EP2SGX60EF1152C3N vs EP2SGX60EF1152I3N Comparison
Detailed side-by-side comparison of EP2SGX60EF1152C3N by Intel and EP2SGX60EF1152I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX60EF1152C3N | EP2SGX60EF1152I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,195.00 | $1,195.00 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | β |
| Logic Elements | 60,440 | β |
| Adaptive Logic Modules (ALMs) | 30,220 | β |
| Logic Array Blocks (LABs) | 3022 | β |
| Embedded Memory (bits) | 2,544,192 | β |
| Maximum User I/Os | 534 | β |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage (Vcc) | 1.2 V | β |
| Maximum Internal Frequency | 717 MHz | β |
| Propagation Delay | 0.40 ns | β |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | β |
| PLLs | 4 | β |
| Transceiver Data Rate | 3.125 Gbps per channel | β |
| Package | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | β |
| Speed Grade | C3 (commercial, -3 bin) | β |
| Operating Temperature | 0C to +85C (commercial) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Type | β | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | β | 60,440 |
| Configurable Logic Blocks (CLBs) | β | 60,440 |
| Embedded Memory Bits | β | 2,544,192 bits |
| Internal Frequency (max) | β | 717 MHz |
| Core Voltage | β | 1.2 V |
| Package Type | β | 1152-ball FC-FBGA |
| Package Size | β | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | β | 1152 |
| Terminal Form | β | Ball |
| Temperature Grade | β | Industrial (-40C to +100C junction) |
| Lead-Free | β | Yes |
| RoHS Status | β | Compliant |
| MSL Level | β | [DATA_NEEDED: MSL level] |