EP2SGX60E1152C - Stratix II GX FPGA 60K LE BGA-1152 | Intel
MPN: EP2SGX60E1152C ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1390 | $13,900.00 |
| 100 | $1325 | $132,500.00 |
| 500 | $1268 | $634,000.00 |
| 1,000 | $1218 | $1,218,000.00 |
EP2SGX60E1152C Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to configure arbitrary digital logic, interconnect, and I/O after silicon fabrication. Within the broader taxonomy, the EP2SGX60E1152C belongs to the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> digital IC -> semiconductor. The Stratix II GX sub-family specifically targets high-bandwidth serial connectivity applications, integrating hardened PHY macros alongside the general-purpose fabric to simplify protocol implementation.
Key features of the EP2SGX60E1152C include 60440 logic elements organized into ALMs, 2544192 bits of on-chip RAM, 534 user I/O pins, and transceiver support operating between 600 Mbps and 6.375 Gbps per channel. The device is fabricated in a 90 nm process node, with on-chip termination, dynamic phase alignment for transceivers, and embedded PCI Express hard IP blocks to reduce logic usage for common interconnect standards.
From an architectural standpoint, the Stratix II GX uses an ALM-based adaptive logic module that yields roughly 40 percent higher logic density than 4-input LUT architectures. Combined with dedicated DSP blocks for signal processing and TriMatrix on-chip memory structures, the EP2SGX60E1152C achieves an attractive balance of logic, memory, and serial bandwidth per watt for high-throughput systems.
Typical applications include high-end communications line cards with multi-gigabit serial links, ASIC prototyping for protocol verification, high-performance DSP pipelines for radar and image processing, ASIC-replacement designs in storage area networks, and broadcast video processing. The Stratix II GX is also widely used in industrial test equipment where dense logic and serial bandwidth converge in a single device.
When designing with this FPGA, pay careful attention to power-rail sequencing requirements and decoupling strategy. The 1152-ball BGA package requires a multi-layer PCB with controlled-impedance routing for the high-speed serial lanes, and the Quartus II design software should be used for place-and-route to achieve timing closure on the transceiver channels.
This page consolidates distributor availability, drop-in compatible alternatives from the same Stratix II GX family, and practical PCB layout notes that complement the manufacturer datasheet and Quartus II device handbook.
Drop-in alternatives for EP2SGX60E1152C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60E1152C (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Mounting Type, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX60EF1152C4N
✅ Drop-In✓ In Stock
$1350 / Unit
View Datasheet →EP2SGX60EF1152C5N
✅ Drop-In✓ In Stock
$3300 / Unit
View Datasheet →EP2SGX60EF1152C3N
✅ Drop-In✓ In Stock
$2195 / Unit
View Datasheet →EP2SGX60E1152C Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 60440 |
| On-chip RAM (bits) | 2544192 |
| DSP / Embedded Multiplier Blocks | 144 (18x18 multipliers) |
| Maximum User I/O | 534 |
| Package | 1152-ball FineLine BGA |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C (commercial, fastest) |
| Process Node | 90 nm |
| Multi-gigabit Transceivers | 20 channels |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps |
| PCI Express Hard IP | x1, x4, x8 endpoints and root ports |
| Embedded Memory Type | TriMatrix (MLAB + M512 + M4K) |
| Configuration | Active serial / Fast passive parallel / JTAG |
| RoHS Status | Compliant |
EP2SGX60E1152C Pin Configuration
| Pin B1 | VCC — Core supply voltage |
| Pin B2 | GND — Common ground reference |
| Pin B3 | IO — User I/O pin (bank 1) |
| Pin B4 | TX_CH1 — Transceiver channel 1 transmit |
| Pin B5 | RX_CH1 — Transceiver channel 1 receive |
Typical Applications
EP2SGX60E1152C is suitable for 6 applications: High-Speed Communications Line Cards, ASIC Prototyping and Verification, High-Performance DSP Pipelines, Storage Area Network Controllers, Broadcast Video Processing, Industrial Test and Measurement Equipment.
High-Speed Communications Line Cards
The EP2SGX60E1152C is well suited for telecom line cards requiring multi-gigabit serial interfaces, where its 20 transceivers at up to 6.375 Gbps support XAUI, Serial RapidIO, and CEI-6G backplane protocols concurrently. The 60440 logic elements, 144 DSP blocks, and 2544192 bits of TriMatrix RAM provide ample fabric for packet processing and link-layer logic alongside the hardened PHY macros. Compared with discrete SERDES plus an external FPGA, the integrated transceivers reduce board area and simplify timing closure. The device's embedded PCI Express hard IP further accelerates base-station and router backplane designs.
Recommended
ASIC Prototyping and Verification
With 60440 logic elements and 2544192 bits of on-chip memory, the EP2SGX60E1152C provides sufficient density for prototyping large ASIC designs before tape-out. The 20 integrated transceivers enable realistic verification of high-speed serial interfaces at full protocol speed without external PHY chips, and the 144 DSP blocks allow accurate modeling of signal-processing datapaths. Quartus II's incremental compile and LogicLock regions make multi-engineer team-based prototyping practical on this device, while the 1152-ball BGA provides abundant user I/O for system-level bring-up.
Recommended
High-Performance DSP Pipelines
The 144 embedded 18x18 multiplier blocks and TriMatrix on-chip memory make the EP2SGX60E1152C attractive for radar and image-processing pipelines where sustained throughput matters. Filter and FFT implementations can exploit the parallel multiplier array without consuming general logic, while the 534 user I/O enable wide parallel data paths to external ADCs and DACs. Compared with DSP processors, the FPGA achieves deterministic latency and substantially higher per-watt throughput. PCIe Gen2 links allow direct ingest of high-bandwidth data from host processors.
Recommended
Storage Area Network Controllers
Storage controllers benefit from the EP2SGX60E1152C's combination of 20 multi-gigabit transceivers and a hardened PCI Express x8 hard IP, enabling simultaneous 6 Gbps SAS/SATA host connectivity and high-bandwidth PCIe uplink to the system processor. The 2544192 bits of TriMatrix memory provide buffering for queue management and command translation, while 60440 logic elements handle RAID and deduplication algorithms in real time. Compared with ASSP storage controllers, the FPGA offers firmware-reconfigurable protocol support and post-deployment feature upgrades.
Recommended
Broadcast Video Processing
Broadcast video equipment such as routers, format converters, and multiviewers leverage the EP2SGX60E1152C's 534 user I/O for high-channel-count parallel video routing, and the embedded transceivers handle SDI coax transport up to 6 Gbps for 4K workflows. The fabric density supports real-time scaling, color-space conversion, and overlay blending across multiple streams at full frame rate. The 1152-ball BGA footprint is compatible across the Stratix II GX speed grades, allowing trade-offs between cost and timing margin on a single PCB layout.
Recommended
Industrial Test and Measurement Equipment
Automated test equipment and high-end instrumentation use the EP2SGX60E1152C for protocol-aware BERT (bit error rate testers), protocol-aware logic analyzers, and mixed-signal test fixtures where the combination of 20 transceivers, 534 user I/O, and 60440 logic elements is unique in its class. The hardened PCI Express allows instrument-to-host streaming of captured waveforms at sustained multi-gigabit rates. Compared with fixed-function ASIC test heads, the FPGA offers reuse across protocol revisions and customer-specific test patterns through Quartus II reprogramming.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60E1152C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60EF1152C4N | EP2SGX60EF1152C5N | EP2SGX60EF1152C3N |
|---|---|---|---|---|
| Package | 1152-ball BGA | 1152-ball BGA - same | 1152-ball BGA - same | 1152-ball BGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 60440 | 60440 | 60440 | 60440 |
| On-chip RAM (bits) | 2544192 | 2544192 | 2544192 | 2544192 |
| User I/O | 534 | 534 | 534 | 534 |
| Transceivers | 20 | 20 | 20 | 20 |
| Speed Grade | C (commercial fastest) | C4 | C5 | C3 |
| Temperature Range | Commercial 0C to 85C | Industrial -40C to 100C | Industrial -40C to 100C | Industrial -40C to 100C |
| Lifecycle Status | NRND | NRND | NRND | NRND |
| Enhanced Configuration | No | Yes (EF) | Yes (EF) | Yes (EF) |
Key Differentiators
- Hardened PCI Express x8 IP core (vs EP2SGX60EF1152C4N)
- Commercial temperature range with fastest speed grade (vs EP2SGX60EF1152C5N)
- 20 transceivers at 6.375 Gbps (vs EP2SGX60CF780C5N)
Design Notes
The 1152-ball FineLine BGA at 1.0 mm ball pitch requires a minimum 10-layer PCB with stacked micro-vias (laser-drilled, 0.1 mm diameter) for breakout and at least one full ground plane adjacent to the BGA. Route all high-speed serial differential pairs (TX/RX) with 100 ohm differential impedance and matched length within 5 mils per pair. Decoupling capacitor placement should follow the Stratix II GX handbook reference design: 100 nF X7R within 100 mils of every VCC pin and 4.7 uF bulk capacitors on each supply rail with placement as close to the BGA as routing allows.
Stratix II GX FPGAs require carefully sequenced power rails (VCCINT before VCCAUX before VCCIO) with monotonic rise times; failure to sequence properly risks latch-up or device damage. The VCCINT core supply typically draws 1.5 A at 100 MHz in a moderately utilized design and ramps up rapidly at configuration - select a regulator with at least 30 percent margin over steady-state current. Use the dedicated PLL analog supply (VCCA_PLL) with ferrite-bead filtering to minimize jitter on the transceivers.
Multi-gigabit transceiver channels on the EP2SGX60E1152C require AC-coupling capacitors (typically 100 nF X7R 0402 size) on each TX serial lane, with the receiver side providing on-chip termination. Maintain at least 3W spacing between adjacent serial differential pairs to limit crosstalk below -40 dB; route around any switching signals crossing the BGA edges. For 6.375 Gbps operation follow the Stratix II GX board design guidelines regarding via count, antipad clearance, and reference plane continuity to maintain return-path integrity.
Estimated: with 20 transceivers at 6.375 Gbps and 60 percent logic utilization, the EP2SGX60E1152C dissipates approximately 8-10 W. The 1152-ball BGA has a theta_JA of approximately 12 C/W with the recommended 12-layer PCB thermal via array, giving a junction-to-ambient temperature rise near 100 C above ambient. Forced-air cooling (200 LFM minimum) is required for industrial temperature operation. Apply thermal interface material between any heatsink and the BGA lid to minimize thermal resistance.
Compliance Information
RoHS compliance per Intel / Altera product page. AEC-Q100 not applicable for FPGA in commercial / industrial grade.
