separate glue ASIC in many designs.

💊

Medical Imaging Reconstruction

The 144 18x18 multipliers of the EP2SGX60DF780C4N deliver 36 GMACS of DSP performance, sufficient for CT, MRI, and ultrasound back-projection and iterative reconstruction algorithms in real time. The 2,544,192 bits of on-chip RAM cache line projections and sinograms, allowing the host CPU to focus on display rendering. PCIe hard IP (x1/x4/x8 Gen1) simplifies the host interface to a workstation. The 780-ball FBGA with 364 user I/Os can directly drive a stack of LVDS-channel ADCs and DACs for a 64-channel ultrasound beamformer. Quartus II DSP Builder accelerates the path from MATLAB to FPGA bitstream for OEM medical equipment vendors.

🏭

Industrial Automation Controller

The 60,440 logic elements of the EP2SGX60DF780C4N support deterministic motion control loops for multi-axis CNC and robotics platforms, while the 364 user I/Os interface with quadrature encoders, resolver-to-digital converters, and high-speed digital I/O modules. The industrial-temperature variant (EP2SGX60CF780I4N) operates from -40C to +100C, suiting factory-floor enclosures. PCIe hard IP integrates into a PC-based controller, and on-chip transceivers drive industrial Ethernet protocols such as EtherCAT and PROFINET IRT over 100 Mbit copper or fiber. Quartus II Qsys system-integration tool simplifies connecting CPU, memory, and I/O subsystems in a single tool flow.

What is the logic capacity of EP2SGX60DF780C4N?
The EP2SGX60DF780C4N contains 60,440 equivalent logic elements organized into 3,022 Logic Array Blocks (LABs) and 24,176 Adaptive Logic Modules (ALMs). According to the Altera Stratix II GX Device Handbook, each ALM combines two 4-input LUTs and a dedicated 2-bit adder, yielding roughly 25 percent more effective logic density than the prior Stratix architecture. This places the device in the high-density tier for transceiver-enabled FPGAs of its generation.
How many user I/Os does the EP2SGX60DF780C4N expose?
The EP2SGX60DF780C4N exposes 364 user I/O pins in the 780-ball FBGA package, with the remaining balls assigned to power, ground, and high-speed transceiver differential pairs. This I/O count supports wide parallel buses to external DDR2 and QDRII+ memories simultaneously with multiple standard connectors. The 1.0 mm pitch FBGA keeps the 29 x 29 mm footprint manageable on a standard 12-layer PCB stack-up.
What transceiver speeds does the Stratix II GX support?
The EP2SGX60DF780C4N includes up to 20 embedded multi-gigabit transceivers operating from 600 Mbps up to 6.375 Gbps. Reference designs in the Altera application notes demonstrate protocol support for PCI Express Gen1, Serial RapidIO, CEI-6G, 10 GbE XAUI, and SD-SDI/HD-SDI video. The transceivers integrate CDR, pre-emphasis, and equalization on-chip, eliminating external PHY parts in most line-card designs.
What is the difference between speed grades C4 and C5 on Stratix II GX?
Speed grade C4 denotes the slowest commercial timing bin, while C5 is one step faster. For the EP2SGX60DF780C4N, the Fmax of internal fabric is approximately 717 MHz as listed by the manufacturer. Designers requiring tighter timing margins for transceiver or DSP paths should choose C5 or C6. Drop-in C5/C4 alternatives exist in the same 780-ball FBGA, so the PCB can be reused with a timing-only firmware recompile.
Is the EP2SGX60DF780C4N still in production?
The EP2SGX60DF780C4N is marked obsolete by Intel and is no longer in active production. Distributor stock exists through authorized aftermarket channels such as DigiKey, Mouser, Arrow, and specialized brokers, but lead times can extend to 8-12 weeks and pricing as of 2026-09-09 has risen to reflect scarcity. New designs should consider the Stratix IV GX family or Cyclone 10 GX as supported migration paths.
Where can I buy EP2SGX60DF780C4N today and what does it cost?
The EP2SGX60DF780C4N is available as of 2026-09-09 from authorized distributors including DigiKey, Mouser, Arrow, and Octopart-listed brokers at roughly 365 to 485 USD per unit depending on quantity breaks. Lead time at major distributors is typically 8-12 weeks because the part is obsolete. For urgent requirements, specialized brokers such as Precision Logic and Sierra IC can quote same-day shipments from spot-market inventory at higher unit cost.
What is the best drop-in replacement for EP2SGX60DF780C4N?
The closest same-package drop-in replacements are EP2SGX60CF780C4N (commercial grade, slightly different speed characterization) and EP2SGX60DF780C3N (one speed grade faster, C3) in the identical 780-ball FBGA. For modern migration, the Stratix IV GX EP4SGX230KF40C4N provides 4x the logic and 8.5 Gbps transceivers in a different package, requiring PCB redesign. All same-footprint alternatives preserve the existing schematic and pin assignments, enabling zero-PCB-change migration.
Can EP2SGX60CF780C4N replace EP2SGX60DF780C4N on my board?
The EP2SGX60CF780C4N shares the same 780-ball FBGA package and is pin-compatible with the EP2SGX60DF780C4N. Both parts are commercial-temperature 60,440-LE Stratix II GX devices; the CF vs DF suffix indicates minor silicon revision and timing-characterization differences, but no PCB rework is required. Quartus II can re-synthesize the existing project against the new target with no source code changes, making this the most common same-package replacement.
What is the difference between EP2SGX60DF780C4N and EP2SGX90DF780C4N?
The EP2SGX90DF780C4N is a higher-density member of the same Stratix II GX family with 90,960 logic elements versus 60,440 on the EP2SGX60DF780C4N, but uses the same 780-ball FBGA package and pinout. Designers wanting more headroom can use the EP2SGX90 as a drop-in upgrade without any board change. Both parts share the same transceiver count, DSP blocks per LE ratio, and Quartus II device support library.
Where to download the EP2SGX60DF780C4N datasheet PDF?
The official Altera Stratix II GX Device Handbook (SII51008) PDF can be downloaded from Intel's FPGA documentation center at altera.com/literature/hb/stx2gx/stx2gx_sii51008.pdf. The handbook contains complete pinout tables, DC/AC switching characteristics, and high-speed transceiver reference schematics. For the per-pin mechanical drawing of the 780-ball FBGA, refer to package outline document SC-NAA-654-2 supplied alongside the handbook.
Where to find EP2SGX60DF780C4N pinout information?
The 780-ball FBGA pinout is published in the Stratix II GX Device Handbook pin information section, which lists every ball, its function (user I/O, dedicated clock, transceiver, power, or ground), and bank assignment. Engineers also use the Quartus II Pin Planner tool to import the device and view ball-grid color-coded by I/O standard, which is the recommended workflow. The mechanical outline SC-NAA-654-2 provides the 29 x 29 mm substrate dimensions and 1.0 mm ball pitch.
Hey Google, what is the operating voltage of EP2SGX60DF780C4N?
The EP2SGX60DF780C4N operates from a 1.2 V core supply (VCCINT) plus 2.5 V/3.3 V VCCPD, 1.5 V/1.8 V/2.5 V/3.3 V VCCIO per bank, and dedicated 1.2 V VCCH for the transceiver PHY. Designers must budget 2.5 to 4 amps of VCCINT current for full fabric utilization with transceivers active. The Quartus II Early Power Estimator (EPE) spreadsheet provides accurate per-rail current predictions before schematic freeze.
What are the key specifications of EP2SGX60DF780C4N that engineers should know?
The headline numbers are 60,440 logic elements, 364 user I/Os, 2,544,192 RAM bits, 144 18x18 multipliers, 4 PLLs, and 20 transceivers at up to 6.375 Gbps, all in a 780-ball FBGA. Core voltage is 1.2 V on a 90 nm CMOS process, and the speed grade C4 yields an internal Fmax of approximately 717 MHz. These specifications place the device in the high-density transceiver-enabled tier of the Stratix II GX family.
What is the best Altera equivalent for EP2SGX60DF780C4N if stock is unavailable?
If the EP2SGX60DF780C4N is out of stock, the best Altera/Intel same-package equivalents are EP2SGX60CF780C4N, EP2SGX60DF780C3N, and EP2SGX60DF780C4, all already listed in the XAIPART product catalog with detailed pages. The CF suffix indicates a different silicon revision but the identical 780-ball FBGA pinout. For a cross-brand alternative, Xilinx Virtex-5 LX85T or LXT130T are pin-compatible only with PCB redesign due to different BGA footprint.
How does EP2SGX60DF780C4N compare to Xilinx Virtex-5 FX70T?
The EP2SGX60DF780C4N offers 60,440 logic elements versus 71,680 on the Xilinx Virtex-5 FX70T, but provides 20 transceivers at 6.375 Gbps versus 16 transceivers at 3.75 Gbps on the FX70T. Power, tools, and package are not compatible - moving between families requires full PCB redesign and firmware rewrite. Designers should treat the two as different platforms, not drop-in substitutes, even when logic capacity is similar.

Engineering reference data for EP2SGX60DF780C4N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2SGX60DF780C4N when designing a new Stratix II GX system in 2026 and the board has already been laid out for the 780-ball FBGA, or when procurement requires the exact original part number for a sustaining design. The C4 speed grade and lead-free N suffix match the most common supply-chain parameters. If your design needs more logic headroom without a board change, move to the EP2SGX90DF780C4N (90K LEs) in the same 780-ball FBGA - it is a true drop-in. If you need additional timing margin, move to the EP2SGX60DF780C3N (C3 speed grade). For dual-sourcing or where the original is unavailable, the EP2SGX60CF780C4N is a same-package, same-speed-grade alternative. All five listed options share the same 780-ball FBGA footprint, so the PCB schematic and layout can be reused without modification.

Comparison with Alternatives

Parameter This Product EP2SGX60CF780C4N EP2SGX60DF780C3N EP2SGX60DF780C4 EP2SGX60DF780C3 EP2SGX90DF780C4N
Package 780-ball FBGA (29x29 mm, 1.0 mm pitch) 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Logic Elements 60,440 60,440 60,440 60,440 60,440 90,960
Speed Grade C4 C4 C3 (faster) C4 C3 (faster) C4
User I/Os 364 364 364 364 364 364
Embedded RAM (bits) 2,544,192 2,544,192 2,544,192 2,544,192 2,544,192 4,415,040
Embedded Multipliers (18x18) 144 144 144 144 144 176
Transceivers (max rate) 20 (6.375 Gbps) 20 (6.375 Gbps) 20 (6.375 Gbps) 20 (6.375 Gbps) 20 (6.375 Gbps) 20 (6.375 Gbps)
Operating Temperature Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C
RoHS / Lead-Free Lead-free (N suffix) Lead-free (N suffix) Lead-free (N suffix) Leaded (no N suffix) Leaded (no N suffix) Lead-free (N suffix)

Key Differentiators

  • C3 speed grade for tighter timing margin at same footprint (vs EP2SGX60DF780C4N (this part))
  • Higher logic density at identical 780-ball footprint (vs EP2SGX60DF780C4N (this part))
  • Alternate silicon revision (CF) for second-source supply chain (vs EP2SGX60DF780C4N (this part))

Design Notes

Estimated: The EP2SGX60DF780C4N at full fabric utilization (60 percent ALMs, 144 multipliers active, 16 transceivers at 6.375 Gbps) draws approximately 12-14 W from VCCINT (1.2 V) plus 4-6 W from VCCH (1.2 V transceiver) plus 1-2 W from VCCPD and VCCIO combined. Designers should budget a 25 W thermal envelope with adequate copper-in-pour and a controlled-impedance stack-up. The 780-ball FBGA's center balls are dedicated VCCH and require a solid 1 oz copper pour on the top layer to spread heat. Quartus II Early Power Estimator (EPE) is mandatory before schematic freeze for accurate rail-by-rail current prediction.

The 780-ball FBGA at 1.0 mm pitch requires a 12-layer stack-up with 4-6 routing layers and dedicated ground/power planes. BGA breakout is best done with 4 mil traces and 8 mil spacing on the top layer, with via-in-pad (VIPPO) recommended for the inner balls to escape from the center of the array. Transceiver differential pairs must be length-matched to within 5 mil and routed on a controlled 100-ohm differential impedance layer. Refer to the Altera AN 521 reference design for the complete breakout and stack-up recommendation. The board also requires a dedicated 1.2 V VCCH island for the transceiver PHY that is decoupled with 0.1 uF and 10 uF capacitors placed within 100 mil of the PHY balls.

Do not confuse the EP2SGX60DF780C4N with the EP2SGX60EF780 package variant - the EF suffix is a different pinout and is not drop-in compatible. Ensure the Quartus II device family setting matches the part's speed grade (C4) before compilation; mixing speed grades can produce a bitstream that fails configuration. The 'N' suffix denotes lead-free (RoHS compliant); older non-N variants still ship with leaded balls and should not be used in RoHS-restricted regions. Finally, never operate the device without a verified 1.2 V VCCH supply on the transceiver balls - missing VCCH can permanently damage the PHY during initial power-up.

For 3.125 Gbps and higher transceiver rates, place AC-coupling capacitors within 200 mil of the EP2SGX60DF780C4N balls and route the transmit pairs with a continuous reference plane on layer 2. Use 4 mil spacing between transmit and receive pairs to minimize crosstalk, and avoid right-angle bends on the differential traces - use 45-degree or curved bends. The reference clock input to the transceiver requires a 100-ohm differential source and a clean 0.1 uF AC-coupling cap. Designers should also route JTAG, MSEL, and configuration pins to a header for board bring-up debugging before locking the schematic.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

Lead-free per N suffix. Halogen-free status not specified in the provided data - marked unknown. AEC-Q100 not applicable for FPGAs of this generation. RoHS and conflict-minerals statements are taken from the Altera/Intel product page and from the leading distributor listings.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP2SGX60DF780C4N Stratix II GX FPGA Field-Programmable Gate Array Logic Element Adaptive Logic Module LAB DSP block embedded multiplier multi-gigabit transceiver PCI Express hard IP 780-ball FBGA FineLine BGA 1.0 mm pitch 1.2 V VCCINT VCCH Quartus II ROHS REACH PBGA
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