EP2SGX60DF780C3 vs EP2SGX60DF780C5 Comparison

Detailed side-by-side comparison of EP2SGX60DF780C3 by Intel and EP2SGX60DF780C5 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX60DF780C5 EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

EP2SGX60DF780C5 ⚠ Last Time Buy

Specification Comparison

Parameter EP2SGX60DF780C3 EP2SGX60DF780C5
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $218.00 $860.69
Family Stratix II GX Stratix II GX
Series Stratix II β€”
Logic Elements / Cells 60,440 β€”
Logic Array Blocks (LABs) 3,022 3,022
Total RAM Bits [DATA_NEEDED: total embedded memory bits] β€”
Number of I/O 364 β€”
Number of Transceivers Up to 20 β€”
Transceiver Data Rate Up to 6.375 Gbps β€”
Core Voltage 1.2 V β€”
Process Technology 90 nm 90 nm
Internal Frequency (max) ~717 MHz β€”
Package 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch 780-ball FC-FBGA
Mounting Type Surface Mount Surface Mount
Operating Temperature (TJ) 0 Β°C to +85 Β°C (commercial, C speed grade) β€”
Speed Grade C3 (fastest commercial) -C5 (commercial, mid-band)
RoHS Status Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) [DATA_NEEDED: RoHS status]
Logic Elements β€” 60,440
User I/O Pins β€” 364
Package Body Size β€” 23 x 23 mm
Ball Pitch β€” 1.0 mm
Core Supply Voltage β€” 1.2 V
Internal Frequency (max, typical) β€” ~717 MHz
Device Type β€” Field-Programmable Gate Array (FPGA)
Operating Temperature β€” Commercial (0C to +85C)
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

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