EP2SGX60EF1152C3N - 60K LEs Stratix II GX FPGA | Intel | 1152-BBGA
MPN: EP2SGX60EF1152C3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 5 | $2710 | $13,550.00 |
| 10 | $2580 | $25,800.00 |
| 25 | $2410 | $60,250.00 |
| 100 | $2195 | $219,500.00 |
EP2SGX60EF1152C3N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnect via a hardware description language (HDL). FPGAs occupy a tier in the semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. They offer parallel processing, deterministic timing, and hardware-level reprogrammability that microcontrollers and DSPs cannot match for high-throughput, low-latency signal processing.
The EP2SGX60EF1152C3N integrates 3022 logic array blocks (LABs) with 534 user I/Os, four phase-locked loops (PLLs), and embedded multiplier blocks (18x18) for DSP arithmetic. The device is offered in the C3 speed grade (commercial, -3 speed bin) and ships in a 35 mm x 35 mm 1152-pin FC-FBGA with 1.0 mm ball pitch, providing ample I/O for high-bandwidth memory interfaces and parallel data acquisition. The GX suffix denotes integrated multi-gigabit transceivers.
Stratix II GX transceivers support serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI at up to 3.125 Gbps. The combination of high logic density, embedded memory, hard IP for DSP, and serial transceivers makes the EP2SGX60EF1152C3N a single-chip solution for protocol bridging, high-speed data aggregation, and signal processing. The 90 nm CMOS process delivers a balance of speed and power for telecom, military, and high-end industrial systems.
Typical applications include 10G Ethernet line card aggregation, wireless baseband processing, radar and SIGINT front ends, high-speed test instrumentation, and military secure communications. Design flow uses the Quartus II design software, which provides synthesis, place-and-route, timing analysis, and bitstream generation for the device.
When designing with the EP2SGX60EF1152C3N, ensure PCB layout follows Intel's 1152-BGA flip-chip escape rules with via-in-pad or microvia stack-ups for signal-integrity. Thermal management requires an adequate thermal pad connection to the PCB inner copper plane to keep junction temperature within the 100C commercial limit. The C3 speed grade is one step below the fastest C4 and C5 bins; verify timing closure against your target fMAX before committing to the bin.
This page consolidates distributor pricing, same-brand Stratix II GX alternates, and practical Quartus II design notes not found in the device datasheet alone.
Drop-in alternatives for EP2SGX60EF1152C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60EF1152C3N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Package Type, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX60EF1152C5N
β Drop-Inβ In Stock
$3300 / Unit
View Datasheet βEP2SGX60EF1152C4N
β Drop-Inβ In Stock
$1350 / Unit
View Datasheet βEP2SGX60EF1152I4N
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP2SGX60CF1152C5N
β Drop-Inπ Reference alternative (not in catalog)
EP2S60F1020C5N
β Drop-Inβ In Stock
$143.75 / Unit
View Datasheet βEP2SGX60EF1152C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Series | Stratix II |
| Logic Elements | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 |
| Logic Array Blocks (LABs) | 3022 |
| Embedded Memory (bits) | 2,544,192 |
| Maximum User I/Os | 534 |
| Process Technology | 90 nm CMOS |
| Core Voltage (Vcc) | 1.2 V |
| Maximum Internal Frequency | 717 MHz |
| Propagation Delay | 0.40 ns |
| PLLs | 4 |
| Transceiver Data Rate | 3.125 Gbps per channel |
| Package | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch |
| Speed Grade | C3 (commercial, -3 bin) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
EP2SGX60EF1152C3N 1152-bbga (fc-fbga) 35 x 35 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX60EF1152C3N (1152-bbga (fc-fbga) 35 x 35 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60EF1152C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60EF1152C3N is suitable for 6 applications: 10 Gigabit Ethernet Line Card Aggregation, Wireless Baseband Processing (WCDMA/LTE), Military Radar and SIGINT Front End, High-Speed Test and Measurement Instrumentation, Medical Imaging (Ultrasound Beamforming), Secure Military Communications Encryptor.
10 Gigabit Ethernet Line Card Aggregation
The EP2SGX60EF1152C3N integrates multi-gigabit transceivers supporting 3.125 Gbps per channel, enabling direct XAUI (4 x 3.125 Gbps) and 10 Gigabit Ethernet connectivity without external PHYs. The 60,440 logic elements plus 2,544,192 bits of embedded memory allow aggregation of multiple 1G/10G ports, packet buffering, and classification logic on a single device. In line card designs, the FPGA sits between network processors and SFP+/XFP optical modules, performing traffic shaping and protocol bridging. The 534 user I/Os support parallel connection to TCAMs, RLDRAM II, and backplane SERDES, making it ideal for legacy terabit-class switches and routers.
Recommended
Wireless Baseband Processing (WCDMA/LTE)
The EP2SGX60EF1152C3N provides DSP-grade performance for wireless baseband signal processing, with embedded 18x18 multipliers and thousands of logic elements for FFT, channel estimation, and turbo decoder cores. At 1.2 V core and 90 nm CMOS, it sustains multi-antenna (MIMO) processing for WCDMA, WiMAX, and early LTE base stations. The 3.125 Gbps transceivers interface with CPRI/OBSAI fronthaul links to remote radio heads, while 534 user I/Os support parallel ADC/DAC data capture. The 1152-BGA package enables dense PCB layouts for baseband units where board area is constrained.
Recommended
Military Radar and SIGINT Front End
The EP2SGX60EF1152C3N is widely used in military radar and signals-intelligence (SIGINT) systems where high logic density, embedded memory, and hardened transceivers are required for digital receiver channelization, pulse compression, and direction-finding algorithms. The 60K logic elements support 16+ channel digital down-conversion (DDC) chains, while 2.5 Mbits of embedded memory buffer raw ADC samples. The industrial temperature variant EP2SGX60EF1152I4N extends the same architecture to -40C to +100C for airborne and ground-mobile platforms. The 534 user I/Os handle multi-board analog-to-digital interfaces, and 3.125 Gbps links connect to backplane recorders.
Recommended
High-Speed Test and Measurement Instrumentation
The EP2SGX60EF1152C3N serves as the central processing engine in high-speed oscilloscopes, logic analyzers, and protocol testers. Its 60,440 logic elements and 2.5 Mbits of memory enable real-time trigger logic, pattern generation, and statistics collection on multi-channel data streams. The integrated transceivers support up to 3.125 Gbps channels for serial protocol analysis (PCIe Gen 1, SATA, XAUI). The 534 user I/Os accommodate parallel LVDS data capture from front-end ADCs, and the 1152-BGA package provides the routing density required for 8-16 layer PCBs in benchtop instruments.
Recommended
Medical Imaging (Ultrasound Beamforming)
In medical ultrasound systems, the EP2SGX60EF1152C3N performs real-time digital beamforming across 64 to 128 channels, summing echo signals with sub-microsecond delay precision. The 60K logic elements implement FIR filters, envelope detection, and harmonic imaging algorithms, while the 2.5 Mbit embedded memory holds channel data and lookup tables. The 534 user I/Os accept parallel LVDS streams from front-end ADCs, and the 3.125 Gbps transceivers offload processed images to host processors. The commercial 0C to +85C temperature range suits cart-based ultrasound systems; the I4 industrial variant is preferred for portable point-of-care devices.
Recommended
Secure Military Communications Encryptor
The EP2SGX60EF1152C3N provides the FPGA fabric for Type-1 encrypted military communications, implementing high-speed cryptographic algorithms and protocol framing for tactical radios and satellite links. The 60,440 logic elements run AES-256, KG-84, and key-management state machines, while the 3.125 Gbps transceivers handle link-side encryption on Sonet, Fibre Channel, or custom serial interfaces. With 2.5 Mbits of memory for key tables and packet buffering, the device supports continuous encrypted traffic at line rate. The I4 industrial variant extends deployment to -40C tactical environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60EF1152C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60EF1152C5N | EP2SGX60EF1152C4N | EP2SGX60EF1152I4N | EP2SGX60CF1152C5N | EP2S60F1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA (FC-FBGA) 35x35mm | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same | 1020-FBGA - different |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C3 (commercial) | C5 (faster) | C4 (faster) | I4 (industrial) | C5 (faster) | C5 (faster) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Transceivers | 3.125 Gbps GX (yes) | 3.125 Gbps GX | 3.125 Gbps GX | 3.125 Gbps GX | No transceivers (logic only) | No transceivers (Stratix II non-GX) |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Hardened 3.125 Gbps transceivers in the same 1152-BGA package (vs EP2SGX60CF1152C5N (logic-only Stratix II, 1152-BGA))
- C3 speed grade vs industrial I4 temperature range (vs EP2SGX60EF1152I4N)
- 60,440 logic elements in 1152-BGA - same silicon as other 1152-BGA GX variants (vs EP2SGX60EF1152C5N)
Design Notes
Estimated: The 1152-ball FC-FBGA at 1.0 mm pitch requires a 4-1-4 or 5-1-5 HDI stack-up with micro-vias to escape the inner rows. Use via-in-pad (VIP) for transceiver balls to maintain signal integrity at 3.125 Gbps, with controlled-impedance differential traces of 100 ohms. Follow Intel's Stratix II GX High-Speed Board Design Guidelines for length-matching tolerances; typical Tx/Rx pair length matching is within 20 mil. BGA decoupling requires 0402/0201 capacitors placed within 100 mil of each power pin, totaling 60-80 capacitors per device.
Estimated: At full transceiver utilization (12-16 channels at 3.125 Gbps) and 80% logic utilization, total power dissipation can reach 15-20 W. The 1152-BGA package has a theta-JA of approximately 8-10 C/W with 16 thermal balls in a 4x4 array. Provide a thermal pad with 9-12 thermal vias to inner copper planes, and ensure chassis airflow of at least 200 LFM for the commercial 0C to +85C temperature range. For sealed enclosures, derate to 70% transceiver utilization or specify the I4 industrial variant.
Three common pitfalls when using the EP2SGX60EF1152C3N: (1) Confusing the GX (transceiver) part with the C-only (logic-only) variant - the CF/DF part numbers lack the embedded transceivers; (2) Using C3 speed grade for designs targeting fMAX above 250 MHz - migrate to C4 or C5; (3) Ignoring the 1.2 V core sequencing requirement - the FPGA needs VCCINT to ramp before VCCPD to avoid latch-up. Always use Quartus II 13.0 or earlier; later Quartus versions dropped Stratix II support.
Estimated: For 3.125 Gbps transceiver channels, maintain differential impedance at 100 ohms +/-10% with intra-pair skew below 5 mil. Use Acrylate or low-loss PCB material (e.g., Isola FR408HR) for the top layers; the per-inch loss at 3.125 Gbps is roughly 0.5 dB for standard FR-4 versus 0.3 dB for low-loss. Reference clock distribution to MGTs requires a 100 MHz or 125 MHz low-jitter oscillator with phase noise below -110 dBc/Hz at 100 kHz offset, distributed through a 1:4 zero-delay buffer for multi-channel synchronization.
Compliance Information
Compliance status not stated in the verified distributor data. Intel/legacy Altera products are typically RoHS-compliant for the industrial part number suffix N, but the C3N was manufactured prior to 2010 and full material disclosure may not be available. The I4N industrial variant is typically lead-free. Verify with the manufacturer's material declaration for aerospace/defense applications.
