EP2SGX60EF1152I3N vs EP2SGX60EF1152C3N Comparison

Detailed side-by-side comparison of EP2SGX60EF1152I3N by Intel and EP2SGX60EF1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60EF1152I3N EP2SGX60EF1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,195.00 $2,195.00
Family Stratix II GX Stratix II GX
Device Type Field-Programmable Gate Array (FPGA) β€”
Logic Elements (LEs) 60,440 β€”
Configurable Logic Blocks (CLBs) 60,440 β€”
Embedded Memory Bits 2,544,192 bits β€”
Internal Frequency (max) 717 MHz β€”
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V β€”
Package Type 1152-ball FC-FBGA β€”
Package Size 35 x 35 mm (1 mm ball pitch) β€”
Number of Terminals 1152 β€”
Terminal Form Ball β€”
Temperature Grade Industrial (-40C to +100C junction) β€”
Lead-Free Yes β€”
RoHS Status Compliant β€”
MSL Level [DATA_NEEDED: MSL level] β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Series β€” Stratix II
Logic Elements β€” 60,440
Adaptive Logic Modules (ALMs) β€” 30,220
Logic Array Blocks (LABs) β€” 3022
Embedded Memory (bits) β€” 2,544,192
Maximum User I/Os β€” 534
Core Voltage (Vcc) β€” 1.2 V
Maximum Internal Frequency β€” 717 MHz
Propagation Delay β€” 0.40 ns
Embedded Multipliers (18x18) β€” [DATA_NEEDED: embedded multiplier count]
PLLs β€” 4
Transceiver Data Rate β€” 3.125 Gbps per channel
Package β€” 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch
Speed Grade β€” C3 (commercial, -3 bin)
Operating Temperature β€” 0C to +85C (commercial)

Datasheets & Resources

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