EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel
MPN: EP2SGX60DF780C5 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1163.36 | $1,163.36 |
| 10 | $1105.19 | $11,051.90 |
| 100 | $1023.76 | $102,376.00 |
| 500 | $930.69 | $465,345.00 |
| 1,000 | $860.69 | $860,690.00 |
EP2SGX60DF780C5 Overview
An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources (block RAM, DSP blocks, PLLs, and high-speed transceivers) on a single die, allowing designers to implement custom digital hardware that can be reconfigured after manufacturing. The Stratix II GX family sits within Intel's high-performance FPGA hierarchy: FPGA > programmable logic > programmable logic device > semiconductor IC, and is widely used in protocols where hard SERDES, large on-chip memory, and high logic density are required concurrently.
Key features include 364 user I/O pins, embedded 3.125 Gbps-class transceivers, embedded multiplier blocks for DSP, TriMatrix block RAM, and a structured ASIC-like clock network. According to distributor listings, the device supports an internal frequency near 717 MHz and uses a 23 x 23 mm FC-FBGA substrate with 1 mm ball pitch, providing robust signal and power integrity for high-channel-count designs.
Architecturally, the Stratix II GX family introduced an adaptive logic module (ALM) that combines fracturable look-up-tables with dedicated arithmetic and carry logic, delivering higher effective logic utilization than the previous Stratix generation. The -C5 speed grade places it in the mid-band of Stratix II GX timing, well suited for production deployments rather than the fastest prototyping tier.
Typical applications include telecom line cards, multi-gigabit serial backplanes, video broadcast equipment, military radar preprocessing, and high-performance ASIC prototyping. Designers also use the part in test and measurement chassis where flexible I/O plus high logic density shorten time-to-market.
When designing with this device, plan power sequencing for the 1.2 V core, the auxiliary and PLL supplies, and the transceiver analog rails, and verify termination, length-matching, and stack-up against the package's 1 mm BGA pitch. Because the part is in the Stratix II GX EOL category at Altera/Intel, long-life customers should confirm last-time-buy status before committing to new designs.
Drop-in alternatives for EP2SGX60DF780C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60DF780C5 (same form factor and footprint) — differing in Speed Grade, Package, RoHS Status, Operating Temperature, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX60DF780C5N
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$205 / Unit
View Datasheet →EP2SGX60DF780C4N
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$365 / Unit
View Datasheet →EP2SGX60DF780C4
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$1350 / Unit
View Datasheet →EP2SGX60DF780C3N
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$188 / Unit
View Datasheet →EP2SGX60DF780C3
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$218 / Unit
View Datasheet →EP2SGX60CF780C5
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$162 / Unit
View Datasheet →EP2SGX60DF780C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| User I/O Pins | 364 |
| Package | 780-ball FC-FBGA |
| Package Body Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Internal Frequency (max, typical) | ~717 MHz |
| Speed Grade | -C5 (commercial, mid-band) |
| Device Type | Field-Programmable Gate Array (FPGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | Commercial (0C to +85C) |
EP2SGX60DF780C5 23 x 23 mm Pin Configuration Guide
Pin configuration for EP2SGX60DF780C5 (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60DF780C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60DF780C5 is suitable for 6 applications: Telecom Line Card with Multi-Gigabit SerDes, PCI Express Endpoint / Gen1 Card, Video Broadcast and Image Processing Pipeline, High-Performance ASIC Prototyping, Test & Measurement Instrumentation, Industrial Control and Machine Vision.
Telecom Line Card with Multi-Gigabit SerDes
The EP2SGX60DF780C5 integrates 60,440 logic elements with embedded 3.125 Gbps-class transceivers in a 780-ball FC-FBGA, making it well suited for telecom line cards that aggregate multi-gigabit serial links (CPRI, OBSAI, Serial RapidIO, XAUI). Compared with discrete SERDES plus an FPGA, the part reduces board area and BOM by absorbing the PHY into silicon, while 364 user I/Os leave headroom for backplane glue logic, framer interfaces, and TDM buses. Designers typically instantiate the transceiver hard IP at 2.5-3.125 Gbps, run the line-card CPU on a Nios II soft core, and use TriMatrix block RAM for cell buffering.
Recommended
PCI Express Endpoint / Gen1 Card
Stratix II GX devices expose hard PCI Express IP that maps cleanly to Gen1 (2.5 Gbps) x1/x4/x8 endpoints, and the EP2SGX60DF780C5 fits this role because of its hard SERDES and 60K logic elements. The FPGA provides the PCIe Transaction Layer and Data Link Layer, plus DMA, MSIs, and any custom acceleration logic in user space. Compared with a soft PCIe core, the hard IP frees 5-10K logic elements and shortens latency by ~20-40 ns, which matters for storage controllers and DSP accelerator cards. The 780-ball FC-FBGA supports the wider x8 card-edge pinout plus 3.3 V/2.5 V legacy I/O.
Recommended
Video Broadcast and Image Processing Pipeline
Broadcast routers and image-processing pipelines need both DSP throughput and flexible I/O, and the EP2SGX60DF780C5 supplies 60,440 logic elements with embedded multiplier blocks and TriMatrix block RAM for SDR/HDR, deinterlacing, and chroma resampling. The 780-ball FC-FBGA exposes 364 user I/Os, enough to drive parallel Camera Link, BT.1120, or HDMI-side logic alongside DDR2/DDR3 memory controllers. Compared with a discrete DSP plus CPLD, the FPGA absorbs the entire video path into one device, reducing jitter and EMC issues at 148.5/297 MHz pixel rates.
Recommended
High-Performance ASIC Prototyping
ASIC and SoC teams use the EP2SGX60DF780C5 as a multi-million-gate prototyping vehicle, mapping RTL partition-by-partition and validating performance before tape-out. The 60K logic elements, abundant block RAM, and high transceivers-per-pin ratio let engineers prototype PCIe, memory controllers, and DSP blocks concurrently. Versus an FPGA-only ASIC emulator, the Stratix II GX delivers better per-LUT cost in low-volume prototyping. Use the Quartus II LogicLock feature and the Design Partition flow to maintain timing closure across RTL revisions.
Recommended
Test & Measurement Instrumentation
Test and measurement chassis require fast DSP, deep trace buffers, and flexible I/O - exactly the EP2SGX60DF780C5's profile. The part supports real-time FFTs on 16-bit samples at hundreds of MSPS by combining DSP blocks with block RAM ping-pong buffering, while 364 user I/Os handle LVDS pairs, analog-to-digital converter interfaces, and front-panel triggers. Compared with off-the-shelf DSP processors, the FPGA offers 5-10x faster inner loops and lets engineers change the algorithm in the field via JTAG reconfiguration.
Recommended
Industrial Control and Machine Vision
Industrial machine-vision systems require Camera Link or GigE Vision capture, real-time image processing, and deterministic GPIO to motion controllers - all of which fit the EP2SGX60DF780C5. The 90 nm Stratix II GX device can drive a 80-bit-wide DDR2 memory at 200 MHz while sustaining 60K logic elements for Sobel, thresholding, and template matching, leaving 364 user I/Os for encoders, triggers, and safety I/O. Compared with a CPU plus GPU stack, the FPGA delivers deterministic latency and lower system BOM for 24/7 factory-floor use.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60DF780C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60DF780C5N | EP2SGX60DF780C4N | EP2SGX60DF780C4 | EP2SGX60DF780C3N | EP2SGX60DF780C3 | EP2SGX60CF780C5 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FC-FBGA (23x23 mm, 1.0 mm pitch) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) |
| Speed Grade | -C5 | -C5 | -C4 (slower) | -C4 (slower) | -C3 (slowest) | -C3 (slowest) | -C5 |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| LABs | 3,022 | 3,022 | 3,022 | 3,022 | 3,022 | 3,022 | 3,022 |
| User I/O | 364 | 364 | 364 | 364 | 364 | 364 | 364 |
| Embedded Transceivers | Yes (Stratix II GX SERDES) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Mid-band -C5 speed grade balances cost and Fmax (vs EP2SGX60DF780C4)
- Lead-free finish variant available for RoHS projects (vs EP2SGX60DF780C5)
- Same Stratix II GX family for second-source flexibility (vs EP2SGX60CF780C5)
Design Notes
Stratix II GX devices require multiple rails: VCCINT (1.2 V core), VCCA_PLL (1.2 V), VCCPD (2.5 V or 3.3 V pre-driver), VCCH_GXB (3.3 V), VCCA_GXB (2.5 V) and per-bank VCCIO. Decouple each rail with 0.1 uF X7R close to each ball plus bulk polymer caps near the package. Use the Stratix II GX PowerPlay Early Power Estimator before schematic freeze; the 780-ball FC-FBGA typically draws 2-5 W at idle and 8-15 W at full transceiver utilization.
Estimated: at 90% logic utilization and full SERDES activity, the EP2SGX60 may dissipate 12-15 W. The 780-ball FC-FBGA exposes a thermal pad underneath the package that should be soldered to a 6x6 array of thermal balls and a 4-layer PCB copper pour. Without this thermal path, the junction can exceed 100C in still air and trigger thermal-sensor warnings. Use a top-side heatsink or heat-spreader for closed-chassis industrial designs.
Route 100-ohm differential SERDES pairs with controlled impedance, length-matching within 150 mil for XAUI and within 20 mil for PCIe Gen1. Keep 1.0 mm BGA fanout on inner layers with 4/6 mil trace-and-space and use blind/buried vias to escape the 780-ball grid. AC-coupling capacitors must be 0402 size placed within 200 mil of the FPGA ball; 0.1 uF X7R is the standard value for 2.5 Gbps SERDES on Stratix II GX.
Do not program a Stratix II GX device with Quartus Prime versions newer than 13.0sp1 - the family was removed from the toolchain. Always keep the .pof or .sof file paired with the exact device silicon revision (A1/A2). Mixing -C5 and -C3 bitstreams is supported but verify timing closure across the slower grade. Confirm last-time-buy and remaining inventory before committing to new production runs of the EP2SGX60.
Compliance Information
Stratix II GX parts shipped with -N suffix are typically lead-free, but exact RoHS/REACH compliance must be verified lot-by-lot from the manufacturer or distributor CoC. AEC-Q100 not applicable - FPGAs are not automotive-qualified at the silicon level for this family.
