EP2SGX60EF1152I3N vs EP2SGX60EF1152I4 Comparison
Detailed side-by-side comparison of EP2SGX60EF1152I3N by Intel and EP2SGX60EF1152I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX60EF1152I3N | EP2SGX60EF1152I4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,195.00 | $1,395.00 |
| Family | Stratix II GX | β |
| Device Type | Field-Programmable Gate Array (FPGA) | β |
| Logic Elements (LEs) | 60,440 | β |
| Configurable Logic Blocks (CLBs) | 60,440 | β |
| Embedded Memory Bits | 2,544,192 bits | β |
| Internal Frequency (max) | 717 MHz | β |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | β |
| Package Type | 1152-ball FC-FBGA | β |
| Package Size | 35 x 35 mm (1 mm ball pitch) | β |
| Number of Terminals | 1152 | β |
| Terminal Form | Ball | β |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial |
| Lead-Free | Yes | β |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| MSL Level | [DATA_NEEDED: MSL level] | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Family | β | Stratix II GX |
| Logic Elements | β | 60,440 |
| Logic Cells | β | 60,440 |
| Logic Array Blocks (LABs) | β | 3,022 |
| Embedded Memory | β | 2,544,192 bits |
| User I/O Pins | β | 534 |
| Maximum Internal Frequency | β | 717 MHz (per data source) |
| Maximum Operating Frequency | β | 732.1 MHz (per data source) |
| Core Supply Voltage | β | 1.2 V |
| Package | β | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) |
| Package Dimensions | β | 23 x 23 mm, 1 mm pitch (per data source) |