EP2SGX60EF1152C3N vs EP2SGX60E1152C Comparison
Detailed side-by-side comparison of EP2SGX60EF1152C3N by Intel and EP2SGX60E1152C by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX60EF1152C3N | EP2SGX60E1152C |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,195.00 | $1,218.00 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | β |
| Logic Elements | 60,440 | 60440 |
| Adaptive Logic Modules (ALMs) | 30,220 | β |
| Logic Array Blocks (LABs) | 3022 | β |
| Embedded Memory (bits) | 2,544,192 | β |
| Maximum User I/Os | 534 | β |
| Process Technology | 90 nm CMOS | β |
| Core Voltage (Vcc) | 1.2 V | β |
| Maximum Internal Frequency | 717 MHz | β |
| Propagation Delay | 0.40 ns | β |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | β |
| PLLs | 4 | β |
| Transceiver Data Rate | 3.125 Gbps per channel | 600 Mbps to 6.375 Gbps |
| Package | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | 1152-ball FineLine BGA |
| Speed Grade | C3 (commercial, -3 bin) | C (commercial, fastest) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) | β |
| On-chip RAM (bits) | β | 2544192 |
| DSP / Embedded Multiplier Blocks | β | 144 (18x18 multipliers) |
| Maximum User I/O | β | 534 |
| Process Node | β | 90 nm |
| Multi-gigabit Transceivers | β | 20 channels |
| PCI Express Hard IP | β | x1, x4, x8 endpoints and root ports |
| Embedded Memory Type | β | TriMatrix (MLAB + M512 + M4K) |
| Configuration | β | Active serial / Fast passive parallel / JTAG |
| RoHS Status | β | Compliant |